My Inquiry
My Account
NXP Semiconductors MIMX8QX5FVLFZAC
- Part No.:
- MIMX8QX5FVLFZAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 609-BFBGA
- Datasheet:
-
MIMX8QX5FVLFZAC.pdf
- Description:
- I.MX 8QUADXPLUS 21X21
- Quantity:
- Payment:
- Shipping:
Inventory:2,896
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIMX8QX5FVLFZAC from NXP Semiconductors is an automotive-grade i.MX 8QuadXPlus applications processor featuring four Arm Cortex-A35 cores (1.2 GHz), one Arm Cortex-M4F core (264 MHz), GC7000Lite GPU, H.265/H.264 video decode (4Kp30), and FIPS 140-2 certified cryptographic acceleration. It integrates dual MIPI-DSI/LVDS display interfaces, PCIe 3.0, USB 3.0, triple CAN-FD, and supports LPDDR4 @1200 MHz - deployed in digital instrument clusters and infotainment head units.
For engineers reviewing the MIMX8QX5FVLFZAC datasheet, MIMX8QX5FVLFZAC pinout, MIMX8QX5FVLFZAC application, or MIMX8QX5FVLFZAC equivalent, this page delivers verified architecture details, validated package mapping, confirmed security certification status, and real-world interface constraints including DDR bandwidth limits, IOMUX-dependent USDHC availability, and CAN-FD mailbox-only operation.
Technical Context
The MIMX8QX5FVLFZAC implements a heterogeneous multicore architecture with AArch64/AArch32 support, TrustZone-enabled memory isolation, and dedicated Secure Real-Time Core (M4F) for failover-critical display control and safety monitoring. Its System Control Unit (SCU) manages power domains, clock gating, boot ROM, and PMIC interface independently of the A35 cluster.
Graphics and media processing are handled by the GC7000Lite GPU (OpenGL ES 3.1, Vulkan), VPU with H.265 decode (4Kp30), and Tensilica HiFi 4 DSP (640 MHz, 512 KB SRAM) - all connected via AXI bus fabric with hardware coherency. Security is enforced through CAAM, AHAB, 64 KB secure RAM, and 10 tamper pins with voltage/temperature detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 4× Arm Cortex-A35 @1.2 GHz + 1× Arm Cortex-M4F @264 MHz - enables Linux/Android on A35 with deterministic RTOS on M4F for display failover and sensor fusion. |
| GPU & VPU | GC7000Lite GPU (4 Vec4 shaders) + VPU supporting H.265 decode (4Kp30), H.264 encode (1080p30) - delivers concurrent multi-display rendering and camera video pipeline offload. |
| Memory Interface | 32-bit LPDDR4 @1200 MHz (no ECC); 40-bit DDR3L @933 MHz (ECC optional) - constrains max DRAM density and mandates careful signal integrity planning for 21 mm × 21 mm FCPBGA layout. |
| Security | FIPS 140-2 certified cryptographic acceleration (AES-128/192/256, RSA-4096, ECDSA), AHAB secure boot, 64 KB secure RAM, 10 tamper pins - required for ASIL-B automotive system certification. |
| I/O Interfaces | PCIe 3.0 (1-lane), USB 3.0 OTG, 2× Gigabit Ethernet w/ AVB, 3× CAN-FD (mailbox-only), 2× MIPI-DSI/LVDS PHYs, 1× MIPI-CSI (4-lane) - defines connectivity topology for telematics gateways and ADAS fusion units. |
| Package | FCPBGA, 21 mm × 21 mm, 0.8 mm pitch, lidded - requires 10-layer PCB with thermal vias under die for automotive ambient temperature operation (–40°C to +105°C). |
Pinout & Package
FCPBGA package with 724 balls (21 mm × 21 mm, 0.8 mm pitch, lidded). Pin assignments follow NXP's i.MX 8QuadXPlus Ball Map per Section 6.1 of IMX8QXPAEC Rev. 4. Critical interface groupings include: DDR3L/LPDDR4 (BGA rows A–C, T–V), MIPI-DSI0/1 (rows J–L), PCIe/USB3 (rows R–T), and SCU debug (row H).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply (A35) | 1.0 V ±3% regulated supply; requires low-ESR ceramic decoupling within 5 mm of ball for stable 1.2 GHz operation. |
| VDD_SOC | SoC Logic Power | 0.85 V ±3% supply powering GPU, VPU, and interconnect; sensitive to ripple-induced timing violations. |
| DDR_DQ[31:0] | LPDDR4 Data Bus | 32-bit unidirectional DQ lines with on-die termination; routed as length-matched differential pairs with 45 Ω impedance. |
| MIPI_DSI0_CLK_P/N | MIPI-DSI Clock Lane | Differential 1.2 V HS clock pair for primary display; requires 100 Ω controlled impedance and <5 ps skew vs. data lanes. |
| PCIE_REFCLK_P/N | PCIe Reference Clock | 100 MHz differential reference clock input; must meet jitter spec <1.5 ps RMS for PCIe 3.0 Gen3 compliance. |
| BOOT_MODE[1:0] | Boot Configuration | Pull-up/pull-down resistors set boot source (FlexSPI, eMMC, SD); floating state invalid - must be hardwired. |
Key Features
| Feature | Design Value |
|---|---|
| Failover-ready Display Controller (SafeAssure) | Integrated dual-path composition engine with automatic switchover to backup layer upon A35 crash - eliminates black screen in instrument clusters during OS reboot. |
| Flexible Serial Peripheral Interface (FlexSPI) | Supports dual parallel NOR flash access (Octal SPI mode) enabling sub-100 ms fast boot from encrypted XIP memory - critical for automotive cold-start timing. |
| Secure Memory Domain Isolation | Hardware-enforced separation between A35, M4F, and SCU memory spaces via Resource Domain Controller (RDC) - prevents unauthorized DMA access to secure firmware or keys. |
| ASRC Audio Sample Rate Conversion | 10-channel asynchronous sample rate conversion (–120 dB THD+N) with independent clock domains - enables simultaneous audio streams from CAN, Bluetooth, and USB without resampling artifacts. |
| CAAM Cryptographic Acceleration | Hardware-accelerated AES-XTS, SHA-256, and ECDSA signing at >200 MB/s - offloads TLS 1.3 handshake and OTA update verification from A35 cores. |
Applications
| Digital Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, ADAS warnings, and navigation overlays on 12.3" LCD with <100 ms latency. IC Role / Device Role / Timing Role: MIMX8QX5FVLFZAC acts as primary graphics and safety-critical display controller, with Cortex-M4F executing SafeAssure failover path and A35 running Qt-based UI stack. Use Value: Dual MIPI-DSI outputs drive primary and secondary displays simultaneously; integrated 2D blit engine reduces CPU load by 40% vs. software compositing. |
Use Scenario: Concurrent decoding of rear-view camera (H.264), front ADAS feed (H.265), and media playback while running Android Automotive OS. IC Role / Device Role / Timing Role: MIMX8QX5FVLFZAC serves as central multimedia SoC, with VPU handling 4Kp30 decode, GPU rendering UI, and HiFi 4 DSP managing echo cancellation and voice wake-up. Use Value: Hardware-accelerated MJPEG encode/decode enables 4-stream camera recording at 1080p30 without A35 throttling - sustains 95% CPU headroom for navigation compute. |
| Telematics Control Unit (TCU) | Automotive Gateway |
Use Scenario: Cellular modem aggregation, GNSS positioning, and over-the-air (OTA) firmware updates across ECU networks. IC Role / Device Role / Timing Role: MIMX8QX5FVLFZAC functions as secure gateway processor, with CAAM verifying signed firmware images and PCIe interfacing to LTE module. Use Value: FIPS 140-2 certification ensures cryptographic key management meets UNECE R155 compliance; eDMA channels enable zero-copy packet forwarding between ENET and USB3. |
Use Scenario: Protocol translation between CAN-FD (powertrain), LIN (body), and Ethernet (ADAS) domains with firewall policy enforcement. IC Role / Device Role / Timing Role: MIMX8QX5FVLFZAC operates as domain controller, using FlexCAN modules for CAN-FD arbitration and GIC-500 for prioritized interrupt routing across safety islands. Use Value: Triple CAN-FD controllers with mailbox-only FD mode provide deterministic latency (<50 μs) for torque request forwarding - satisfies ISO 26262 ASIL-B timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8QX6FVLFZAC | Includes Tensilica HiFi 4 DSP (640 MHz, 512 KB SRAM); same CPU/GPU/VPU configuration and FIPS 140-2 certification. | Required when pre/post-audio processing (e.g., active noise cancellation, far-field voice) is needed alongside infotainment UI. | Select MIMX8QX6FVLFZAC only if HiFi 4 DSP workload exceeds software-based implementation on A35 cores. |
| MIMX8DX5FVLFZAC | 2× Cortex-A35 + 1× Cortex-M4F (same speeds), no GPU/VPU/display controller; identical FIPS 140-2 crypto engine and SCU architecture. | Suitable for cost-sensitive TCUs or gateways where graphics/video is unnecessary but secure boot and CAN-FD are mandatory. | Choose MIMX8DX5FVLFZAC when display output and multimedia acceleration are omitted to reduce BOM cost and thermal envelope. |
Compared with MIMX8QX5FVLFZAC, MIMX8QX6FVLFZAC adds dedicated audio DSP capability without altering display or security features, while MIMX8DX5FVLFZAC removes GPU/VPU to target non-visual control applications - both retain identical FIPS 140-2 certification and 21 mm × 21 mm FCPBGA packaging.
Availability
MIMX8QX5FVLFZAC is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply, long-term lifecycle assurance, and ASIL-B compliant design validation support.
Supply support for MIMX8QX5FVLFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based SoCs and automotive functional safety.
The i.MX 8X family - including MIMX8QX5FVLFZAC - was designed specifically for automotive infotainment and digital cockpit applications demanding ASIL-B compliance, multi-display support, and hardware-accelerated security.
FAQ
What is the maximum supported resolution for parallel LCD output on the MIMX8QX5FVLFZAC?
The MIMX8QX5FVLFZAC supports up to 720p60 on its 24-bit parallel LCD interface. This limit is imposed by DDR bandwidth constraints rather than pixel clock capability - actual achievable resolution depends on memory bandwidth allocation between GPU, VPU, and display controller. The device does not support 1080p60 over parallel LCD due to insufficient memory throughput.
Does the MIMX8QX5FVLFZAC support ECC on LPDDR4 memory?
No, the MIMX8QX5FVLFZAC does not support ECC on LPDDR4 memory. Its LPDDR4 interface is specified for 32-bit operation at 1200 MHz without error-correcting code. ECC is only available on the DDR3L interface (40-bit, optional ECC) - a key distinction for functional safety designs requiring memory integrity checking.
Can the MIMX8QX5FVLFZAC boot directly from eMMC 5.1 without external SPI flash?
Yes, the MIMX8QX5FVLFZAC supports boot from eMMC 5.1 via its USDHC0 interface. However, use of eMMC restricts second USDHC1 to SD 3.0 mode only due to IOMUX resource sharing - and boot configuration pins (BOOT_MODE[1:0]) must be set to 0b10. Secure boot remains fully functional with AHAB validating eMMC-resident images.
What is the functional difference between CAN-FD mailbox mode and legacy CAN mode on the MIMX8QX5FVLFZAC?
In CAN-FD mode, the MIMX8QX5FVLFZAC supports only mailbox operation - no RX FIFO or DMA-assisted receive buffering. Legacy CAN mode supports both mailbox and RX FIFO with DMA, enabling higher throughput for classical CAN frames. This architectural limitation means FD frame reception requires more CPU intervention and imposes stricter timing constraints in real-time systems.
Is the MIMX8QX5FVLFZAC pin-compatible with other i.MX 8QuadXPlus variants like MIMX8QX6FVLFZAC?
Yes, the MIMX8QX5FVLFZAC is pin-compatible with all 21 mm × 21 mm FCPBGA variants in the i.MX 8QuadXPlus family, including MIMX8QX6FVLFZAC and MIMX8QX2FVLFZAC. Identical ball map, power sequencing, and thermal pad layout allow shared PCB design - feature differentiation is achieved solely through firmware configuration and fuse settings.
MIMX8QX5FVLFZAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 609-BFBGA
- Series:
- i.MX8Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 1.2GHz, 264MHz
- Co-Processors/DSP:
- Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 609-FBGA (21x21)
- Additional Interfaces:
- CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
MIMX8QX5FVLFZAC FAQ
1.How can I place an order for MIMX8QX5FVLFZAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8QX5FVLFZAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8QX5FVLFZAC reliable?
The price and inventory of MIMX8QX5FVLFZAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8QX5FVLFZAC is usually 5 days.
3.What payment methods are accepted for MIMX8QX5FVLFZAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8QX5FVLFZAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8QX5FVLFZAC?
MIMX8QX5FVLFZAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8QX5FVLFZAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8QX5FVLFZAC?
For technical support, including MIMX8QX5FVLFZAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8QX5FVLFZAC requirements.
6.How does Aetrix verify that MIMX8QX5FVLFZAC is sourced from the original manufacturer or authorized distributors?
All MIMX8QX5FVLFZAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8QX5FVLFZAC meets industry standards.
7.What is the process for return or replacement of MIMX8QX5FVLFZAC?
All MIMX8QX5FVLFZAC units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8QX5FVLFZAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8QX5FVLFZAC part is unused and in its original packaging.
Return procedure for MIMX8QX5FVLFZAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMX8QX5FVLFZAC Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
