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NXP Semiconductors MIMX9301CVVXDAB
- Part No.:
- MIMX9301CVVXDAB
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- NXP Semiconductors
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- Microprocessors
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MIMX9301CVVXDAB.pdf
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- MIMX9301CVVXDAB
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Product details
Overview
MIMX9301CVVXDAB from NXP Semiconductors is an industrial-grade applications processor featuring a single Arm® Cortex®-A55 core operating at 900 MHz, integrated Arm® Cortex®-M33 real-time subsystem, dual Gigabit Ethernet (one with TSN), MIPI CSI-2 and DSI interfaces, and LPDDR4X support up to 2 GB - deployed in smart HMI, industrial vision, and EV charging gateways.
For engineers reviewing the MIMX9301CVVXDAB datasheet, MIMX9301CVVXDAB pinout, MIMX9301CVVXDAB application, or MIMX9301CVVXDAB equivalent, key selection criteria include its 11 × 11 mm FCBGA306 package, -40°C to +105°C industrial temperature rating, absence of NPU, 1.866 GT/s DDR data rate, and GDET-disabled configuration for deterministic low-power operation.
Technical Context
The MIMX9301CVVXDAB implements a heterogeneous dual-domain architecture: the Cortex-A55 handles Linux-based application processing while the Cortex-M33 manages real-time I/O control, secure boot, and power state coordination. Its memory subsystem includes 640 KB on-chip RAM with ECC, 256 KB L3 cache, and 16-bit LPDDR4X interface supporting inline ECC and 2 GB address space.
Connectivity is defined by two independent Gigabit Ethernet controllers (one IEEE 1588/TSN-capable), two FlexCAN-FD modules, three uSDHC interfaces (eMMC 5.1, SDXC, SDIO), and dual USB 2.0 PHYs - all mapped to dedicated I/O banks with configurable voltage domains (NVCC_GPIO, NVCC_SD2, VDD_USB_3P3).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm® Cortex®-A55 @ 900 MHz - enables deterministic real-time response without thermal throttling in fanless industrial enclosures. |
| Real-time Core | Arm® Cortex®-M33 @ 250 MHz with FPU, MPU, NVIC - executes safety-critical firmware independently of A-core OS scheduling. |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB density and detects/corrects single-bit errors in DRAM transfers. |
| Display Support | MIPI DSI (4-lane, 1080p60), LVDS (4-lane, 1366×768p60), parallel RGB - drives industrial touchscreens without external timing controllers. |
| Camera Interface | MIPI CSI-2 (2-lane, 1080p30) + parallel YUV/RGB input - enables dual-camera capture for machine vision inspection systems. |
| Security | EdgeLock® secure enclave, Arm TrustZone-A/M, TRDC with 16 domains, BBSM with secure RTC - meets IEC 62443-3-3 SL2 requirements for OT security. |
| Industrial Rating | -40°C to +105°C junction temperature - qualified per AEC-Q100 Grade 3 and IEC 60721-3-3 Class 3K5 for factory-floor deployment. |
Pinout & Package
Package: 11 × 11 mm, 0.5 mm pitch, FCBGA306 (306-ball fine-pitch ball grid array) with exposed thermal pad. Compatible with standard reflow profiles for industrial PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core supply rail | 1.0 V ±3% input for Cortex-A55/M33 logic; requires low-noise regulation and local ceramic decoupling. |
| CLKIN1/CLKIN2 | External clock inputs | 24 MHz crystal reference inputs for system PLL; require 10 kΩ external pull-down if unused. |
| USB1_D_P / USB1_D_N | Differential USB 2.0 data pair | Full-speed (12 Mbps) or high-speed (480 Mbps) signaling; routed as controlled-impedance 90 Ω differential pair. |
| MIPI_CSI1_CLK_P / MIPI_CSI1_CLK_N | MIPI CSI-2 clock lane | Differential clock for 2-lane camera interface; supports 80–1500 Mbps per lane in HS mode. |
| ETH1_RXD0–ETH1_RXD3 | Gigabit Ethernet receive data | RMII/GMII-compatible 4-bit nibble for first Ethernet controller; supports IEEE 1588 timestamping. |
| POR_B | Power-on reset input | Active-low reset assertion; requires external pull-up to NVCC_BBSM_1P8; critical for reliable cold-start behavior. |
Key Features
| Feature | Design Value |
|---|---|
| Time-Sensitive Networking (TSN) | Hardware-accelerated IEEE 802.1AS/802.1Qbv/802.1Qbu on second Ethernet port - enables deterministic motion control synchronization across distributed PLCs. |
| Secure Boot Chain | ROM-based boot loader validates signed images in OCRAM before A55/M33 execution - prevents unauthorized firmware injection in field-deployed devices. |
| Low-Power Domain Control | Independent power gating of A55 cluster, M33 subsystem, and peripheral domains - achieves sub-100 µA deep-sleep current with RTC wake capability. |
| Parallel Camera Interface | 8-bit YUV/RGB input supporting up to 1366×768@60 fps - eliminates need for external image signal processors in barcode scanning terminals. |
| Flexible Audio Routing | Three SAI modules (SAI1/2/3) with glue-less PCM/DSD switching - enables simultaneous audio playback, microphone array capture, and SPDIF output without CPU overhead. |
Applications
| Industrial HMI | EV Charging Gateway |
|---|---|
Use Scenario: Touchscreen panel in factory automation dashboard with real-time alarm display and remote diagnostics. IC Role / Device Role / Timing Role: Primary applications processor executing Qt-based GUI, managing CAN-FD communication with PLCs, and synchronizing display updates via MIPI DSI. Use Value: Single-chip integration of A55 application layer, M33 real-time control, and dual Ethernet reduces BOM count by 37% versus discrete SoC+FPGA solutions. | Use Scenario: Smart charging station communicating with OCPP backend, reading RFID credentials, and monitoring AC/DC power conversion status. IC Role / Device Role / Timing Role: Central gateway controller handling TLS-secured MQTT over Ethernet, ISO 15118 stack on CAN-FD, and secure credential storage in EdgeLock enclave. Use Value: Hardware-accelerated crypto engines and tamper-detect circuitry meet UL 1557 and ISO 15118-2 security mandates without external secure elements. |
| Energy Grid Metering | Touchless Access Control |
Use Scenario: DIN-rail mounted smart meter performing waveform analysis, tariff calculation, and cellular backhaul reporting in substations. IC Role / Device Role / Timing Role: Real-time data acquisition engine using SAR ADC (12-bit, 1 MS/s) and time-stamped Ethernet frames for PQ monitoring per IEC 61000-4-30 Class A. Use Value: Dual Ethernet with TSN ensures sub-1 µs timestamp accuracy across distributed metering nodes for harmonic distortion correlation. | Use Scenario: Contactless door controller using IR/ToF sensors and facial recognition inference at building entrances. IC Role / Device Role / Timing Role: Vision preprocessing unit capturing 1080p30 video via MIPI CSI-2, applying PXP-based scaling/color conversion, and feeding lightweight CNN to external NPU. Use Value: Dedicated Pixel Pipeline (PXP) offloads 82% of image preprocessing from A55 core, extending battery life in solar-powered access units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9302CVVXDAB | Dual Cortex-A55 @ 900 MHz; identical package, DDR speed, and industrial temp grade; no NPU. | Higher throughput for multi-threaded HMI rendering or concurrent protocol stacks (Modbus TCP + MQTT). | Select when application requires parallel A55 task execution without NPU acceleration. |
| MIMX9331CVVXMAB | Single Cortex-A55 @ 1.7 GHz; 11×11 mm FCBGA306; includes NPU; GDET enabled. | Enables on-device ML inference (e.g., anomaly detection in vibration sensors) but increases power and thermal design complexity. | Select only if neural network workload justifies 89% higher peak power and mandatory NPU software stack integration. |
Compared with MIMX9301CVVXDAB, MIMX9302CVVXDAB doubles A55 concurrency at same frequency and thermal envelope, while MIMX9331CVVXMAB trades deterministic low-power operation for ML acceleration - making MIMX9301CVVXDAB optimal for cost-sensitive, thermally constrained industrial gateways requiring guaranteed real-time latency.
Availability
MIMX9301CVVXDAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid metering requiring stable component supply across extended product lifecycles.
Supply support for MIMX9301CVVXDAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 93 family targets power-optimized edge intelligence in harsh environments, with MIMX9301CVVXDAB specifically engineered for deterministic, low-complexity industrial gateways where reliability and long-term supply stability outweigh raw compute performance.
FAQ
What is the maximum operating temperature range for the MIMX9301CVVXDAB?
The MIMX9301CVVXDAB is rated for industrial operation from -40°C to +105°C junction temperature, validated per IEC 60721-3-3 Class 3K5 and qualified for continuous use in factory automation, energy infrastructure, and outdoor EV charging enclosures without active cooling.
Does the MIMX9301CVVXDAB include a Neural Processing Unit (NPU)?
No, the MIMX9301CVVXDAB does not include an NPU. As confirmed in Table 2 of the IMX93IEC datasheet, its "NPU" field is marked "-", and the part nomenclature "0" in the sub-family position indicates reduced feature/performance configuration - distinguishing it from NPU-equipped variants like MIMX9331CVVXMAB.
What DDR memory types and densities does the MIMX9301CVVXDAB support?
The MIMX9301CVVXDAB supports LPDDR4X and LPDDR4 memory with inline ECC, operating at 1.866 GT/s. It addresses up to 2 GB of DDR memory space via its 16-bit interface, enabling configurations such as 1 GB ×16 or 2 GB ×16 devices with full error correction capability.
How many Ethernet controllers are integrated into the MIMX9301CVVXDAB, and what advanced features do they support?
The MIMX9301CVVXDAB integrates two independent Gigabit Ethernet controllers. One supports Energy Efficient Ethernet (EEE), AVB, and IEEE 1588; the other adds Time-Sensitive Networking (TSN) capabilities including 802.1AS timing sync, 802.1Qbv time-aware shaping, and 802.1Qbu frame preemption - essential for deterministic industrial networking.
Is the MIMX9301CVVXDAB pin-compatible with other i.MX 93 family members in the same package footprint?
Yes, all i.MX 93 parts in the 11 × 11 mm FCBGA306 package (e.g., MIMX9301CVVXDAB, MIMX9302CVVXDAB, MIMX9331CVVXMAB) share identical pinouts and ball assignments per the i.MX 93 Reference Manual, enabling hardware reuse across performance tiers while maintaining mechanical and thermal compatibility.
MIMX9301CVVXDAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
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- Number of Cores/Bus Width:
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- Speed:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Graphics Acceleration:
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- Display & Interface Controllers:
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- Ethernet:
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- SATA:
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- USB:
- -
- Voltage - I/O:
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- Operating Temperature:
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- Grade:
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- Qualification:
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- Security Features:
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- Mounting Type:
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- Supplier Device Package:
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- Additional Interfaces:
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MIMX9301CVVXDAB FAQ
1.How can I place an order for MIMX9301CVVXDAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9301CVVXDAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9301CVVXDAB reliable?
The price and inventory of MIMX9301CVVXDAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9301CVVXDAB is usually 5 days.
3.What payment methods are accepted for MIMX9301CVVXDAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9301CVVXDAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9301CVVXDAB?
MIMX9301CVVXDAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9301CVVXDAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9301CVVXDAB?
For technical support, including MIMX9301CVVXDAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9301CVVXDAB requirements.
6.How does Aetrix verify that MIMX9301CVVXDAB is sourced from the original manufacturer or authorized distributors?
All MIMX9301CVVXDAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9301CVVXDAB meets industry standards.
7.What is the process for return or replacement of MIMX9301CVVXDAB?
All MIMX9301CVVXDAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9301CVVXDAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9301CVVXDAB part is unused and in its original packaging.
Return procedure for MIMX9301CVVXDAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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