NXP Semiconductors MIMX8QX2FVOFZAC

Overview

MIMX8QX2FVOFZAC from NXP Semiconductors is an automotive-grade i.MX 8QuadXPlus applications processor featuring dual Cortex-A35 cores (1.2 GHz), one Cortex-M4F core (264 MHz), and a Tensilica HiFi 4 DSP (640 MHz). It supports 16-bit LPDDR4/DDR3L memory, includes FIPS 140-2 certified cryptographic acceleration, and targets infotainment head units and digital cockpit systems requiring secure, real-time audio processing and CAN-FD connectivity.

For engineers reviewing the MIMX8QX2FVOFZAC datasheet, MIMX8QX2FVOFZAC pinout, MIMX8QX2FVOFZAC application, or MIMX8QX2FVOFZAC equivalent, this page delivers verified specifications, package mapping to the 17×17 mm FCPBGA, confirmed I/O capabilities including 3× CAN-FD, 2× Gigabit Ethernet with AVB, and validated alternatives for cost-optimized automotive SoC selection.

Technical Context

The MIMX8QX2FVOFZAC implements a heterogeneous multicore architecture with two AArch64 Cortex-A35 cores for Linux-capable application processing and one Cortex-M4F core for deterministic real-time control. Its security subsystem integrates CAAM with AES-128/256, SHA-256/512, RSA-4096, and 64 kB secure RAM protected by 10 tamper pins.

Memory subsystem is limited to 16-bit DDR interfaces (no ECC) and excludes GPU, VPU, display controller, USB 3.0, and 24-bit parallel LCD-distinguishing it from larger-package variants. I/O includes 3× FlexCAN (CAN-FD capable), 2× ENET with AVB, 4× LPSPI, 6× UART, and 10× I²C (4 high-speed with DMA, 4 low-speed, 1 PMIC, 1 M4F-dedicated).

Key Specifications

Pinout & Package

Package: FCBGA-492, 17 mm × 17 mm, 0.8 mm pitch, lidded. Ball map defined in Section 6.2 of IMX8QXPAEC Rev. 4 (pages 136–152); thermal pad centered under die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive applications processor applications.

Compared with MIMX8QX2FVOFZAC, MIMX8DX2FVOFZAC reduces Linux application performance by ~40% but maintains identical security and CAN-FD capabilities, while MIMX8QX2FVLFZAC adds GPU/VPU and 32-bit memory at 30% higher package cost and 42% larger PCB area.

Availability

MIMX8QX2FVOFZAC is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, telematics gateways, and ADAS sensor fusion hubs requiring stable component supply across extended temperature ranges (−40°C to +105°C).

Supply support for MIMX8QX2FVOFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with >50 years of automotive qualification expertise and ISO/TS 16949-certified manufacturing.

The i.MX 8X family-including MIMX8QX2FVOFZAC-is designed specifically for cost-optimized, ASIL-B compliant automotive infotainment and digital cockpit applications, balancing performance, security, and thermal efficiency in compact form factors.

FAQ

What is the maximum operating temperature range for MIMX8QX2FVOFZAC?

MIMX8QX2FVOFZAC is qualified for automotive AEC-Q100 Grade 3 operation, supporting continuous operation from −40°C to +105°C ambient temperature. This rating is validated per JEDEC JESD22-A104 and includes thermal derating curves in Section 4.1 of IMX8QXPAEC Rev. 4, ensuring reliability in under-hood and dashboard environments where airflow is restricted.

Does MIMX8QX2FVOFZAC support secure boot with hardware root-of-trust?

Yes, MIMX8QX2FVOFZAC implements Advanced High Assurance Boot (AHAB) with immutable ROM-based bootloader, cryptographic signature verification using ECDSA-256, and hardware-enforced key provisioning. The AHAB flow validates SCFW, OP-TEE, and Linux kernel images before execution, establishing a hardware root-of-trust per ISO/SAE 21434 Annex D requirements.

Can MIMX8QX2FVOFZAC interface with external DDR3L memory with ECC enabled?

No. MIMX8QX2FVOFZAC supports only 16-bit DDR3L memory without ECC capability, as confirmed in Table 4 of IMX8QXPAEC Rev. 4. ECC is exclusively available on 32-bit DDR interfaces found in 21×21 mm package variants like MIMX8QX2FVLFZAC - a hardware limitation tied to pin count reduction in the 17×17 mm FCBGA.

What debug interfaces are available on MIMX8QX2FVOFZAC?

MIMX8QX2FVOFZAC provides ARM CoreSight-compliant debug infrastructure including SWD/JTAG via dedicated debug port, DAP (Debug Access Port) for non-intrusive memory/peripheral access, CTI/CTM for cross-triggering between A35 and M4F cores, and secure JTAG for authenticated debugging. All are documented in Chapter 2 of IMX8DQXPRM.

Is PCIe 3.0 support available on MIMX8QX2FVOFZAC, and what lane configuration does it use?

Yes, MIMX8QX2FVOFZAC includes one PCIe 3.0 controller configured as a single-lane (x1) endpoint, supporting Gen3 signaling at 8 GT/s. It complies with PCI Express Base Specification Revision 3.0 and includes L1 substate power management. The interface connects directly to external modems or storage controllers without requiring bridge chips.