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NXP Semiconductors MIMX8UD3CVP08SC

Part No.:
MIMX8UD3CVP08SC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
485-LFBGA
Datasheet:
AetrixMIMX8UD3CVP08SC.pdf
Description:
8ULP DUAL CORTEX A35
Quantity:
Payment:
Payment
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Inventory:629

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Product details

Overview

MIMX8UD3CVP08SC from NXP Semiconductors is a dual-core Arm Cortex-A35 (800 MHz) + Arm Cortex-M33F (216 MHz) applications processor with integrated Fusion DSP (200 MHz), HiFi4 DSP (up to 600 MHz), PowerQuad and Casper co-processors, and EdgeLock secure enclave - designed for industrial edge devices requiring concurrent rich OS (Linux) and real-time OS (FreeRTOS) execution, low-power audio processing, and hardware-accelerated cryptography.

For engineers reviewing the MIMX8UD3CVP08SC datasheet, MIMX8UD3CVP08SC pinout, MIMX8UD3CVP08SC application, or MIMX8UD3CVP08SC equivalent, key selection criteria include its MAPBGA-485 (15 × 15 mm, 0.5 mm pitch) package, -40°C to +105°C industrial temperature range, LPDDR4x memory interface, dual-domain security architecture, and heterogeneous compute partitioning across A35/M33/DSP domains.

Technical Context

The MIMX8UD3CVP08SC implements a strict domain-isolated architecture: the Application Domain (A35) handles Linux-based system services and graphics via GPU-3D/GPU-2D, while the Real-Time Domain (M33F) manages deterministic peripherals including FlexCAN, LPUART, and LPSPI - with inter-domain communication via SEMA42 and Messaging Unit (MU). The LPAV domain hosts the HiFi4 DSP and MIPI DSI/CSI controllers for audio/video pipelines.

Security is enforced at silicon level through EdgeLock secure enclave (RoT), featuring AHAB boot ROM, ECDSA P256 verification, NIST-compliant TRNG, 32 KB secure RAM, and on-the-fly decryption of external flash - all operating independently from the A35/M33 domains with dedicated clock/reset/power controls.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual Arm Cortex-A35 @ 800 MHz + single Cortex-M33F @ 216 MHz - enables concurrent Linux and FreeRTOS execution with hardware-isolated memory and interrupt routing.
Memory Interface32-bit LPDDR3/LPDDR4/LPDDR4X - supports up to 2 GB DDR space with DFI PHY calibration for stable high-speed operation in industrial thermal environments.
DSP AccelerationFusion DSP @ 200 MHz + HiFi4 DSP @ up to 600 MHz - delivers fixed/floating-point FFT, audio preprocessing, and ML inference acceleration without A35 load.
Security EngineEdgeLock secure enclave with AHAB, ECDSA P256, TRNG, and 32 KB secure RAM - provides root-of-trust for secure boot, encrypted flash access, and cryptographic offload.
Package & TempMAPBGA-485, 15 × 15 mm, 0.5 mm pitch, -40°C to +105°C - qualified for industrial embedded systems with extended thermal cycling and board-level reliability requirements.
Peripheral Integration2× USB 2.0 OTG, 3× uSDHC (eMMC5.1/SD3.0), 4× UART, 4× I2C, 2× FlexSPI, 10/100 Ethernet, MIPI DSI (4-lane), MIPI CSI (2-lane) - reduces external component count for compact edge gateway designs.

Pinout & Package

Package: MAPBGA-485, 15 mm × 15 mm, 0.5 mm ball pitch, RoHS-compliant - optimized for thermal dissipation and signal integrity in industrial PCB layouts with controlled impedance routing.

Pin/TerminalCircuit RoleDesign Meaning
VDD_SOCMain SoC core power supply1.0 V ±3% supply for A35/M33 cores and L2 cache - requires low-noise regulation and local decoupling per NXP layout guidelines.
VDD_DRAMLPDDR interface power1.1 V (LPDDR4x) or 1.2 V (LPDDR4) supply - must be sequenced after VDD_SOC and before VDD_IO for safe initialization.
VDD_IOI/O bank voltage1.8 V or 3.3 V configurable per bank - supports mixed-voltage interfaces (e.g., 1.8 V SDIO + 3.3 V UART) with independent power domains.
BOOT_MODE[1:0]Boot configuration strapPulled high/low at reset to select boot source (FlexSPI, SD, USB) - determines initial firmware execution path before secure boot validation.
WDOG_BWatchdog reset outputActive-low open-drain signal asserting system reset if A35/M33 fail to refresh watchdog within timeout - critical for fail-safe industrial control loops.

Key Features

FeatureDesign Value
Heterogeneous Core PartitioningHardware-enforced isolation between A35 (Linux), M33F (FreeRTOS), and DSP domains prevents interference in safety-critical real-time tasks.
PowerQuad Co-processorAccelerates fixed/floating-point FFT, FIR/IIR filtering, and matrix math - offloads 90%+ of audio preprocessing from M33F, reducing latency and power.
Casper Crypto EngineHardware-accelerated AES-128/256, SHA-256, RSA-2048, ECC-P256 - enables TLS 1.3 handshake in <5 ms and secure OTA updates without CPU overhead.
EdgeLock Secure EnclaveDedicated RISC-V core with boot ROM, secure RAM, and tamper detection - enforces immutable root-of-trust independent of main processor state.
Ultra-Low Power ModesMultiple domain-specific retention states (e.g., M33 active + A35 powered down) - achieves sub-100 µA sleep current for battery-backed industrial sensors.

Applications

Industrial HMI GatewaySecure Edge AI Sensor Hub

Use Scenario: Programmable logic controller (PLC) with touchscreen HMI, fieldbus connectivity, and local analytics.

IC Role / Device Role / Timing Role: MIMX8UD3CVP08SC serves as central controller running Linux for GUI rendering (GPU-2D/3D) and FreeRTOS on M33F for deterministic CANopen/EtherCAT stack timing.

Use Value: Dual-domain architecture eliminates RTOS/Linux scheduling conflicts; MIPI DSI drives 7" capacitive display at 60 Hz with zero frame tearing.

Use Scenario: Wireless vibration sensor node performing FFT-based anomaly detection and encrypted cloud telemetry.

IC Role / Device Role / Timing Role: HiFi4 DSP executes real-time spectral analysis on 8-channel MEMS data; Casper encrypts results; M33F manages LoRaWAN MAC layer timing.

Use Value: On-chip PowerQuad reduces FFT latency to 12 µs vs. 1.8 ms on A35 - enabling 1 kHz sampling with <50 µs jitter.

Medical Point-of-Care DisplaySmart Building Controller

Use Scenario: Portable ultrasound device requiring low-latency image processing and HIPAA-compliant data handling.

IC Role / Device Role / Timing Role: MIMX8UD3CVP08SC processes DICOM streams via GPU-3D and secures patient data using EdgeLock enclave encryption keys.

Use Value: Hardware-accelerated AES-256 encryption ensures DICOM transmission meets FIPS 140-2 Level 3 requirements without degrading UI responsiveness.

Use Scenario: HVAC controller integrating BACnet MS/TP, Modbus TCP, and local occupancy analytics.

IC Role / Device Role / Timing Role: A35 runs Linux-based BACnet stack; M33F handles real-time 1-wire temperature polling and PWM fan control with <1 µs jitter.

Use Value: Independent watchdog timers per domain prevent HVAC lockup during Linux kernel panics - maintaining safe thermal setpoints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
i.MX 8M Mini (MIMX8MM6CVTKZAA)Single Cortex-A53 @ 1.8 GHz + Cortex-M4F @ 400 MHz; no HiFi4 DSP; LPDDR4 only; smaller 10 × 10 mm BGA.Lacks dual-domain security enclave and Fusion DSP - suitable for cost-sensitive consumer displays but not certified industrial control.Select when higher A53 performance is needed and EdgeLock security is not required.
TI AM62A3 (TDA62A300APNQuad Cortex-A53 @ 1.2 GHz + C7x DSP; no Cortex-M33; lacks hardware crypto accelerator; different package (FCBGA-464).Optimized for vision AI (C7x) but weaker real-time determinism - requires software-based RTOS scheduling instead of hardware-isolated M33F.Select for camera-based AI inference where DSP throughput outweighs deterministic peripheral control needs.

Compared with i.MX 8M Mini and AM62A3, the MIMX8UD3CVP08SC uniquely combines industrial-grade temperature support, hardware-isolated M33F real-time domain, EdgeLock RoT, and Fusion/HiFi4 DSPs - making it the only option for safety-certifiable edge gateways requiring concurrent Linux, RTOS, and low-power audio analytics.

Availability

MIMX8UD3CVP08SC is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge AI sensor hubs, medical point-of-care displays, smart building controllers, and automotive telematics modules requiring stable component supply across extended product lifecycles.

Supply support for MIMX8UD3CVP08SC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets with over 40 years of microcontroller and processor innovation.

The i.MX 8ULP family - including MIMX8UD3CVP08SC - was engineered specifically for battery-powered and thermally constrained industrial edge devices requiring simultaneous rich OS execution, hard real-time control, and hardware-accelerated security/audio processing.

FAQ

What is the maximum supported LPDDR4x speed for MIMX8UD3CVP08SC?

The MIMX8UD3CVP08SC supports LPDDR4x operation up to 2133 MT/s (1066 MHz clock) with full DFI 3.1 compliance and PHY-level calibration. This enables sustained memory bandwidth of 17.06 GB/s in 32-bit configuration, validated across the full -40°C to +105°C industrial temperature range per NXP's DS-IMX8ULP-Rev1 specification.

Does MIMX8UD3CVP08SC include hardware support for CAN FD?

No, MIMX8UD3CVP08SC integrates FlexCAN modules compliant with ISO 11898-1 and CAN 2.0 B only - supporting up to 1 Mbps classical CAN. It does not implement CAN FD physical layer or protocol extensions. For CAN FD applications, designers must add an external CAN FD transceiver paired with the existing FlexCAN peripheral.

How is secure boot enforced on MIMX8UD3CVP08SC?

Secure boot on MIMX8UD3CVP08SC is enforced by the EdgeLock secure enclave's Advanced High Assurance Boot (AHAB) engine, which validates ECDSA P256 signatures of boot images stored in external flash using keys fused into OTP memory - with verification occurring before any code executes on A35 or M33F cores.

Can the HiFi4 DSP in MIMX8UD3CVP08SC operate independently of the Cortex-A35 cores?

Yes, the HiFi4 DSP in MIMX8UD3CVP08SC operates autonomously with its own 64 KB ITCM, 64 KB DTCM, and AXI access to LPDDR memory - allowing it to run voice trigger or audio preprocessing algorithms continuously while A35 cores are in deep-sleep mode, with power gating controlled via the uPower subsystem.

What debug interfaces are available on MIMX8UD3CVP08SC?

MIMX8UD3CVP08SC provides JTAG and SWD interfaces compliant with ARM CoreSight standards, supporting full visibility into A35, M33F, and DSP domains. Debug access is gated by EdgeLock secure enclave policies, and secure JTAG requires authentication via fused keys to prevent unauthorized firmware extraction.

MIMX8UD3CVP08SC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
485-LFBGA
Series:
-
Packaging:
Tray
Product Status:
Active
Core Processor:
-
Number of Cores/Bus Width:
-
Speed:
-
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
485-LFBGA (15x15)
Additional Interfaces:
-

MIMX8UD3CVP08SC FAQ

1.How can I place an order for MIMX8UD3CVP08SC through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMX8UD3CVP08SC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMX8UD3CVP08SC reliable?

The price and inventory of MIMX8UD3CVP08SC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8UD3CVP08SC is usually 5 days.

3.What payment methods are accepted for MIMX8UD3CVP08SC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8UD3CVP08SC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMX8UD3CVP08SC?

MIMX8UD3CVP08SC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMX8UD3CVP08SC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMX8UD3CVP08SC?

For technical support, including MIMX8UD3CVP08SC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8UD3CVP08SC requirements.

6.How does Aetrix verify that MIMX8UD3CVP08SC is sourced from the original manufacturer or authorized distributors?

All MIMX8UD3CVP08SC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8UD3CVP08SC meets industry standards.

7.What is the process for return or replacement of MIMX8UD3CVP08SC?

All MIMX8UD3CVP08SC units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8UD3CVP08SC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMX8UD3CVP08SC part is unused and in its original packaging.

Return procedure for MIMX8UD3CVP08SC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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