NXP Semiconductors MIMX9302CVVXDAB

Overview

MIMX9302CVVXDAB from NXP Semiconductors is an industrial-grade dual-core Arm® Cortex®-A55 applications processor operating at 900 MHz, integrated with a Cortex®-M33 real-time co-processor (250 MHz), dual Gigabit Ethernet controllers (one with TSN support), MIPI CSI-2/DSI interfaces, and LPDDR4X memory interface - designed for touchless HMI, industrial vision, and EV charging gateways requiring deterministic low-power operation.

For engineers reviewing the MIMX9302CVVXDAB datasheet, MIMX9302CVVXDAB pinout, MIMX9302CVVXDAB application, or MIMX9302CVVXDAB equivalent, key selection criteria include its 11 × 11 mm FCBGA306 package, industrial temperature range (–40°C to +105°C), absence of NPU, 1.866 GT/s DDR data rate, and dual-A55 + M33 heterogeneous architecture for concurrent high-level OS and real-time control tasks.

Technical Context

The MIMX9302CVVXDAB implements a tightly coupled dual-Cortex-A55 cluster with per-core 32 KB L1 instruction/data caches, 64 KB L2 cache, and shared 256 KB L3 cache with ECC protection - all running at 900 MHz. Its Cortex-M33 subsystem operates at 250 MHz with 256 KB TCM, MPU, NVIC, and FPU support, enabling autonomous wake-up monitoring and safety-critical firmware execution independent of the A55 domain.

Memory subsystem includes 16-bit LPDDR4X/LPDDR4 interface with inline ECC (up to 2 GB), three uSDHC controllers (eMMC 5.1, SDXC, SDIO), and FlexSPI supporting XIP from Octal/Quad SPI NOR/NAND flash. Connectivity integrates two FlexCAN-FD modules, two I3C, eight LPUARTs (up to 5 Mbps), and dual GbE with IEEE 1588, AVB, and TSN timing capabilities.

Key Specifications

Pinout & Package

Package: 306-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA), 11 mm × 11 mm, 0.5 mm ball pitch, 1.15 mm height (JEDEC MO-275). Thermal pad on underside requires solder paste stencil opening and thermal via array per NXP AN12237.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MIMX9302CVVXDAB, MIMX9332CVVXMAB delivers 89% higher CPU performance and NPU inference capability but increases peak power by ~2.2 W; the i.MX 8M Mini offers lower cost and smaller footprint but omits TSN, MIPI, and industrial temperature qualification - making MIMX9302CVVXDAB optimal for balanced industrial gateway designs requiring deterministic timing and compact form factor.

Availability

MIMX9302CVVXDAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid edge nodes requiring stable component supply across extended product lifecycles and rigorous environmental qualification.

Supply support for MIMX9302CVVXDAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based applications processors and edge AI.

The i.MX 93 family - including MIMX9302CVVXDAB - was engineered specifically for power-constrained industrial edge devices requiring real-time responsiveness, functional safety, and robust security without sacrificing Linux application capability.

FAQ

What is the maximum operating frequency of the Cortex-A55 cores in the MIMX9302CVVXDAB?

The MIMX9302CVVXDAB features dual Arm® Cortex®-A55 processors operating at a maximum frequency of 900 MHz. This is confirmed in Table 2 of the i.MX 93 Industrial Data Sheet (IMX93IEC Rev. 8), where the "Max speed" column for MIMX9302CVVXDAB is explicitly listed as "900 MHz". The reduced frequency versus higher-tier variants (e.g., 1.7 GHz) reflects its optimized balance of performance, power, and thermal envelope for industrial gateway use cases.

Does the MIMX9302CVVXDAB include a Neural Processing Unit (NPU)?

No, the MIMX9302CVVXDAB does not include an NPU. As stated in Table 2 of the IMX93IEC datasheet, the "NPU" field for this part number is marked "-", indicating absence. This distinguishes it from variants like MIMX9352CVVXMAB which list "NPU" in that column. The MIMX9302CVVXDAB relies on CPU-based inference or optional external accelerators for machine learning workloads.

What package type and dimensions does the MIMX9302CVVXDAB use?

The MIMX9302CVVXDAB uses a 306-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) package measuring 11 mm × 11 mm with 0.5 mm ball pitch. This is specified in the "Package" column of Table 2 (IMX93IEC Rev. 8) and confirmed in Figure 1's nomenclature breakdown where "VV" denotes "11 x 11 mm, 0.5 mm pitch, FCBGA306". The thermal pad on the underside requires specific PCB layout per NXP AN12237.

What is the industrial temperature range supported by the MIMX9302CVVXDAB?

The MIMX9302CVVXDAB is rated for industrial temperature operation from –40°C to +105°C junction temperature. This is indicated by the "C" in its part number (MIMX9302C...), which - per Figure 1 and Section 1.1 of IMX93IEC - designates compliance with the i.MX 93 Industrial Products Data Sheet (IMX93IEC) and qualification across the full industrial thermal envelope.

Which Ethernet features are supported by the MIMX9302CVVXDAB?

The MIMX9302CVVXDAB integrates two Gigabit Ethernet controllers: one supports Energy Efficient Ethernet (EEE), Audio Video Bridging (AVB), and IEEE 1588; the second adds Time-Sensitive Networking (TSN) capabilities - including IEEE 802.1AS (time sync), 802.1Qbv (time-aware shaper), and 802.1Qci (per-stream filtering) - as documented in Table 1 and Section 1.1 of the IMX93IEC datasheet.