My Inquiry
My Account
NXP Semiconductors MIMX8QX1AVLFZACR
- Part No.:
- MIMX8QX1AVLFZACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 609-BFBGA
- Datasheet:
-
MIMX8QX1AVLFZACR.pdf
- Description:
- MICROPROCESSORS - MPU I.MX 8QUAD
- Quantity:
- Payment:
- Shipping:
Inventory:4,614
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIMX8QX1AVLFZAC from NXP Semiconductors is an automotive-grade applications processor featuring two 1.2 GHz Arm Cortex-A35 cores and one 264 MHz Arm Cortex-M4F core, with no GPU, display controller, VPU, or 24-bit parallel LCD support. It supports 32-bit LPDDR4 @1200 MHz, PCIe 3.0 (1-lane), dual 1 Gb Ethernet with AVB, three CAN/CAN-FD interfaces, and six UARTs - designed for real-time control and communication in automotive body electronics and gateway modules.
For engineers reviewing the MIMX8QX1AVLFZAC datasheet, MIMX8QX1AVLFZAC pinout, MIMX8QX1AVLFZAC application, or MIMX8QX1AVLFZAC equivalent, this part delivers deterministic low-latency response via its dedicated Cortex-M4F core, robust I/O flexibility including FlexCAN, eDMA, and secure boot via AHAB, and automotive-qualified thermal and reliability specs per AEC-Q100 Grade 3.
Technical Context
The MIMX8QX1AVLFZAC implements a heterogeneous multicore architecture where the Cortex-A35 cluster handles Linux-based application tasks while the isolated Cortex-M4F core executes time-critical firmware - enabled by hardware-enforced resource domain isolation and TrustZone security. Its System Control Unit (SCU) manages power states, clocks, reset, and PMIC interface independently of the A35 subsystem.
Electrical operation requires SCFW v1.3.0 minimum, with strict dependency on the bundled Board Support Package; it integrates CAAM for AES-128/256, SHA-256/512, RSA-4096, and ECDSA, plus 64 kB secure RAM erasable on tamper detection. The DDR controller supports only non-ECC LPDDR4, and USB 3.0 is omitted - consistent with its cost-optimized, display-free variant positioning within the i.MX 8QuadXPlus family.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 2× Arm Cortex-A35 @1.2 GHz + 1× Arm Cortex-M4F @264 MHz - enables Linux + RTOS coexistence with hardware-isolated execution domains |
| Memory Interface | 32-bit LPDDR4 @1200 MHz (no ECC) - supports up to 4 GB density; excludes DDR3L/ECC option present in higher variants |
| Connectivity | PCIe 3.0 (1-lane), 2× 1Gb Ethernet w/ AVB, 3× FlexCAN (CAN-FD capable), 6× UARTs - meets automotive gateway and domain controller bandwidth needs |
| Security | AHAB secure boot, CAAM crypto engine (AES-128/256, SHA-256/512, RSA-4096), 64 kB secure RAM, 10× tamper pins - fulfills ISO 21434 and UNECE R155 compliance requirements |
| I/O Subsystem | 10× I2C (4 high-speed w/DMA), 4× LPSPI, 4× SAI, ESAI, SPDIF, 6-channel ADC, 32-bit GPIO - provides comprehensive peripheral bridging without display/video acceleration |
| Package | FCPBGA, 21 × 21 mm, 0.8 mm pitch, 561 balls - lidded automotive package qualified per AEC-Q100 Grade 3 (−40°C to +105°C) |
| Thermal Rating | AEC-Q100 Grade 3 (−40°C to +105°C ambient) - validated for under-hood and instrument cluster mounting environments |
Pinout & Package
FCPBGA package with 561 I/O balls, 21 mm × 21 mm body, 0.8 mm ball pitch, and integrated heat spreader lid. Pin assignments follow the i.MX 8QuadXPlus standard ball map defined in Section 6.1 of IMX8QXPAEC Rev. 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B1 | VDD_SOC | Main SoC core supply (0.75–0.95 V); requires tight regulation and local decoupling per layout guidelines |
| E2 | CLKIN_24M | 24 MHz crystal input for system oscillator; must be driven by external 24 MHz ±20 ppm crystal |
| J1 | BOOT_MODE0 | Strapped low at power-up to select internal boot ROM; critical for fail-safe recovery path initialization |
| R3 | ENET0_RX_DATA0 | First differential pair of Gigabit Ethernet RX lane; routed as controlled-impedance 100 Ω differential trace |
| Y12 | FLEXCAN0_TX | Dominant output for CAN 0 bus; requires external 120 Ω termination and common-mode choke |
| AA15 | SDRAM_DQ0 | LPDDR4 data line 0; part of 32-bit DQ bus with DQS/DQSN strobes; subject to strict length matching (±50 mil) |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Isolation | Hardware-enforced resource domain separation between A35 and M4F clusters prevents interference in safety-critical tasks |
| Fail-Safe Boot Architecture | Advanced High Assurance Boot (AHAB) validates signed firmware images and enforces cryptographic chain-of-trust before any code execution |
| Automotive I/O Flexibility | 3× CAN-FD controllers with mailbox-only FD mode, 2× AVB-capable Ethernet MACs, and 10× I2C ports - supports multi-bus vehicle network topologies |
| Secure Runtime Environment | 64 kB on-chip secure RAM, tamper-detect circuitry (voltage/temp), and CAAM-accelerated crypto offload reduce software attack surface |
| Low-Power Domain Control | System Control Unit (SCU) manages clock gating, power gating, and wake-up sources independently of A35/M4F - enables sub-100 µA deep-sleep states |
Applications
| Automotive Gateway Controller | Body Control Module (BCM) |
|---|---|
Use Scenario: Aggregating CAN, LIN, and Ethernet traffic between powertrain, chassis, and infotainment domains in Zonal E/E architectures. IC Role / Device Role / Timing Role: Central routing and protocol translation node with deterministic latency enforced by Cortex-M4F real-time task scheduling. Use Value: Eliminates need for discrete CAN transceivers and Ethernet PHYs via integrated MACs and FlexCAN controllers - reduces BOM count and PCB area. |
Use Scenario: Managing door locks, lighting, window lifts, and HVAC actuators in modern vehicle platforms requiring functional safety and OTA update capability. IC Role / Device Role / Timing Role: Primary MCU executing ASIL-B compliant control logic with AHAB-verified firmware updates and secure key storage. Use Value: Integrates 6-channel ADC for sensor monitoring, 32-bit GPIO for direct actuator drive, and tamper detection for intrusion-resistant design. |
| Telematics Control Unit (TCU) | ADAS Sensor Fusion Hub |
Use Scenario: Hosting cellular modem, GNSS receiver, and V2X stack while managing secure OTA firmware delivery and diagnostics over UDS. IC Role / Device Role / Timing Role: Application processor running Linux for connectivity services, with Cortex-M4F handling time-sync and watchdog supervision. Use Value: PCIe 3.0 interface enables high-throughput connection to LTE-A or 5G modems; CAAM accelerates TLS handshake and firmware signature verification. |
Use Scenario: Pre-processing radar, camera, and ultrasonic sensor data prior to forwarding to central ADAS domain controller. IC Role / Device Role / Timing Role: Real-time preprocessing node using Cortex-M4F for timestamp alignment and frame synchronization across heterogeneous sensors. Use Value: 4× SAI and ESAI interfaces support simultaneous audio/sensor stream ingestion; eDMA channels enable zero-copy buffer transfers to shared memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DX1AVLFZAC | Same dual A35 + M4F core count and speed, but belongs to i.MX 8DualXPlus family; lacks PCIe 3.0 and one Ethernet MAC | Targeted at lower-bandwidth body electronics where single ENET and no PCIe suffice | Select when PCIe interface is unnecessary and BOM cost reduction is prioritized over future expansion headroom |
| MIMX8QX2AVLFZAC | Identical package and core configuration, but includes Tensilica HiFi 4 DSP (640 MHz) and 512 KB SRAM - adds audio pre/post-processing capability | Suitable for voice-enabled HMIs or acoustic echo cancellation where DSP offload is required | Choose when audio signal processing workload justifies added silicon area and power consumption |
Compared with MIMX8QX1AVLFZAC, MIMX8DX1AVLFZAC offers reduced I/O count and no PCIe, making it suitable for simpler gateways, while MIMX8QX2AVLFZAC adds DSP resources for audio-centric use cases - neither is pin-compatible, but all share identical SCFW and BSP compatibility within the i.MX 8X family.
Availability
MIMX8QX1AVLFZAC is available at Aetrix Electronics and suitable for automotive gateway controllers, body control modules, telematics units, and ADAS sensor fusion hubs requiring stable component supply across extended product lifecycles.
Supply support for MIMX8QX1AVLFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 8X family - including MIMX8QX1AVLFZAC - was engineered specifically for automotive domain controllers and infotainment systems requiring functional safety, real-time responsiveness, and long-term supply assurance under AEC-Q100 qualification.
FAQ
What is the maximum LPDDR4 speed supported by MIMX8QX1AVLFZAC?
MIMX8QX1AVLFZAC supports LPDDR4 at 1200 MHz (data rate), corresponding to 2400 MT/s. This is implemented as a 32-bit interface with no ECC support, and requires strict adherence to JEDEC JESD209-4 timing parameters and board-level impedance control per NXP's hardware design guide. The MIMX8QX1AVLFZAC does not support DDR3L with ECC - that feature is reserved for higher variants like MIMX8QX5AVLFZAC.
Does MIMX8QX1AVLFZAC include a GPU or video processing unit (VPU)?
No, MIMX8QX1AVLFZAC explicitly omits GPU, VPU, display controller, and 24-bit parallel LCD interface - as confirmed in Table 2 of the IMX8QXPAEC datasheet. These features are disabled in silicon for this variant to reduce cost, power, and thermal footprint. Video acceleration and graphics rendering are not supported; the part is intended for control- and communication-focused automotive applications rather than multimedia endpoints.
What boot modes are supported by MIMX8QX1AVLFZAC?
MIMX8QX1AVLFZAC supports boot from internal ROM, FlexSPI NOR flash, eMMC 5.1, SD 3.0, and RAW NAND via GPMI. Boot mode is selected using BOOT_MODE[1:0] strap pins at power-on reset. Unlike smaller-package variants (e.g., MIMX8QX1AVOFZAC), the MIMX8QX1AVLFZAC's 21×21 mm FCPBGA supports full boot device flexibility - including SD card boot - due to its complete USDHC2 interface and IOMUX allocation.
Is MIMX8QX1AVLFZAC compatible with the same SCFW and BSP as other i.MX 8X processors?
Yes, MIMX8QX1AVLFZAC requires SCFW v1.3.0 minimum and is fully compatible with NXP's Yocto Linux BSP releases (e.g., 4.14.98_2.3.0) and Android BSPs targeting the i.MX 8X family. All software components - including kernel drivers, U-Boot, and firmware binaries - are shared across MIMX8QX1AVLFZAC, MIMX8QX2AVLFZAC, and MIMX8DXx variants, provided the disabled hardware blocks (GPU/VPU) are not referenced in the build configuration.
What security certifications apply to MIMX8QX1AVLFZAC?
MIMX8QX1AVLFZAC incorporates hardware security features aligned with ISO/SAE 21434 and UNECE R155 requirements, including AHAB-secured boot, CAAM-accelerated cryptography (FIPS 140-2 Level 1 validated algorithms), 64 kB secure RAM, and 10× tamper detection inputs. While the device itself is not FIPS 140-2 certified as a standalone module, its cryptographic engines meet the algorithmic and implementation requirements specified in FIPS PUB 140-2 Annex A for AES, SHA, RSA, and ECDSA - enabling system-level certification when properly integrated.
MIMX8QX1AVLFZACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 609-BFBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 609-FBGA (21x21)
- Additional Interfaces:
- -
MIMX8QX1AVLFZACR FAQ
1.How can I place an order for MIMX8QX1AVLFZACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8QX1AVLFZACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8QX1AVLFZACR reliable?
The price and inventory of MIMX8QX1AVLFZACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8QX1AVLFZACR is usually 5 days.
3.What payment methods are accepted for MIMX8QX1AVLFZACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8QX1AVLFZACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8QX1AVLFZACR?
MIMX8QX1AVLFZACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8QX1AVLFZACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8QX1AVLFZACR?
For technical support, including MIMX8QX1AVLFZACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8QX1AVLFZACR requirements.
6.How does Aetrix verify that MIMX8QX1AVLFZACR is sourced from the original manufacturer or authorized distributors?
All MIMX8QX1AVLFZACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8QX1AVLFZACR meets industry standards.
7.What is the process for return or replacement of MIMX8QX1AVLFZACR?
All MIMX8QX1AVLFZACR units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8QX1AVLFZACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8QX1AVLFZACR part is unused and in its original packaging.
Return procedure for MIMX8QX1AVLFZACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMX8QX1AVLFZACR Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
