NXP Semiconductors MIMX8QX1FVOFZAC

Overview

MIMX8QX1FVOFZAC from NXP Semiconductors is an automotive-grade i.MX 8QuadXPlus applications processor featuring four 1.2 GHz Arm Cortex-A35 cores, one 264 MHz Cortex-M4F core, and FIPS 140-2 certified security. It supports 16-bit DDR3L/DDR4 memory (no ECC), operates in industrial temperature range (−40°C to +105°C), and targets infotainment head units with CAN-FD and dual Ethernet AVB connectivity.

For engineers reviewing the MIMX8QX1FVOFZAC datasheet, MIMX8QX1FVOFZAC pinout, MIMX8QX1FVOFZAC application, or MIMX8QX1FVOFZAC equivalent, this page delivers verified SoC-level specifications, package mapping to 17×17 mm FCPBGA, confirmed peripheral disable set (no GPU/VPU/USB3/Display Controller), and validated alternatives for cost-optimized automotive control designs.

Technical Context

The MIMX8QX1FVOFZAC implements a heterogeneous multicore architecture with four AArch64 Cortex-A35 cores sharing 512 KB L2 cache with ECC, plus a dedicated Cortex-M4F core with 256 KB TCM. Its memory subsystem is limited to 16-bit DDR interface (no ECC support) and excludes LPDDR4, contrasting with larger 21×21 mm variants.

Security is anchored by CAAM cryptographic accelerator, 64 KB secure RAM, hardware RNG, and FIPS 140-2 certification. Peripheral enablement excludes GPU, VPU, USB 3.0, display controller, and 24-bit parallel LCD - all explicitly disabled per ordering table - while retaining dual 1 Gb Ethernet with AVB, 3× CAN-FD, and 6× UARTs including one SCU-tied port.

Key Specifications

Pinout & Package

Package: FCPBGA, 17 mm × 17 mm, 0.8 mm pitch, lidded, 493-ball configuration. Ball map defined in Section 6.2 of IMX8QXPAEC Rev. 4 (pages 136–152).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive applications processor applications.

Compared with MIMX8QX1FVOFZAC, MIMX8DX1FVOFZAC trades two A35 cores for lower thermal design power and bill-of-materials cost, while MIMX8QX2FVOFZAC adds audio DSP capability without increasing package size or memory bandwidth - enabling differentiated feature sets within the same mechanical footprint.

Availability

MIMX8QX1FVOFZAC is available at Aetrix Electronics and suitable for automotive infotainment head units, central gateway ECUs, telematics control units, and commercial vehicle fleet monitors requiring stable component supply across extended product lifecycles.

Supply support for MIMX8QX1FVOFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 8X family - including MIMX8QX1FVOFZAC - was designed specifically for cost-sensitive, safety-aware automotive infotainment and domain controller applications requiring long-term availability, AEC-Q100 qualification, and hardware-enforced security.

FAQ

What memory types does the MIMX8QX1FVOFZAC support?

The MIMX8QX1FVOFZAC supports 16-bit DDR3L and DDR4 memory operating up to 933 MHz. It does not support LPDDR4, DDR3L with ECC, or 32-bit wide interfaces - all excluded per its 17×17 mm package constraints and ordering specification. Memory initialization must follow NXP's DDR PHY training sequence documented in the i.MX 8X Reference Manual.

Does the MIMX8QX1FVOFZAC include GPU or VPU functionality?

No, the MIMX8QX1FVOFZAC explicitly disables GPU, VPU, and display controller functionality as stated in Table 2 of the IMX8QXPAEC datasheet. This distinguishes it from larger 21×21 mm variants like MIMX8QX6AVLFZAC. Graphics and video processing must be handled externally or omitted entirely in designs using MIMX8QX1FVOFZAC.

Is USB 3.0 supported on the MIMX8QX1FVOFZAC?

No, USB 3.0 is not supported on the MIMX8QX1FVOFZAC. The 17×17 mm package omits the SS3 and OTG2 balls required for SuperSpeed operation, leaving only USB 2.0 OTG1 functionality. This limitation is confirmed in Table 4 ("Feature differences per package") and Table 2's "Features not supported" column for MIMX8QX1FVOFZAC.

What is the maximum number of CAN-FD interfaces supported by the MIMX8QX1FVOFZAC?

The MIMX8QX1FVOFZAC supports three FlexCAN modules, each capable of CAN-FD operation in Mailbox mode. Legacy CAN mode additionally supports RX FIFO with DMA, but CAN-FD mode uses Mailbox only - with no enhanced RX FIFO or DMA support per the datasheet. All three interfaces operate concurrently with independent clock domains.

How is security implemented in the MIMX8QX1FVOFZAC?

Security in the MIMX8QX1FVOFZAC is implemented via the Cryptographic Accelerator and Assurance Module (CAAM), which provides FIPS 140-2 certified AES-128/192/256, SHA-256/384/512, RSA-4096, and ECDSA operations. It includes a hardware RNG, 64 KB erasable secure RAM, tamper detection on 10 pins, and Advanced High Assurance Boot (AHAB) for authenticated, encrypted boot - all confirmed in Sections 1 and 3 of IMX8QXPAEC Rev. 4.