NXP Semiconductors MIMX9311CVXXMAB
- Part No.:
- MIMX9311CVXXMAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- -
- Datasheet:
-
MIMX9311CVXXMAB.pdf
- Description:
- MIMX9311CVXXMAB
- Quantity:
- Payment:

- Shipping:

Inventory:1,460
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIMX9311CVXXMAB from NXP Semiconductors is an industrial-grade Arm® Cortex®-A55 single-core applications processor operating at 1.7 GHz, integrated with a Cortex®-M33 real-time core (250 MHz), dual Gigabit Ethernet (one with TSN), parallel camera and display interfaces, and 3.2 GT/s LPDDR4X support in a 9 × 9 mm FCBGA208 package. It targets touchless HMI, EV charging control, and industrial automation gateways requiring deterministic low-power operation.
For engineers reviewing the MIMX9311CVXXMAB datasheet, MIMX9311CVXXMAB pinout, MIMX9311CVXXMAB application, or MIMX9311CVXXMAB equivalent, key selection criteria include its single A55 core configuration, industrial temperature range (−40°C to +105°C), absence of NPU, parallel-only imaging/display I/O, and 9 mm × 9 mm FCBGA208 footprint-critical for space-constrained embedded edge designs.
Technical Context
The MIMX9311CVXXMAB implements a heterogeneous dual-domain architecture: the Cortex-A55 domain handles Linux-based application processing and multimedia tasks, while the Cortex-M33 domain manages real-time control, power state coordination, and peripheral offload. Its memory subsystem includes 640 KB on-chip RAM with ECC, 256 KB cluster L3 cache, and a 16-bit LPDDR4X interface supporting inline ECC up to 2 GB.
Connectivity is centered on deterministic industrial I/O: one Gigabit Ethernet controller with IEEE 1588/AVB/EEE, one USB 2.0 host/device PHY, eight LPUARTs (up to 5 Mbps), two FlexCAN modules (CAN-FD capable), and dual I3C buses. Imaging and display are served exclusively via parallel interfaces-no MIPI CSI/DSI-enabling cost-optimized camera and LCD integration without high-speed SerDes complexity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm® Cortex®-A55 @ 1.7 GHz - delivers Linux-capable application performance with low dynamic power |
| Real-time Core | Arm® Cortex®-M33 @ 250 MHz - handles time-critical tasks, power management, and secure boot independently |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB DDR, enabling robust data integrity in industrial environments |
| Ethernet | Dual 1 Gbps controllers: one with TSN, AVB, IEEE 1588 - enables deterministic networking for synchronized industrial control |
| Imaging Interface | 8-bit parallel YUV/RGB camera input - simplifies integration with legacy or cost-sensitive image sensors without MIPI PHY overhead |
| Display Interface | Parallel RGB display output - drives standard industrial LCD panels directly, eliminating need for bridge ICs |
| Package | FCBGA208, 9 × 9 mm, 0.5 mm pitch - compact footprint suitable for dense industrial PCB layouts |
| Temperature Grade | Industrial: −40°C to +105°C junction - qualified for uncontrolled ambient deployments in factory and energy infrastructure |
Pinout & Package
Package: 9 × 9 mm, 0.5 mm pitch Fine-Pitch Ball Grid Array (FCBGA208) with 208 solder balls. Thermal pad on underside for enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core supply rail | 1.0 V ± 3% nominal; powers Cortex-A55/M33 cores and L1/L2 caches - requires tight regulation and local decoupling |
| NVCC_GPIO | GPIO I/O supply | 1.8 V / 3.3 V configurable bank supply - sets logic levels for all general-purpose digital I/Os |
| CLKIN1/CLKIN2 | External clock inputs | 24 MHz system reference clock inputs; no internal pull-up/down - external 10 kΩ pull-down required if unused |
| ONOFF | Power control signal | Active-low hardware power toggle: brief GND pulse initiates ON/OFF transitions; long pulse forces forced OFF |
| POR_B | Power-on reset input | Asynchronous reset input; requires external 10 kΩ pull-up to NVCC_BBSM_1P8 - critical for reliable cold-start sequencing |
| XTALI_24M / XTALO_24M | 24 MHz crystal oscillator interface | Must use 24 MHz crystal (not oscillator); strict jitter/tolerance specs apply when used for USB timing |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone-A/M security | Hardware-enforced isolation between A55 and M33 domains, enabling secure firmware updates and trusted execution environments |
| EdgeLock® secure enclave | On-die tamper-resistant security subsystem managing cryptographic keys, secure boot, and runtime attestation |
| Flexible power domain partitioning | Independent gating of A55, M33, and peripheral blocks allows granular power states - essential for battery-backed industrial nodes |
| Parallel camera + display I/O | Dedicated 8-bit YUV/RGB input and RGB output buses eliminate need for external video bridges, reducing BOM and layout complexity |
| Industrial connectivity suite | Two CAN-FD controllers, dual Ethernet (one TSN), eight LPUARTs, and dual I3C - meets fieldbus and gateway requirements without add-on ICs |
Applications
| Industrial HMI | EV Charging Station Control |
|---|---|
Use Scenario: Touchless gesture-based operator interface in factory floor HMIs with glove-compatible operation. IC Role / Device Role / Timing Role: MIMX9311CVXXMAB serves as main application processor running Linux UI stack and real-time M33 co-processor handling sensor fusion and safety monitoring. Use Value: Parallel display interface drives 1280×800p60 LCD directly; TSN Ethernet synchronizes with PLC networks; industrial temp grade ensures reliability in unconditioned environments. | Use Scenario: Smart AC/DC charging station controller managing power delivery, user authentication, grid communication, and thermal monitoring. IC Role / Device Role / Timing Role: MIMX9311CVXXMAB executes OCPP stack over TSN Ethernet, runs local billing logic, and coordinates CAN-FD communication with EVSE power modules. Use Value: Dual Ethernet enables isolated LAN (user interface) and TSN-enabled grid interface; 12-bit SAR ADC monitors temperature/voltage; industrial qualification supports outdoor enclosure deployment. |
| Energy Meter Data Aggregator | Industrial Vision Sensor Node |
Use Scenario: Edge node collecting and preprocessing metering data from multiple smart meters before upstream transmission. IC Role / Device Role / Timing Role: MIMX9311CVXXMAB acts as protocol gateway translating Modbus RTU over RS-485 to MQTT over Ethernet, with M33 handling time-stamped sampling. Use Value: Eight LPUARTs support daisy-chained meter interfaces; IEEE 1588 timestamping ensures synchronized data capture across distributed nodes. | Use Scenario: Compact vision inspection unit for barcode reading or defect detection on production lines using fixed-focus CMOS sensors. IC Role / Device Role / Timing Role: MIMX9311CVXXMAB processes images via CPU-accelerated NEON instructions and runs lightweight ML inference on Cortex-M33 for real-time pass/fail decisions. Use Value: Parallel camera interface accepts 200 MPixel/s input; PXP graphics engine performs hardware-accelerated scaling/color conversion; low-power M33 core maintains always-on trigger detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9312CVXXMAB | Dual Cortex-A55 cores (1.7 GHz), same package and I/O - adds 2× CPU throughput but higher power draw | Suitable for multi-threaded Linux workloads (e.g., containerized edge analytics) where single-core latency is insufficient | Select MIMX9312CVXXMAB only when parallel task execution justifies increased thermal and power budget |
| MIMX9321CVXXMAB | Includes Neural Processing Unit (NPU), same core count and package - adds 1 TOPS AI inference capability | Required for on-device neural network inference (e.g., anomaly detection, predictive maintenance) not feasible on MIMX9311CVXXMAB's CPU alone | Choose MIMX9321CVXXMAB when ML model execution is mandatory and NPU acceleration provides measurable latency/power benefit |
Compared with MIMX9311CVXXMAB, MIMX9312CVXXMAB offers scalable compute headroom for concurrent services, while MIMX9321CVXXMAB introduces dedicated AI acceleration-neither provides pin-to-pin compatibility, and both require board-level validation due to differing power delivery and thermal design needs.
Availability
MIMX9311CVXXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging control, and energy infrastructure applications requiring stable component supply across extended product lifecycles.
Supply support for MIMX9311CVXXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications.
The i.MX 93 family-including MIMX9311CVXXMAB-is designed specifically for power-optimized, secure edge intelligence in industrial and building automation systems where functional safety, long-term availability, and deterministic real-time response are mandatory.
FAQ
What is the maximum operating frequency of the Cortex-A55 core in the MIMX9311CVXXMAB?
The Cortex-A55 core in the MIMX9311CVXXMAB operates at a maximum frequency of 1.7 GHz. This speed is guaranteed across the full industrial temperature range (−40°C to +105°C) and under specified voltage and cooling conditions per the IMX93IEC datasheet Rev. 8. The MIMX9311CVXXMAB does not support dynamic frequency scaling beyond this rated maximum, and sustained operation at 1.7 GHz requires adherence to thermal design guidelines including proper PCB copper pour and heatsinking.
Does the MIMX9311CVXXMAB include a Neural Processing Unit (NPU)?
No, the MIMX9311CVXXMAB does not include a Neural Processing Unit. Per Table 2 of the IMX93IEC datasheet, the "NPU" column for MIMX9311CVXXMAB is marked "-", indicating absence. NPU functionality is present only in variants such as MIMX9321CVXXMAB and above. For AI inference on MIMX9311CVXXMAB, developers must rely on CPU-based NEON acceleration or offload to external accelerators.
What display and camera interfaces are supported by the MIMX9311CVXXMAB?
The MIMX9311CVXXMAB supports only parallel interfaces: an 8-bit parallel YUV/RGB camera input and a parallel RGB display output. It lacks MIPI CSI-2 and MIPI DSI physical layers entirely. Supported resolutions include up to 1366×768p60 for display and up to 200 MPixel/s pixel rate for camera input. These interfaces are optimized for cost-sensitive industrial displays and fixed-focus CMOS sensors without high-speed SerDes complexity.
What is the package type and ball count of the MIMX9311CVXXMAB?
The MIMX9311CVXXMAB uses a 9 × 9 mm Fine-Pitch Ball Grid Array (FCBGA) package with 208 solder balls and 0.5 mm pitch. This is explicitly confirmed in Table 2 of the IMX93IEC datasheet under the "Package" column and in Figure 1's nomenclature breakdown ("VX" = 9 × 9 mm, FCBGA208). The package includes an exposed thermal pad on the underside for thermal management in industrial enclosures.
Which Ethernet features are implemented in the MIMX9311CVXXMAB?
The MIMX9311CVXXMAB integrates two Gigabit Ethernet controllers: one supports Energy Efficient Ethernet (EEE), Audio Video Bridging (AVB), and IEEE 1588 Precision Time Protocol; the second adds Time-Sensitive Networking (TSN) capabilities on top of those features. Both controllers operate simultaneously and are fully independent, enabling segregated traffic domains-for example, one for HMI web services and one for deterministic control messaging-without software arbitration overhead.
MIMX9311CVXXMAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Additional Interfaces:
- -
MIMX9311CVXXMAB FAQ
1.How can I place an order for MIMX9311CVXXMAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9311CVXXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9311CVXXMAB reliable?
The price and inventory of MIMX9311CVXXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9311CVXXMAB is usually 5 days.
3.What payment methods are accepted for MIMX9311CVXXMAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9311CVXXMAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9311CVXXMAB?
MIMX9311CVXXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9311CVXXMAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9311CVXXMAB?
For technical support, including MIMX9311CVXXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9311CVXXMAB requirements.
6.How does Aetrix verify that MIMX9311CVXXMAB is sourced from the original manufacturer or authorized distributors?
All MIMX9311CVXXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9311CVXXMAB meets industry standards.
7.What is the process for return or replacement of MIMX9311CVXXMAB?
All MIMX9311CVXXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9311CVXXMAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9311CVXXMAB part is unused and in its original packaging.
Return procedure for MIMX9311CVXXMAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMX9311CVXXMAB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

