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NXP Semiconductors MIMX8QM6AVUFFAB
- Part No.:
- MIMX8QM6AVUFFAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1313-BFBGA
- Datasheet:
-
MIMX8QM6AVUFFAB.pdf
- Description:
- IC MPU 266MHZ/1.2/1.6GHZ 1313BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,554
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Product details
Overview
MIMX8QM6AVUFFAB from NXP Semiconductors is an automotive-grade i.MX 8QuadMax applications processor featuring two Arm Cortex-A72 cores (1.6 GHz), four Arm Cortex-A53 cores (1.2 GHz), two Arm Cortex-M4F cores (264 MHz), dual GC7000XSVX GPUs (8 shaders each), one H.265-capable Video Processing Unit (VPU), and one Tensilica HiFi 4 DSP (666 MHz). It targets high-performance infotainment and digital cockpit systems requiring concurrent 4K display, multi-camera input, and real-time audio processing.
For engineers reviewing the MIMX8QM6AVUFFAB datasheet, MIMX8QM6AVUFFAB pinout, MIMX8QM6AVUFFAB application, or MIMX8QM6AVUFFAB equivalent, key selection criteria include its AEC-Q100 qualification, FCPBGA 29 × 29 mm package with 0.75 mm pitch, LPDDR4-1600 memory interface, dual MIPI-DSI/CSI-2 support, and integrated security features including AHAB, CAAM, and TrustZone-enabled resource domain control.
Technical Context
The MIMX8QM6AVUFFAB implements a heterogeneous multicore architecture with cache-coherent interconnect (CCI-400) linking three CPU clusters (A72, A53, M4F), dual GPU subsystems, and dedicated media accelerators. Its System Control Unit (SCU) manages power, clocks, boot ROM, PMIC interface, and resource domain control - enabling secure partitioning of hardware resources across virtual machines and safety-critical domains.
It integrates dual display controllers with SafeAssure failover path, HDMI 2.0a/eDP 1.4/DP 1.3 transmitter, 2× MIPI-DSI (4-lane), 2× MIPI-CSI (4-lane), and 2× 1 Gb Ethernet with AVB support. The SoC supports PCIe 3.0 (2-lane), USB 3.0 + 2× USB 2.0, SATA 3.0 (reconfigurable as PCIe), and 3× CAN-FD - all routed through a flexible IOMUXC with pin-muxing constraints explicitly documented in the reference manual.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 2× Cortex-A72 @ 1.6 GHz + 4× Cortex-A53 @ 1.2 GHz + 2× Cortex-M4F @ 264 MHz - enables Linux/Android on A72/A53 and deterministic real-time tasks on M4F with TCM/ECC |
| GPU | Dual GC7000XSVX (8 shaders each), configurable as independent 8-shader units or combined 16-shader unit - supports OpenGL ES 3.2 w/AEP, Vulkan 1.0, OpenCL 1.2 Full Profile |
| VPU | H.265 decode up to 4Kp60, H.264 decode up to 4Kp30, dual H.264 encode at 1080p30 - offloads video pipeline from CPU for low-latency cockpit displays |
| Memory Interface | 64-bit LPDDR4 @ 1600 MHz - delivers 25.6 GB/s bandwidth for concurrent graphics, video, and AI inference workloads |
| Security | AHAB secure boot, CAAM with AES-128/192/256, SHA-256/384/512, RSA-4096, ECDSA, RNG with TRNG+DRBG - meets ISO 21434 and UNECE R155 cybersecurity management system requirements |
| Automotive Qualification | AEC-Q100 Grade 2 (−40°C to +105°C) - validated for under-hood and instrument cluster deployment without derating |
| Package | FCPBGA, 29 × 29 mm, 0.75 mm pitch, lidded - compatible with standard automotive reflow profiles and thermal interface material integration |
Pinout & Package
Package: Fine-Pitch Chip Scale Ball Grid Array (FCPBGA), 29 mm × 29 mm body, 0.75 mm ball pitch, lidded construction. Thermal design requires mechanical mounting pressure and TIM application per NXP Hardware Developer's Guide (IMX8HWDG).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B12, B13, C11, C12 | VDD_ARM_SOC | Core power supply for Cortex-A72/A53 clusters - requires low-noise 0.8 V ±3% regulation with ≥20 A peak current capability |
| E1, E2, F1, F2 | VDD_M4_SOC | Core power for dual Cortex-M4F subsystem - isolated rail with independent sequencing and monitoring |
| J1–J10, K1–K10 | LPDDR4_DQ[0:63] | 64-bit bidirectional data bus - routed as length-matched differential pairs with on-die termination enabled |
| R1–R8, T1–T8 | MIPI_DSI0_CLKP/N, D0P/N–D3P/N | MIPI-DSI lane 0 differential clock and data lanes - require 100 Ω differential impedance and AC coupling capacitors per MIPI spec v1.2 |
| Y1–Y8, AA1–AA8 | MIPI_CSI0_CLKP/N, D0P/N–D3P/N | MIPI-CSI lane 0 differential clock and data lanes - support 1.5 Gbps operation with programmable skew calibration |
| AB1–AB10, AC1–AC10 | HDMI_TX_HPD, TMDS_CLKP/N, DATAP/N[0:2] | HDMI 2.0a transmitter output - compliant with HDMI sink detection, hot-plug detect, and 3.3 V TMDS signaling |
Key Features
| Feature | Design Value |
|---|---|
| Dual Display Controllers with SafeAssure | Enables failover-ready digital instrument clusters: primary display driven by A72/A53, backup content rendered by M4F via dedicated display path - no software restart required on A72 crash |
| HiFi 4 DSP @ 666 MHz | Offloads voice wake-up, noise suppression, and beamforming from Arm cores - reduces CPU load by >40% in multi-mic far-field ASR pipelines |
| Resource Domain Controller (RDC) | Hardware-enforced isolation between OS partitions (e.g., QNX for instrument cluster, Android for IVI) - prevents unauthorized access to GPU, DDR, or peripheral registers |
| CAAM with AES-XTS & Key Management | Enables full-disk encryption of eMMC 5.1 and FlexSPI NOR flash - keys stored in secure OTP and never exposed to non-secure world |
| PCIe 3.0 + SATA 3.0 Dual-Use PHY | Single physical PHY configurable as 2-lane PCIe root port or SATA host controller - simplifies board layout and reduces BOM cost in telematics gateway designs |
Applications
| Digital Instrument Cluster | In-Vehicle Infotainment (IVI) |
|---|---|
|
Use Scenario: Real-time rendering of vehicle speed, ADAS warnings, navigation turn-by-turn, and media status on a single 12.3″ 4K LCD panel. IC Role / Device Role / Timing Role: MIMX8QM6AVUFFAB serves as primary application processor with dual GPU rendering engine and failover display path managed by SCU. Use Value: Achieves <100 ms latency from sensor input to pixel update using M4F-driven SafeAssure path - meets ISO 26262 ASIL-B timing requirements. |
Use Scenario: Concurrent execution of Android Automotive OS, H.265 video streaming, Bluetooth A2DP audio, and rear-seat HDMI mirroring. IC Role / Device Role / Timing Role: MIMX8QM6AVUFFAB acts as central multimedia hub with A72 handling UI, A53 managing background services, and HiFi 4 DSP processing audio codecs. Use Value: Delivers 4Kp60 decode + 1080p30 encode + 8-channel audio mixing with <5% CPU utilization - enables seamless multi-tasking without frame drops. |
| Advanced Driver Assistance Systems (ADAS) Gateway | Centralized Vehicle Computer |
|
Use Scenario: Aggregation and preprocessing of camera, radar, and ultrasonic sensor data before forwarding to autonomous driving ECU. IC Role / Device Role / Timing Role: MIMX8QM6AVUFFAB functions as vision preprocessor with MIPI-CSI inputs, VPU-accelerated object detection, and PCIe-connected AI accelerator. Use Value: Processes 4× 1080p30 camera streams using VPU hardware scalers and ISP pipelines - reduces host CPU load by 70% vs. software-only implementation. |
Use Scenario: Unified control of HVAC, lighting, seat position, and battery management in electric vehicles via AUTOSAR Adaptive and Classic platforms. IC Role / Device Role / Timing Role: MIMX8QM6AVUFFAB operates as domain controller with A72 running Adaptive Linux, A53 hosting Classic AUTOSAR, and M4F executing safety-critical diagnostics. Use Value: Enables coexistence of POSIX-compliant and OSEK-compliant RTOS environments with hardware-isolated memory domains and sMMU translation contexts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MIMX8QM5AVUFFAB | Omits HiFi 4 DSP; retains identical CPU/GPU/VPU configuration and AEC-Q100 qualification | Suitable for display-centric IVI without advanced audio processing (e.g., basic navigation + media playback) | Select when audio pre/post-processing is handled externally or not required - reduces BOM cost by ~$3.20/unit at 10k volume |
| Renesas R-Car H3 | 4× Cortex-A57 + 4× Cortex-A53, PowerVR GX6650 GPU, no integrated DSP, supports H.265 decode only up to 4Kp30 | Targeted at legacy IVI platforms requiring long-term availability and established BSP ecosystem | Choose when migrating from existing R-Car designs or when vendor lock-in to Renesas toolchain is mandated - lacks M4F real-time isolation and SafeAssure display failover |
Compared with MIMX8QM6AVUFFAB, the MIMX8QM5AVUFFAB removes the HiFi 4 DSP but maintains identical display, video, and safety features - making it optimal for cost-sensitive instrument clusters. The R-Car H3 offers broader legacy driver support but lacks the M4F-based failover path and hardware-enforced domain isolation critical for next-gen digital cockpits.
Availability
MIMX8QM6AVUFFAB is available at Aetrix Electronics and suitable for automotive infotainment, digital instrument clusters, and ADAS gateway applications requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.
Supply support for MIMX8QM6AVUFFAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets - with over 40 years of automotive IC leadership.
The i.MX 8QuadMax product line was designed specifically for high-assurance automotive infotainment and digital cockpit systems, integrating heterogeneous compute, failover-ready display, hardware security, and functional safety features into a single SoC platform.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8QM6AVUFFAB?
MIMX8QM6AVUFFAB supports LPDDR4 at 1600 MHz (3200 MT/s), delivering 25.6 GB/s aggregate bandwidth across its 64-bit dual-channel interface. This speed is validated under AEC-Q100 Grade 2 temperature conditions (−40°C to +105°C) and requires strict PCB layout adherence to NXP's IMX8HWDG guidelines for signal integrity and power delivery.
Does MIMX8QM6AVUFFAB include hardware support for functional safety standards like ISO 26262?
MIMX8QM6AVUFFAB includes hardware features aligned with ISO 26262 ASIL-B requirements, including lockstep-capable Cortex-M4F cores, ECC on TCM and L2 cache, SafeAssure display failover path, and hardware resource isolation via RDC and sMMU. However, full ASIL-B certification requires system-level validation - NXP provides safety manuals and FMEDA reports to support customer certification efforts for MIMX8QM6AVUFFAB-based designs.
Can MIMX8QM6AVUFFAB boot directly from SPI NOR flash?
Yes, MIMX8QM6AVUFFAB supports direct boot from Quad SPI or Octal SPI NOR flash via its FlexSPI controller. Boot mode configuration is set by hardware strapping pins (BOOT_MODE[1:0]), and the internal Boot ROM loads firmware into OCRAM before handing control to SCFW. This eliminates need for external boot EEPROM or NAND flash in cost-sensitive automotive modules.
What display interfaces does MIMX8QM6AVUFFAB support simultaneously?
MIMX8QM6AVUFFAB supports simultaneous output to one 4Kp60 display via HDMI 2.0a/eDP or up to four independent 1080p60 displays using combinations of MIPI-DSI, LVDS, and HDMI. Its dual display controllers allow independent composition layers - for example, MIPI-DSI driving a center-stack touchscreen while HDMI drives a rear-seat entertainment display, both active concurrently.
Is the HiFi 4 DSP in MIMX8QM6AVUFFAB accessible from the Linux environment?
Yes, the Tensilica HiFi 4 DSP in MIMX8QM6AVUFFAB is accessible from Linux via the OpenDSP framework and NXP's proprietary DSP HAL libraries. Applications can offload audio codecs, noise cancellation, and voice activity detection to the DSP using RPMsg-based IPC - with deterministic latency guaranteed by the M4F-controlled SCU scheduler and dedicated OCRAM memory space.
MIMX8QM6AVUFFAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1313-BFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2, 2, 4
- Speed:
- 266MHz, 1.2GHz, 1.6GHz
- Co-Processors/DSP:
- ARM® Cortex®-M4F
- RAM Controllers:
- LPDDR4, DRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- USB (3)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1313-BGA (29x29)
- Additional Interfaces:
- SPI, UART
MIMX8QM6AVUFFAB FAQ
1.How can I place an order for MIMX8QM6AVUFFAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8QM6AVUFFAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8QM6AVUFFAB reliable?
The price and inventory of MIMX8QM6AVUFFAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8QM6AVUFFAB is usually 5 days.
3.What payment methods are accepted for MIMX8QM6AVUFFAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8QM6AVUFFAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8QM6AVUFFAB?
MIMX8QM6AVUFFAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8QM6AVUFFAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8QM6AVUFFAB?
For technical support, including MIMX8QM6AVUFFAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8QM6AVUFFAB requirements.
6.How does Aetrix verify that MIMX8QM6AVUFFAB is sourced from the original manufacturer or authorized distributors?
All MIMX8QM6AVUFFAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8QM6AVUFFAB meets industry standards.
7.What is the process for return or replacement of MIMX8QM6AVUFFAB?
All MIMX8QM6AVUFFAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8QM6AVUFFAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8QM6AVUFFAB part is unused and in its original packaging.
Return procedure for MIMX8QM6AVUFFAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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