NXP Semiconductors MIMX8QP6AVUFFAB
- Part No.:
- MIMX8QP6AVUFFAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1313-BFBGA
- Datasheet:
-
MIMX8QP6AVUFFAB.pdf
- Description:
- MPU I.MX8 QUAD PLUS
- Quantity:
- Payment:

- Shipping:

Inventory:4,520
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Product details
Overview
MIMX8QP6AVUFFAB from NXP Semiconductors is an automotive-grade i.MX 8QuadPlus applications processor featuring one Arm Cortex-A72 core @ 1.6 GHz, four Arm Cortex-A53 cores @ 1.2 GHz, two Arm Cortex-M4F cores @ 264 MHz, dual GC7000XSVX GPUs (625 MHz), and a Tensilica HiFi 4 DSP @ 666 MHz - deployed in infotainment head units requiring concurrent 4K video decode, multi-display output, and real-time audio processing.
For engineers reviewing the MIMX8QP6AVUFFAB datasheet, MIMX8QP6AVUFFAB pinout, MIMX8QP6AVUFFAB application, or MIMX8QP6AVUFFAB equivalent, key selection criteria include AEC-Q100 qualification, FCPBGA 29 × 29 mm 0.75 mm pitch packaging, LPDDR4-1600 memory interface, dual MIPI-DSI/CSI support, and integrated AHAB secure boot - all critical for automotive functional safety and display subsystem design.
Technical Context
The MIMX8QP6AVUFFAB implements a heterogeneous multicore architecture with cache-coherent interconnect (CCI-400), enabling simultaneous operation of A72/A53 clusters for Linux-based UI and media stacks while offloading real-time control to dual M4F cores with dedicated I2C/UART peripherals. Its security subsystem integrates CAAM, AHAB, SNVS, and SECO for encrypted boot, runtime integrity, and key management.
Graphics and vision are served by dual independent GC7000XSVX GPUs supporting Vulkan, OpenGL ES 3.2 (with AEP), and OpenCL 2.0, plus a dedicated VPU enabling H.265 decode at 4Kp60 and H.264 encode at 1080p30 - all synchronized via dual failover-ready display controllers with SafeAssure path redundancy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 1× Cortex-A72 @ 1.6 GHz + 4× Cortex-A53 @ 1.2 GHz + 2× Cortex-M4F @ 264 MHz - enables asymmetric OS partitioning (Linux on A72/A53, RTOS on M4F) without shared resource contention. |
| GPU | Dual GC7000XSVX @ 625 MHz, 16 Vec4 shaders - supports dual independent 1080p60 displays or single 4Kp60 output with hardware-accelerated composition and warping. |
| VPU | H.265 decode up to 4Kp60, H.264 encode up to 1080p30 - eliminates need for external video co-processors in digital cockpit systems. |
| Memory Interface | 64-bit LPDDR4 @ 1600 MHz - delivers 25.6 GB/s bandwidth required for concurrent 4K UI rendering, camera preview, and navigation map streaming. |
| Security | Advanced High Assurance Boot (AHAB), CAAM with RSA-4096/ECC-1023, AES-256, SHA-512, and dedicated Secure JTAG Controller - meets ISO 21434 and UNECE R155 compliance requirements. |
| Automotive Qualification | AEC-Q100 Grade 2 (–40°C to +105°C) - validated for under-dash infotainment deployment without active cooling. |
| I/O Interfaces | 2× MIPI-DSI (4-lane), 2× MIPI-CSI (4-lane), HDMI 2.0a/eDP 1.4/DP 1.3, 3× CAN-FD, 2× GbE AVB, PCIe 3.0 (2-lane), USB 3.0 + 2× USB 2.0 - enables full digital cockpit connectivity including rear-seat entertainment, surround-view cameras, and OTA update pathways. |
Pinout & Package
FCPBGA package, 29 mm × 29 mm body size, 0.75 mm ball pitch, 1296-ball array (per NXP package drawing SOT1202-2). Pin assignments follow JEDEC MO-271AC standard with dedicated power/ground ball patterns for signal integrity in automotive EMI environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply (A72/A53) | 1.0 V ±3% regulated supply; requires low-noise LDO or PMIC rail with ≤10 mV ripple to prevent CPU throttling or cache errors. |
| VDD_M4 | Core Power Supply (M4F) | 1.1 V ±3% isolated rail; decoupling must be placed within 3 mm of ball to maintain real-time determinism under interrupt load. |
| DDR_VREF | LPDDR4 Reference Voltage | 0.6 V ±1%, sourced from DDR PHY internal regulator; used for DQ/DQS termination calibration during initialization. |
| BOOT_MODE[3:0] | Boot Configuration Inputs | Pulled high/low at power-on to select boot device (eMMC, SPI NOR, SD, NAND); values latched before SCU firmware execution begins. |
| ENET1_RX_CLK | Ethernet Receive Clock | 125 MHz differential clock input for AVB-compliant 1 GbE; requires controlled impedance (100 Ω diff) routing and matched length to ENET1_RXD[3:0]. |
| MIPI_DSI_CLK_P/N | MIPI-DSI Clock Lane | High-speed differential pair (80–1500 Mbps) driving primary display; routed as 100 Ω differential microstrip with <5 ps skew vs data lanes. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Failover-Ready Display Controllers | Ensures uninterrupted display output during software crash via hardware-switched SafeAssure backup path - eliminates need for external watchdog or secondary display controller in ASIL-B systems. |
| Integrated Tensilica HiFi 4 DSP | 666 MHz fixed/vector-FP engine with 448 KB OCRAM + 64 KB TCM - executes voice wake-word detection, acoustic echo cancellation, and multi-mic beamforming without loading A72/A53 cores. |
| FlexSPI with Octal Mode Support | Enables direct XIP (execute-in-place) from high-density SPI NOR flash (up to 256 MB), reducing boot time by eliminating copy-to-RAM overhead for firmware images. |
| Hardware Security Engine (CAAM) | Accelerates AES-256-GCM, SHA-512, ECDSA P-384, and RSA-4096 operations at line rate - secures OTA updates, DRM content, and vehicle identity tokens without CPU intervention. |
| PCIe 3.0 + SATA 3.0 Shared Lane | Single physical lane configurable as PCIe 3.0 x1 or SATA 3.0 - allows flexible expansion for telematics modems or storage modules without additional SerDes resources. |
Applications
| Automotive Digital Cluster | In-Vehicle Infotainment (IVI) |
|---|---|
Use Scenario: Real-time rendering of speed, ADAS alerts, navigation, and media status on a single 12.3″ TFT-LCD with 1920×720 resolution. IC Role / Device Role / Timing Role: Primary SoC executing QNX Hypervisor with guest VMs for instrument cluster (A72), media player (A53), and safety-critical gauges (M4F). Use Value: Dual display controllers drive primary cluster and secondary HUD simultaneously with sub-16 ms latency; SafeAssure ensures HUD remains active if cluster OS fails. |
Use Scenario: Central head unit supporting Android Automotive OS, 4K video playback, rear-seat wireless streaming, and voice-controlled navigation. IC Role / Device Role / Timing Role: Main applications processor managing GPU-accelerated UI, VPU decoding, HiFi 4 DSP audio pre/post-processing, and CAN-FD gateway functions. Use Value: Integrated H.265 decode at 4Kp60 and dual MIPI-CSI inputs enable simultaneous front/rear camera recording without external video processors. |
| Advanced Driver Assistance Systems (ADAS) Gateway | Commercial Vehicle Telematics Hub |
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for fusion processing and V2X communication in L2+ systems. IC Role / Device Role / Timing Role: Sensor hub SoC running AUTOSAR Adaptive Platform on A72/A53, with M4F handling CAN-FD message filtering and timestamping. Use Value: 3× CAN-FD interfaces with hardware message RAM and timestamping enable deterministic sensor data ingestion at 5 Mbps; PCIe 3.0 connects to AI accelerator card. |
Use Scenario: Fleet management terminal with GPS, cellular modem, driver ID biometrics, and remote diagnostics in heavy-duty trucks. IC Role / Device Role / Timing Role: Telematics control unit (TCU) hosting Linux, managing dual GbE AVB for camera/video upload, and securing OTA firmware via AHAB. Use Value: AEC-Q100 Grade 2 rating ensures reliable operation in cab temperature extremes; eMMC 5.1 interface provides robust local storage for log retention and crash data capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8QP5AVUFFAB | Omits HiFi 4 DSP; identical CPU/GPU/VPU configuration and AEC-Q100 qualification. | Suitable for non-audio-intensive IVI systems where voice processing is handled externally or omitted. | Select when audio DSP offload is unnecessary and BOM cost reduction is prioritized over on-chip voice acceleration. |
| TI AM6548AABN | ARM Cortex-A53 quad-core only (no A72/M4F), no integrated VPU, lower GPU performance (PowerVR SGX544MP2), but includes PRU-ICSS for industrial protocol offload. | Better suited for gateway-only roles without rich graphics or video; lacks 4K decode and dual-display failover. | Choose for cost-sensitive commercial vehicle gateways needing CAN/TSN but not infotainment-grade multimedia. |
Compared with MIMX8QP6AVUFFAB, MIMX8QP5AVUFFAB removes the HiFi 4 DSP while retaining identical compute, graphics, and safety features - making it ideal for display-centric automotive systems without voice processing. The AM6548AABN offers lower multimedia capability but adds industrial Ethernet and PRU flexibility, targeting gateway-focused designs rather than full IVI platforms.
Availability
MIMX8QP6AVUFFAB is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, ADAS domain controllers, and commercial telematics hubs requiring stable component supply across extended product lifecycles.
Supply support for MIMX8QP6AVUFFAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 8QuadPlus family - including MIMX8QP6AVUFFAB - was designed specifically for automotive infotainment and digital cockpit applications demanding AEC-Q100 qualification, hardware-enforced security, and integrated multimedia acceleration.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8QP6AVUFFAB?
MIMX8QP6AVUFFAB supports LPDDR4 at 1600 MHz (3200 MT/s), delivering 25.6 GB/s aggregate bandwidth across its 64-bit interface. This speed is validated per JEDEC JESD209-4 specification and requires strict PCB layout adherence to timing budgets defined in the i.MX 8QuadPlus Hardware Developer's Guide (IMX8HWDG). MIMX8QP6AVUFFAB does not support LPDDR4X or LPDDR5.
Does MIMX8QP6AVUFFAB include hardware support for secure boot?
Yes, MIMX8QP6AVUFFAB integrates Advanced High Assurance Boot (AHAB) with cryptographic verification of each boot stage using SHA-512 hashes and ECDSA-P384 signatures. It validates signed images stored in eMMC, SPI NOR, or SD card before execution and enforces chain-of-trust through the System Control Unit (SCU) and CAAM. MIMX8QP6AVUFFAB also supports encrypted boot with AES-256-XTS for firmware confidentiality.
Can MIMX8QP6AVUFFAB drive two independent 1080p60 displays simultaneously?
Yes, MIMX8QP6AVUFFAB supports up to four independent FullHD 1080p60 displays via its dual display controllers - each capable of driving one MIPI-DSI, HDMI, or LVDS output. Simultaneous dual 1080p60 operation is confirmed in Table 1 of the i.MX 8QuadPlus data sheet (Rev. 2, 05/2021) and validated in NXP's reference design RD-IMX8QP-1080P-DUAL.
What is the role of the Tensilica HiFi 4 DSP in MIMX8QP6AVUFFAB?
The Tensilica HiFi 4 DSP in MIMX8QP6AVUFFAB operates at 666 MHz and handles real-time audio pre- and post-processing tasks - including acoustic echo cancellation, noise suppression, multi-mic beamforming, and voice wake-word detection - offloading these functions from the Arm cores. MIMX8QP6AVUFFAB allocates 448 KB OCRAM and 64 KB TCM exclusively to the HiFi 4 DSP for deterministic low-latency execution.
Is MIMX8QP6AVUFFAB pin-compatible with other i.MX 8QuadPlus variants like MIMX8QP5AVUFFAB?
Yes, MIMX8QP6AVUFFAB is pin-compatible with MIMX8QP5AVUFFAB and all other FCPBGA 29 × 29 mm i.MX 8QuadPlus variants (e.g., MIMX8QP6AVUFFAB, MIMX8QP5AVUFFAB), sharing identical ball map, power sequencing, and thermal pad layout. This allows hardware reuse across configurations differing only in feature enablement (e.g., HiFi 4 DSP presence) and firmware-level differentiation.
MIMX8QP6AVUFFAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1313-BFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1313-BGA (29x29)
- Additional Interfaces:
- -
MIMX8QP6AVUFFAB FAQ
1.How can I place an order for MIMX8QP6AVUFFAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8QP6AVUFFAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8QP6AVUFFAB reliable?
The price and inventory of MIMX8QP6AVUFFAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8QP6AVUFFAB is usually 5 days.
3.What payment methods are accepted for MIMX8QP6AVUFFAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8QP6AVUFFAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8QP6AVUFFAB?
MIMX8QP6AVUFFAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8QP6AVUFFAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8QP6AVUFFAB?
For technical support, including MIMX8QP6AVUFFAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8QP6AVUFFAB requirements.
6.How does Aetrix verify that MIMX8QP6AVUFFAB is sourced from the original manufacturer or authorized distributors?
All MIMX8QP6AVUFFAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8QP6AVUFFAB meets industry standards.
7.What is the process for return or replacement of MIMX8QP6AVUFFAB?
All MIMX8QP6AVUFFAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8QP6AVUFFAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8QP6AVUFFAB part is unused and in its original packaging.
Return procedure for MIMX8QP6AVUFFAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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