Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MIMX8QM5AVUFEAB

Part No.:
MIMX8QM5AVUFEAB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1313-BFBGA
Datasheet:
AetrixMIMX8QM5AVUFEAB.pdf
Description:
MIMX8QM5AVUFEAB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,055

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MIMX8QM5AVUFEAB from NXP Semiconductors is an automotive-grade i.MX 8QuadMax applications processor featuring two 1.296 GHz Arm Cortex-A72 cores, four 1.2 GHz Cortex-A53 cores, two 264 MHz Cortex-M4F cores, dual GC7000XSVX GPUs (650 MHz), and a 4K H.265-capable video processing unit. It delivers heterogeneous compute for infotainment head units requiring simultaneous display, audio, vision, and secure connectivity.

For engineers reviewing the MIMX8QM5AVUFEAB datasheet, MIMX8QM5AVUFEAB pinout, MIMX8QM5AVUFEAB application, or MIMX8QM5AVUFEAB equivalent, key selection criteria include AEC-Q100 qualification, FCPBGA 29×29 mm 0.75 mm pitch packaging, LPDDR4-1600 memory interface, PCIe 3.0 capability (with NXP validation), and integrated failover-ready dual display controllers for ASIL-B–aligned safety-critical UIs.

Technical Context

The MIMX8QM5AVUFEAB implements a cache-coherent interconnect (CCI-400) linking three CPU clusters (A72, A53, M4F), dual GPU subsystems, and a dedicated security controller (SECO) with CAAM cryptographic acceleration. Its system architecture supports hardware virtualization via ARM TrustZone and SMMU-500, enabling concurrent Linux/Android on A72/A53 and real-time RTOS on M4F cores.

It integrates a full-featured multimedia subsystem including HDMI 2.0a/eDP 1.4 transmitter, dual MIPI-DSI (4-lane each), dual MIPI-CSI (4-lane each), LVDS serializer, Tensilica HiFi 4 DSP (666 MHz), and dual 1 Gb Ethernet with AVB-configured for deterministic low-latency audio/video transport in automotive cockpit domains.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores 2× Cortex-A72 @ 1.296 GHz + 4× Cortex-A53 @ 1.2 GHz + 2× Cortex-M4F @ 264 MHz - enables asymmetric OS partitioning with high-performance application layer and deterministic real-time control layer
GPU Dual GC7000XSVX @ 650 MHz (8 shaders each) - supports OpenGL ES 3.2 w/ AEP, Vulkan 1.0, and dual independent 1080p60 rendering paths
VPU H.265 decode up to 4Kp60, H.264 encode up to 1080p30 - enables multi-display video wall or rear-seat entertainment with hardware-accelerated transcoding
Memory Interface 64-bit LPDDR4 @ 1600 MHz - delivers 25.6 GB/s peak bandwidth for GPU/VPU frame buffers and AI inference workloads
Display Support Single 4Kp60 (HDMI/eDP/DP/LVDS) or up to four independent FullHD 1080p60 displays - implemented via dual DPU with SafeAssure failover path for functional safety compliance
Security AHAB secure boot, CAAM with AES-256/SHA-384/RSA-4096, SECO-based HSM support, and tamper detection - meets UNECE R155/R156 requirements for vehicle cybersecurity management systems
Automotive Qualification AEC-Q100 Grade 2 (−40°C to +105°C) - qualified for under-dash infotainment and digital cluster deployment without derating

Pinout & Package

Package: FCBGA, 29 mm × 29 mm, 0.75 mm pitch, lidded, 1296-pin (documented in Section 6 of IMX8QM1P3AEC Rev. 0).

Pin/Terminal Circuit Role Design Meaning
VDD_ARM Core power supply for Cortex-A72/A53 cluster Requires tightly regulated 0.8 V ±3% with low-noise sequencing; shared rail with GPU logic
VDD_M4 Core power supply for Cortex-M4F subsystem Independent 0.9 V ±3% rail enables autonomous operation during A72/A53 sleep states
DDR_VREF LPDDR4 reference voltage Must be set to 0.5 × VDDQ (1.0 V) for 1600 MHz operation; critical for signal integrity across 64-bit bus
CLK_24M_IN Primary crystal oscillator input 24 MHz fundamental-mode crystal required for system clock generation; drives SCU PLLs and boot ROM timing
BOOT_MODE[3:0] Boot configuration strapping pins Pulled high/low at power-on to select boot device (eMMC, SPI NOR, SD, NAND); no external pull-up needed due to internal bias
MIPI_DSI_CLK_P/N Differential clock pair for MIPI-DSI interface Supports 80 Mbps–1.5 Gbps per lane; used for primary instrument cluster display with embedded self-refresh

Key Features

Feature Design Value
Dual Display Failover (SafeAssure) Hardware-enforced backup path ensures uninterrupted display output during software crash or GPU hang-no host CPU intervention required
PCIe 3.0 Capability Validated by NXP for 2-lane operation at 8 GT/s; enables direct connection to automotive radar SoCs or high-speed storage without bridge IC
Tensilica HiFi 4 DSP 666 MHz fixed/vector-FP engine with 448 KB OCRAM + 64 KB TCM-executes voice wake-word detection and acoustic echo cancellation offline from main OS
FlexCAN FD Support Three CAN FD controllers (up to 5 Mbps data phase) with time-triggered communication support-meets AUTOSAR COM stack timing requirements
Secure JTAG (SJC) Three configurable security modes (disabled, debug-only, full-access) enforced via eFUSE; prevents unauthorized firmware extraction during production test

Applications

Automotive Digital Instrument Cluster Central Infotainment Head Unit

Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation turn-by-turn, and media status on a 12.3″ TFT-LCD with 1920×720 resolution.

IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS; dual DPU drives primary and secondary displays with hardware compositor and failover path.

Use Value: Achieves <50 ms latency from CAN FD message arrival to pixel update using M4F interrupt offload and GPU command queue prefill-meeting ISO 26262 ASIL-B timing constraints.

Use Scenario: Concurrent execution of Android Automotive OS, rear-seat video streaming, Bluetooth telephony, and over-the-air (OTA) updates in a premium sedan platform.

IC Role / Device Role / Timing Role: Main SoC hosting hypervisor-separated guest VMs: Android for UI, Linux for connectivity services, and RTOS on M4F for CAN gateway functions.

Use Value: Leverages 64-bit LPDDR4 bandwidth and dual GC7000XSVX GPUs to sustain 4K@60 decode + 1080p@30 encode + OpenGL ES 3.2 UI rendering simultaneously without frame drops.

Rear-Seat Entertainment System Advanced Driver Assistance Display

Use Scenario: Dual-screen playback of HD video content (H.264/H.265) with independent volume control, subtitle overlay, and wireless screen mirroring via Miracast.

IC Role / Device Role / Timing Role: Media-centric SoC driving two MIPI-DSI panels and HDMI output while managing USB 3.0 storage and Wi-Fi/BT coexistence.

Use Value: Uses VPU's dual-stream decode capability and HiFi 4 DSP for real-time audio post-processing-eliminates need for external codec or video decoder ICs.

Use Scenario: Overlaying camera-based ADAS warnings (LDW, FCW) onto HUD projection with sub-30 ms end-to-end latency from sensor capture to optical output.

IC Role / Device Role / Timing Role: Vision pipeline accelerator integrating MIPI-CSI2 input, ISP preprocessing, CNN inference (via GPU tensor ops), and HUD-specific gamma/color correction.

Use Value: Achieves deterministic 12 ms image processing latency using M4F-triggered DMA transfers and GPU shader-based warping-enabling HUD alignment stability at 60 Hz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MIMX8QM6AVUFEAB Includes Tensilica HiFi 4 DSP (666 MHz) and second VPU instance; same core counts, package, and qualification Required for multi-modal voice assistant (wake-word + NLU + TTS) and dual independent video pipelines Select MIMX8QM6AVUFEAB when HiFi 4 DSP offload or dual-VPU concurrency is mandatory; otherwise MIMX8QM5AVUFEAB reduces BOM cost and thermal load
S32G399A0VLQ1 NXP S32G3 vehicle network processor with 4× Cortex-A53 @ 1.5 GHz, no GPU/VPU, focused on networking (10Gbps Ethernet, PCIe, CAN FD), ASIL-D certified Targeted at gateway/zonal ECU roles-not suitable for display/audio-rich infotainment; lacks multimedia accelerators Choose S32G399A0VLQ1 only for domain controller/gateway applications requiring high-speed vehicle networking and functional safety certification beyond ASIL-B

Compared with MIMX8QM6AVUFEAB, the MIMX8QM5AVUFEAB omits the HiFi 4 DSP and second VPU-reducing power consumption by ~1.2 W typical and simplifying thermal design-while retaining identical CPU/GPU/display capabilities for non-voice-first infotainment systems. Against S32G399A0VLQ1, it trades networking depth for multimedia breadth, making it unsuitable as a standalone gateway but optimal for cockpit domain integration.

Availability

MIMX8QM5AVUFEAB is available at Aetrix Electronics and suitable for automotive digital instrument clusters, central infotainment head units, and rear-seat entertainment systems requiring stable component supply across extended product lifecycles.

Supply support for MIMX8QM5AVUFEAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 8QuadMax product line-including MIMX8QM5AVUFEAB-is designed specifically for high-performance automotive infotainment and digital cockpit applications, emphasizing functional safety, multimedia throughput, and heterogeneous compute scalability.

FAQ

What is the maximum LPDDR4 speed supported by MIMX8QM5AVUFEAB?

MIMX8QM5AVUFEAB supports LPDDR4 at 1600 MHz (data rate), delivering 25.6 GB/s peak bandwidth across its 64-bit interface. This speed is validated under AEC-Q100 Grade 2 conditions (−40°C to +105°C) and requires strict PCB layout adherence to JEDEC DDR4-2400L specifications for signal integrity and power delivery.

Does MIMX8QM5AVUFEAB include hardware support for functional safety standards like ISO 26262?

MIMX8QM5AVUFEAB includes hardware features aligned with ISO 26262 ASIL-B requirements, including dual-lockstep watchdog timers, ECC on L2 cache and TCM, parity on instruction/data caches, and SafeAssure display failover path. However, full ASIL-B compliance requires system-level implementation-including software diagnostics, FMEDA analysis, and tool qualification-as documented in NXP's i.MX 8QuadMax Functional Safety Manual.

Can MIMX8QM5AVUFEAB boot directly from eMMC 5.1?

Yes, MIMX8QM5AVUFEAB supports boot from eMMC 5.1 via its uSDHC controller in HS400 mode. Boot mode strapping pins (BOOT_MODE[3:0]) must be configured for eMMC boot, and the first 1 MB of eMMC must contain a valid boot image signed with AHAB keys. The SCFW version must be ≥1.16 (included in LF6.6.y_2.0.0 GA BSP) to ensure proper eMMC initialization timing.

What display interfaces does MIMX8QM5AVUFEAB support for automotive instrument clusters?

MIMX8QM5AVUFEAB supports MIPI-DSI (2×4-lane), LVDS (2×8-lane), HDMI 2.0a, and eDP 1.4 for instrument cluster displays. For ASIL-B–compliant clusters, the dual DPU with SafeAssure failover path allows one display controller to take over instantly if the other fails-verified in hardware without software intervention. MIPI-DSI is most commonly used for TFT-LCD clusters due to lower EMI and integrated power management.

Is PCIe 3.0 operation guaranteed on MIMX8QM5AVUFEAB without additional validation?

No-PCIe 3.0 operation (8 GT/s) on MIMX8QM5AVUFEAB requires validation by NXP and is not guaranteed out-of-box. The datasheet states "PCIe 3.0 capable, contact your NXP representative." Customers must engage NXP's automotive support team to obtain validated reference designs, IBIS models, and compliance test reports before deploying PCIe 3.0 in production systems.

MIMX8QM5AVUFEAB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1313-BFBGA
Series:
-
Packaging:
Bulk
Product Status:
Active
Core Processor:
-
Number of Cores/Bus Width:
-
Speed:
-
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1313-BGA (29x29)
Additional Interfaces:
-

MIMX8QM5AVUFEAB FAQ

1.How can I place an order for MIMX8QM5AVUFEAB through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMX8QM5AVUFEAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMX8QM5AVUFEAB reliable?

The price and inventory of MIMX8QM5AVUFEAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8QM5AVUFEAB is usually 5 days.

3.What payment methods are accepted for MIMX8QM5AVUFEAB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8QM5AVUFEAB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMX8QM5AVUFEAB?

MIMX8QM5AVUFEAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMX8QM5AVUFEAB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMX8QM5AVUFEAB?

For technical support, including MIMX8QM5AVUFEAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8QM5AVUFEAB requirements.

6.How does Aetrix verify that MIMX8QM5AVUFEAB is sourced from the original manufacturer or authorized distributors?

All MIMX8QM5AVUFEAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8QM5AVUFEAB meets industry standards.

7.What is the process for return or replacement of MIMX8QM5AVUFEAB?

All MIMX8QM5AVUFEAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8QM5AVUFEAB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMX8QM5AVUFEAB part is unused and in its original packaging.

Return procedure for MIMX8QM5AVUFEAB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MIMX8QM5AVUFEAB Tags

  • MIMX8QM5AVUFEAB
  • MIMX8QM5AVUFEAB PDF
  • MIMX8QM5AVUFEAB Datasheet
  • MIMX8QM5AVUFEAB Specifications
  • MIMX8QM5AVUFEAB Images
  • NXP Semiconductors
  • NXP Semiconductors MIMX8QM5AVUFEAB
  • Buy MIMX8QM5AVUFEAB
  • MIMX8QM5AVUFEAB Price
  • MIMX8QM5AVUFEAB Distributor
  • MIMX8QM5AVUFEAB Supplier
  • MIMX8QM5AVUFEAB Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER