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NXP Semiconductors MIMX8SL1AVNFZAB
- Part No.:
- MIMX8SL1AVNFZAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 388-LFBGA
- Datasheet:
-
MIMX8SL1AVNFZAB.pdf
- Description:
- I.MX8 DXL 15SQ
- Quantity:
- Payment:
- Shipping:
Inventory:4,483
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Product details
Overview
MIMX8SL1AVNFZAB from NXP Semiconductors is an automotive-grade i.MX 8XLite applications processor featuring a single Arm Cortex-A35 core @1.2 GHz, a Cortex-M4F real-time core @264 MHz, 16-bit LPDDR4 @1200 MHz with inline ECC, and integrated V2X acceleration support. It targets infotainment head units and domain controllers requiring ASIL-B functional safety compliance, deterministic real-time response, and secure boot.
For engineers reviewing the MIMX8SL1AVNFZAB datasheet, MIMX8SL1AVNFZAB pinout, MIMX8SL1AVNFZAB application, or MIMX8SL1AVNFZAB equivalent, key selection criteria include its FIPS 140-3 non-certified status, 15×15 mm FCPBGA package with mixed 0.56/0.8 mm pitch, automotive temperature grade (−40°C to +105°C), and dual-voltage I/O (1.8 V / 3.3 V) support for CAN-FD, TSN Ethernet, and FlexSPI boot.
Technical Context
The MIMX8SL1AVNFZAB implements a heterogeneous multicore architecture: one Cortex-A35 core handles Linux-based infotainment OS tasks while the Cortex-M4F core executes time-critical firmware (e.g., CAN message filtering, sensor preprocessing) with 256 KB TCM and hardware floating-point unit. Its System Control Unit (SCU) manages power domains, boot ROMs, PMIC interface via dedicated I²C, and resource isolation.
Memory subsystem includes LPDDR4 @1200 MHz (16-bit, inline ECC) and DDR3L @933 MHz (16-bit, inline ECC), plus FlexSPI supporting quad/octal SPI NOR flash boot. Connectivity integrates PCIe 3.0 (1-lane), dual USB 2.0, two 1 Gb Ethernet ports (one with AVB, one with TSN), three CAN/CAN-FD controllers, six UARTs (including one tightly coupled to M4F), and four SAI audio interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A35 @1.2 GHz - delivers Linux-capable application processing with AArch64 support and virtualization extensions |
| Real-time Core | Arm Cortex-M4F @264 MHz - provides deterministic real-time control with 256 KB TCM, FPU, and NVIC for safety-critical firmware |
| Memory Interface | 16-bit LPDDR4 @1200 MHz with inline ECC - enables high-bandwidth, error-corrected system memory for infotainment graphics and multimedia buffering |
| Automotive Interfaces | 3× CAN/CAN-FD, 2× 1Gb Ethernet (AVB + TSN), 6× UARTs - supports vehicle network communication, time-synchronized diagnostics, and legacy ECU bridging |
| Package | FCPBGA, 15 × 15 mm, 0.56/0.8 mm mixed pitch - automotive-qualified ball grid array enabling thermal management in compact head unit PCB layouts |
| Temperature Grade | −40°C to +105°C - qualified for under-dash automotive environments without active cooling requirements |
| FIPS Certification | Not FIPS 140-3 certified - suitable for non-cryptographic security applications where SECO-based secure boot suffices |
Pinout & Package
Package: FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed ball pitch, bare die construction per NXP IMX8XLB0AEC Rev. 4 (06/2025).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply | 1.0 V ±3% input powering Cortex-A35 and SCU logic; requires low-noise regulation and decoupling near package edge |
| VDD_MEMC | LPDDR4 memory controller supply | 1.1 V ±3% supply for DDR PHY and memory controller; critical for signal integrity in high-speed LPDDR4 routing |
| VDD_DDR_VDDQ | LPDDR4 I/O supply | 1.1 V ±3% termination voltage for LPDDR4 data/strobe lines; must be independently filtered from VDD_MEMC |
| OSC24M | Main crystal reference input | 24 MHz external crystal connection; primary clock source for PLLs including DDR, USB, and Ethernet PHYs |
| OSC32K | Real-time clock reference | 32.768 kHz crystal input for SNVS RTC and low-power timer operation during deep sleep states |
| BOOT_MODE[1:0] | Boot configuration pins | Strapped at power-on to select boot device (FlexSPI NOR, eMMC, SD, NAND); determines initial firmware load path |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous dual-core architecture | Separates Linux application workload (Cortex-A35) from hard real-time control (Cortex-M4F), eliminating RTOS coexistence complexity in automotive ECUs |
| Integrated V2X acceleration | Dedicated cryptographic hardware accelerates DSRC/WAVE packet signing and verification, reducing CPU load for vehicle-to-everything communication stacks |
| TSN + AVB Ethernet support | Enables time-synchronized audio/video streaming and deterministic control messaging over standard Ethernet, meeting ISO 20092-2 timing requirements |
| Secure Boot and SECO | Hardware-enforced chain of trust using HAB (High Assurance Boot) and SECO subsystem ensures only signed firmware executes, preventing unauthorized code injection |
| FlexSPI boot with octal mode | Supports fast, secure boot from high-density SPI NOR flash (up to 800 MB/s read bandwidth), reducing boot time versus NAND or eMMC in cost-sensitive designs |
Applications
| Infotainment Head Unit | Digital Cluster Controller |
|---|---|
Use Scenario: Central display unit running Android Automotive OS with navigation, media playback, and voice assistant. IC Role / Device Role / Timing Role: Main applications processor executing GUI framework, audio codec offload, and CAN bus gateway between instrument cluster and body control module. Use Value: Single-chip integration of A35 application processing, M4F real-time CAN filtering, and SPDIF/SAI audio I/O eliminates need for companion MCU and audio DSP, reducing BOM count by 2–3 components. |
Use Scenario: High-resolution TFT instrument cluster rendering speedometer, ADAS warnings, and vehicle status with <50 ms latency. IC Role / Device Role / Timing Role: Real-time controller managing graphics rendering (via LCDIF), CAN FD message parsing, and fault-tolerant watchdog supervision using Cortex-M4F core. Use Value: M4F TCM execution guarantees sub-10 µs interrupt response for critical warning signals, while A35 handles non-time-critical UI updates-meeting ASIL-B timing partitioning requirements. |
| Telematics Control Unit (TCU) | V2X Roadside Unit (RSU) |
Use Scenario: Cellular-connected module aggregating GPS, cellular modem, and vehicle bus data for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Secure host processor managing uSDHC-based eMMC storage, PCIe-connected LTE modem, and dual Ethernet for cloud and CAN backhaul. Use Value: Integrated eMMC 5.1 controller and PCIe 3.0 PHY enable direct modem attachment without bridge IC, cutting latency by 12–18 µs versus USB-based modems. |
Use Scenario: Fixed infrastructure node broadcasting traffic light phase, pedestrian crossing alerts, and road hazard notifications to nearby vehicles. IC Role / Device Role / Timing Role: Cryptographic accelerator host for V2X message signing/verification, with TSN Ethernet ensuring synchronized broadcast timing across multi-RSU deployments. Use Value: On-die V2X engine processes >1,200 DSRC packets/sec at <200 µs latency, meeting ETSI EN 302 663-2 Class 2 timing constraints without external crypto coprocessor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8SL2AVNFZAB | FIPS 140-3 certified (SECO only); identical core config, package, and I/O | Required for government fleet telematics or defense-adjacent V2X deployments needing cryptographic validation | Select when FIPS-level auditability is mandated; same PCB layout but requires updated SCFW and BSP signing keys |
| MIMX8DL1AVNFZAB | Dual Cortex-A35 cores @1.2 GHz; same M4F, memory, and peripheral set | Suitable for dual-display systems (e.g., front/rear seat infotainment) requiring parallel OS instances | Choose for higher application throughput; adds ~150 mW static power but retains pin compatibility and thermal profile |
Compared with MIMX8SL1AVNFZAB, MIMX8SL2AVNFZAB adds FIPS 140-3 certification for SECO security functions without altering performance or footprint, while MIMX8DL1AVNFZAB doubles A35 compute capacity for multitasking workloads at the cost of increased power and thermal envelope-both retain identical pinout and software compatibility.
Availability
MIMX8SL1AVNFZAB is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, telematics control units, and V2X roadside equipment requiring stable component supply across extended production lifecycles.
Supply support for MIMX8SL1AVNFZAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets with over 40 years of microcontroller and SoC leadership.
The i.MX 8XLite family-including MIMX8SL1AVNFZAB-is designed specifically for cost-optimized automotive infotainment and domain controller applications, balancing Linux-capable performance, real-time responsiveness, and ASIL-B functional safety features in a single die.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8SL1AVNFZAB?
The MIMX8SL1AVNFZAB supports LPDDR4 at 1200 MHz (data rate), corresponding to 2400 MT/s with 16-bit bus width and inline ECC enabled. This speed is validated under automotive temperature range (−40°C to +105°C) and requires strict PCB layout adherence to NXP's IMX8XLB0AEC package routing guidelines for signal integrity and power delivery.
Does MIMX8SL1AVNFZAB include hardware support for CAN FD?
Yes, MIMX8SL1AVNFZAB integrates three FlexCAN modules compliant with ISO 11898-1:2015, supporting both classical CAN 2.0B and CAN FD protocols up to 5 Mbps data phase. Each controller includes dedicated message RAM, FIFOs, and loopback self-test modes-enabling simultaneous CAN FD communication on multiple vehicle networks without software overhead.
Is MIMX8SL1AVNFZAB pin-compatible with other i.MX 8XLite variants like MIMX8DL1AVNFZAB?
Yes, MIMX8SL1AVNFZAB shares identical FCPBGA 15×15 mm package dimensions, ball map, and power/ground pin assignments with all i.MX 8XLite orderable parts including MIMX8DL1AVNFZAB and MIMX8SL2AVNFZAB. This enables drop-in replacement on existing PCBs when upgrading core count or security certification level without layout changes.
What boot devices does MIMX8SL1AVNFZAB support natively?
MIMX8SL1AVNFZAB supports native boot from FlexSPI-connected NOR flash (quad/octal mode), eMMC 5.1, SD 3.0 (UHS-I), and raw NAND flash with BCH62 ECC. Boot mode is selected via BOOT_MODE[1:0] pins at power-on reset, and the internal boot ROM validates image signatures using HAB before loading SCFW and application firmware.
What is the role of the Cortex-M4F core in MIMX8SL1AVNFZAB system architecture?
The Cortex-M4F core in MIMX8SL1AVNFZAB operates as a dedicated real-time subsystem, executing safety-critical firmware such as CAN FD message filtering, ADC sampling for battery monitoring, and watchdog supervision-fully isolated from the Cortex-A35 Linux environment via RDC and TrustZone. It accesses 256 KB TCM with ECC and runs at 264 MHz for deterministic sub-10 µs interrupt latency.
MIMX8SL1AVNFZAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-LFBGA
- Series:
- i.MX8X
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A35
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- ARM® Cortex®-M4F
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 1Gbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 388-LBGA (15x15)
- Additional Interfaces:
- CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
MIMX8SL1AVNFZAB FAQ
1.How can I place an order for MIMX8SL1AVNFZAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8SL1AVNFZAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8SL1AVNFZAB reliable?
The price and inventory of MIMX8SL1AVNFZAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8SL1AVNFZAB is usually 5 days.
3.What payment methods are accepted for MIMX8SL1AVNFZAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8SL1AVNFZAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8SL1AVNFZAB?
MIMX8SL1AVNFZAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8SL1AVNFZAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8SL1AVNFZAB?
For technical support, including MIMX8SL1AVNFZAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8SL1AVNFZAB requirements.
6.How does Aetrix verify that MIMX8SL1AVNFZAB is sourced from the original manufacturer or authorized distributors?
All MIMX8SL1AVNFZAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8SL1AVNFZAB meets industry standards.
7.What is the process for return or replacement of MIMX8SL1AVNFZAB?
All MIMX8SL1AVNFZAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8SL1AVNFZAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8SL1AVNFZAB part is unused and in its original packaging.
Return procedure for MIMX8SL1AVNFZAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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