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NXP Semiconductors MIMX8SL1AVNFZBAR
- Part No.:
- MIMX8SL1AVNFZBAR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 388-LFBGA
- Datasheet:
-
MIMX8SL1AVNFZBAR.pdf
- Description:
- I.MX 8SOLOXLITE A1 PRODUCTION PN
- Quantity:
- Payment:
- Shipping:
Inventory:2,315
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Product details
Overview
MIMX8SL1AVNFZBAR from NXP Semiconductors is a single-core Arm Cortex-A35 automotive application processor operating at 1.2 GHz, integrated with a 264 MHz Cortex-M4F real-time co-processor, LPDDR4/DDR3L memory interfaces with inline ECC, and automotive-grade I/O including dual 1 Gb Ethernet (one with AVB, one with TSN), 3× CAN-FD, and PCIe 3.0 (1-lane). It targets infotainment head units and domain controllers requiring functional safety support and secure boot.
For engineers reviewing the MIMX8SL1AVNFZBAR datasheet, MIMX8SL1AVNFZBAR pinout, MIMX8SL1AVNFZBAR application, or MIMX8SL1AVNFZBAR equivalent, key selection criteria include A35/M4F asymmetric multicore architecture, FCPBGA 15×15 mm packaging with mixed 0.56/0.8 mm pitch, automotive temperature grade (−40°C to +125°C), absence of FIPS 140-3 certification, and SCFW-dependent system controller firmware requirements.
Technical Context
The MIMX8SL1AVNFZBAR implements an asymmetric multicore architecture with one Cortex-A35 core for Linux-based application processing and one Cortex-M4F core for deterministic real-time control tasks, both supported by TrustZone security isolation. Its System Control Unit (SCU) manages power domains, clock gating, boot ROM execution, and PMIC interface via dedicated I²C.
Memory subsystem includes 16-bit LPDDR4 @1200 MHz and DDR3L @933 MHz, both with inline ECC, plus FlexSPI for fast boot from SPI NOR flash and NAND support with 62-bit BCH ECC. Connectivity integrates PCIe 3.0 (1-lane), dual USB 2.0 OTG, two uSDHC controllers (eMMC 5.1/SD 3.0), and three FlexCAN modules compliant with CAN FD protocol.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A35 @ 1.2 GHz + single Cortex-M4F @ 264 MHz for real-time task offload |
| Memory Interface | 16-bit LPDDR4 @1200 MHz with inline ECC; supports DDR3L @933 MHz with inline ECC |
| Automotive I/O | 3× CAN-FD controllers; dual 1 Gb Ethernet (1× AVB, 1× TSN); PCIe 3.0 (1-lane) |
| Security | No FIPS 140-3 certification; CAAM cryptographic accelerator; Secure JTAG with eFUSE-configurable modes |
| Package | FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed ball pitch, bare die construction |
| Temperature Grade | Automotive: −40°C to +125°C junction temperature, qualified per AEC-Q100 Grade 2 |
| Boot Support | FlexSPI, eMMC 5.1, SD 3.0, RAW NAND (ONFI 3.2/Toggle mode); requires minimum SCFW version per BSP |
Pinout & Package
Package: FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed pitch, 472-ball layout (ball map defined in NXP document IMX8XLB0AEC Rev. 4, Section 5.1.2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply | 1.0 V ±3% input for Cortex-A35/M4F logic; requires low-noise regulation and decoupling |
| VDD_DDR_VDDQ | DDR I/O supply | 1.1 V ±3% for LPDDR4/DDR3L data bus; critical for signal integrity and timing margin |
| OSC24M / OSC32K | Primary clock inputs | 24 MHz crystal reference for PLL synthesis; 32 kHz crystal for RTC and low-power wake-up |
| ENET0_RXD0–3 / TXD0–3 | Gigabit Ethernet PHY interface | Dedicated RMII/RGMII signals for first Ethernet port with AVB support |
| CAN0_TX / CAN0_RX | CAN-FD transceiver interface | Differential pair for first CAN-FD channel; compatible with ISO 11898-2/5 physical layer |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric Multicore Architecture | Separate A35 (Linux-capable) and M4F (real-time deterministic) execution environments with shared memory and MU inter-core messaging |
| Automotive Ethernet Integration | Dual 1 Gb Ethernet MACs - one with Audio Video Bridging (AVB) for time-synchronized media streaming, one with Time-Sensitive Networking (TSN) for deterministic control traffic |
| Secure Boot & Runtime Security | HAB (High Assurance Boot) enforced via OCOTP fuses; CAAM accelerates AES-128/256, SHA-256, RSA/ECC; Secure JTAG with three configurable access modes |
| Flexible Memory Expansion | FlexSPI supports quad/octal SPI NOR/NAND with DDR/DTR modes; NAND controller with 62-bit BCH ECC enables reliable raw NAND boot and storage |
| Functional Safety Ready | Includes lockstep-capable peripherals (e.g., ADC, WDOG), memory ECC on LPDDR4/DDR3L/L2 cache/TCM, and diagnostic firmware support for ISO 26262 ASIL-B targeting |
Applications
| Infotainment Head Unit | Digital Cluster Controller |
|---|---|
|
Use Scenario: Centralized display and multimedia hub in modern vehicle dashboards, supporting Android Automotive OS or QNX with voice, navigation, and connectivity. IC Role / Device Role / Timing Role: Primary application processor running GUI stack and media framework; M4F handles CAN message aggregation and instrument cluster rendering timing. Use Value: Single-chip integration reduces BOM count and board area; LPDDR4 bandwidth and dual Ethernet enable concurrent high-res video decode and OTA update delivery without latency spikes. |
Use Scenario: Real-time rendering of speed, RPM, warning icons, and ADAS status on TFT-LCD or OLED displays behind steering wheel. IC Role / Device Role / Timing Role: A35 executes HMI logic and graphics composition; M4F runs hard-real-time gauge animation engine with sub-10 ms loop latency and deterministic CAN/FlexRay message parsing. Use Value: On-chip L2 cache ECC and TCM parity ensure pixel-perfect display updates under EMI stress; ASRC and SAI interfaces synchronize audio alerts with visual warnings. |
| ADAS Domain Controller | Telematics Control Unit (TCU) |
|
Use Scenario: Sensor fusion gateway aggregating camera, radar, and ultrasonic inputs for parking assist and blind-spot detection before forwarding to central ADAS ECU. IC Role / Device Role / Timing Role: A35 hosts perception middleware and communication stacks; M4F performs time-critical sensor preprocessing and watchdog supervision of safety-critical paths. Use Value: PCIe 3.0 (1-lane) enables direct connection to vision processor ASICs; dual CAN-FD ports handle high-bandwidth sensor data and actuator commands with guaranteed latency. |
Use Scenario: Cellular-connected module managing remote diagnostics, firmware updates, emergency call (eCall), and vehicle-to-cloud telemetry in connected vehicles. IC Role / Device Role / Timing Role: A35 runs LTE modem interface, TLS stack, and OTA update manager; M4F monitors cellular link health and triggers failover to backup network interface. Use Value: Dual uSDHC controllers allow simultaneous eMMC (system storage) and SD card (field service logging); 3× CAN-FD links vehicle bus data to cloud analytics pipelines with timestamp alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8SL2AVNFZAB | Identical architecture and package, but includes FIPS 140-3 certification for SECO subsystem only | Required where cryptographic module validation is mandated for secure boot or key management in Tier 1 supply chains | Select when compliance documentation (e.g., NIST CMVP reports) must be provided for government or regulated OEM programs |
| MIMX8DL1AVNFZAB | Dual Cortex-A35 cores @ 1.2 GHz (vs. single A35), same M4F, identical I/O and memory interfaces | Better suited for multi-container Linux deployments (e.g., isolated IVI and digital cluster VMs) or higher-throughput media transcoding | Choose when application workload exceeds single-A35 throughput but FIPS certification is not required |
Compared with MIMX8SL1AVNFZBAR, MIMX8SL2AVNFZAB adds FIPS 140-3 validation for SECO without changing performance or pinout, while MIMX8DL1AVNFZAB doubles A35 compute capacity at same power envelope-enabling parallelized HMI and connectivity stacks without increasing PCB footprint.
Availability
MIMX8SL1AVNFZBAR is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, ADAS domain gateways, and telematics control units requiring stable component supply across extended production lifecycles.
Supply support for MIMX8SL1AVNFZBAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 8XLite family-including MIMX8SL1AVNFZBAR-is designed specifically for cost-optimized, safety-aware automotive infotainment and domain control applications, balancing performance, security, and ASIL-B readiness in compact packaging.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8SL1AVNFZBAR?
MIMX8SL1AVNFZBAR supports LPDDR4 at up to 1200 MHz with 16-bit bus width and inline ECC. This speed is validated under automotive temperature conditions (−40°C to +125°C) and requires strict PCB layout adherence to JEDEC LPDDR4 timing and impedance rules. The memory controller does not support LPDDR4X or LPDDR5.
Does MIMX8SL1AVNFZBAR include hardware support for CAN FD?
Yes, MIMX8SL1AVNFZBAR integrates three FlexCAN modules compliant with ISO 11898-1:2015 and supporting CAN FD protocol up to 5 Mbps data phase. Each CAN controller includes dedicated message RAM, error counters, and loopback/self-test modes usable in both A35 and M4F software contexts.
Is MIMX8SL1AVNFZBAR pin-compatible with other i.MX 8XLite variants like MIMX8DL1AVNFZAB?
Yes, MIMX8SL1AVNFZBAR shares identical FCPBGA 15×15 mm package, 472-ball layout, and pin assignments with all i.MX 8XLite family members-including MIMX8DL1AVNFZAB, MIMX8SL2AVNFZAB, and MIMX8DL2AVNFZAB-enabling hardware reuse across single- and dual-A35 SKUs without PCB redesign.
What boot devices are supported by MIMX8SL1AVNFZBAR?
MIMX8SL1AVNFZBAR supports boot from FlexSPI-connected NOR/NAND flash, eMMC 5.1, SD 3.0, and raw NAND (ONFI 3.2/Toggle mode) via GPMI. Boot mode is selected via dedicated GPIO pins (BOOT_MODE[1:0]) and configured in fuse bank 0; no external boot ROM is required due to on-chip boot ROM.
Does MIMX8SL1AVNFZBAR require external PMIC sequencing?
Yes, MIMX8SL1AVNFZBAR requires precise power sequencing managed by an external PMIC. The device specifies strict ramp rates and voltage order (e.g., VDD_SOC before VDD_MAIN, VDD_DDR before VDD_DDR_VDDQ) per Section 3.2.1 of the IMX8XLB0AEC datasheet; failure to meet these violates absolute maximum ratings and may cause boot failure or latent reliability issues.
MIMX8SL1AVNFZBAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-LFBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 388-LBGA (15x15)
- Additional Interfaces:
- -
MIMX8SL1AVNFZBAR FAQ
1.How can I place an order for MIMX8SL1AVNFZBAR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8SL1AVNFZBAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8SL1AVNFZBAR reliable?
The price and inventory of MIMX8SL1AVNFZBAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8SL1AVNFZBAR is usually 5 days.
3.What payment methods are accepted for MIMX8SL1AVNFZBAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8SL1AVNFZBAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8SL1AVNFZBAR?
MIMX8SL1AVNFZBAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8SL1AVNFZBAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8SL1AVNFZBAR?
For technical support, including MIMX8SL1AVNFZBAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8SL1AVNFZBAR requirements.
6.How does Aetrix verify that MIMX8SL1AVNFZBAR is sourced from the original manufacturer or authorized distributors?
All MIMX8SL1AVNFZBAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8SL1AVNFZBAR meets industry standards.
7.What is the process for return or replacement of MIMX8SL1AVNFZBAR?
All MIMX8SL1AVNFZBAR units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8SL1AVNFZBAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8SL1AVNFZBAR part is unused and in its original packaging.
Return procedure for MIMX8SL1AVNFZBAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMX8SL1AVNFZBAR Tags
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