NXP Semiconductors MIMX9322CVXXMAB

Overview

MIMX9322CVXXMAB from NXP Semiconductors is a dual-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with an 8-bit/16-bit integer NPU for ML inference, a Cortex®-M33 real-time core (250 MHz), and industrial-grade (-40°C to +105°C) qualification. It supports parallel camera and display interfaces, single Gigabit Ethernet with TSN capability, USB 2.0, and LPDDR4X memory (3.2 GT/s) in a compact 9 × 9 mm FCBGA208 package - deployed in industrial HMI, energy metering, and touchless access control systems.

For engineers reviewing the MIMX9322CVXXMAB datasheet, MIMX9322CVXXMAB pinout, MIMX9322CVXXMAB application, or MIMX9322CVXXMAB equivalent, key selection criteria include its dual-A55+NPU architecture, industrial temperature rating, parallel interface support (not MIPI), single-GbE+TSN connectivity, and 9 mm × 9 mm FCBGA208 footprint for space-constrained embedded gateways and edge controllers.

Technical Context

The MIMX9322CVXXMAB implements a heterogeneous compute architecture: two Cortex-A55 cores (1.7 GHz, 64 KB L2 cache per core, 256 KB cluster L3 cache with ECC) coexist with a dedicated Cortex-M33 (250 MHz, 256 KB TCM, FPU/MPU/NVIC) for deterministic real-time tasks. Its NPU delivers fixed-point neural network acceleration optimized for 8-bit weights and RNN workloads.

Power management leverages domain partitioning with internal switches and a battery-backed security module (BBSM) enabling secure RTC and tamper detection. Connectivity includes one Gigabit Ethernet controller with IEEE 1588/AVB/TSN support, one USB 2.0 PHY, three uSDHC interfaces (eMMC 5.1/SDXC/SDIO), and eight LPUARTs - all routed through a centralized IOMUXC with GPIO interrupt capability.

Key Specifications

Pinout & Package

Package: 208-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 9 mm × 9 mm, 0.5 mm ball pitch, 0.8 mm maximum height. Thermal pad on underside requires solder paste stencil opening per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MIMX9322CVXXMAB, MIMX9321CVXXMAB reduces core count but retains full NPU functionality for AI edge inference in smaller-footprint designs, while MIMX9312CVXXMAB removes the NPU entirely to serve deterministic real-time control applications without machine learning overhead.

Availability

MIMX9322CVXXMAB is available at Aetrix Electronics and suitable for industrial human-machine interface, energy metering, and touchless access control applications requiring stable component supply across extended product lifecycles.

Supply support for MIMX9322CVXXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, IoT, and communication infrastructure markets.

The i.MX 93 family - including MIMX9322CVXXMAB - was designed for power-optimized, secure edge intelligence in industrial and building automation, delivering heterogeneous compute (A55+M33+NPU), TSN networking, and hardware-enforced security for mission-critical deployments.

FAQ

What is the maximum operating frequency of the Cortex-A55 cores in the MIMX9322CVXXMAB?

The MIMX9322CVXXMAB features two Arm Cortex-A55 application processor cores rated for operation up to 1.7 GHz. This frequency is guaranteed across the full industrial temperature range (-40°C to +105°C) and supported by the on-die PLLs and thermal management architecture documented in the i.MX 93 Applications Processors Data Sheet for Industrial Products (IMX93IEC). The MIMX9322CVXXMAB achieves this performance while maintaining power efficiency through dynamic voltage and frequency scaling (DVFS) controlled by the integrated power management unit.

Does the MIMX9322CVXXMAB include a Neural Processing Unit (NPU), and what precision does it support?

Yes, the MIMX9322CVXXMAB integrates a dedicated Neural Processing Unit (NPU) capable of 256 MAC operations per cycle at up to 1.0 GHz, delivering up to 512 GOPS peak performance. It is optimized for 8-bit integer and 16-bit integer RNN inference workloads, supporting 8-bit weight tensors and fixed-point activation quantization - as confirmed in Table 1 of the IMX93IEC datasheet. The MIMX9322CVXXMAB NPU operates independently of the A55 and M33 cores, enabling concurrent AI inference and application processing.

What display and camera interfaces are supported by the MIMX9322CVXXMAB?

The MIMX9322CVXXMAB supports parallel RGB/YUV camera input and parallel RGB display output - explicitly excluding MIPI CSI-2 and MIPI DSI interfaces per Table 2 of the IMX93IEC datasheet. It drives displays up to 1366×768p60 or 1280×800p60 via its LCDIF controller and accepts camera sensors with programmable resolutions up to 2K and pixel rates up to 200 MPixel/s. This parallel interface configuration simplifies design for cost-sensitive industrial panels and legacy scanner modules.

What Ethernet capabilities does the MIMX9322CVXXMAB provide, and is Time-Sensitive Networking (TSN) supported?

The MIMX9322CVXXMAB integrates two Gigabit Ethernet controllers, but only one is implemented in this variant - supporting IEEE 1588 Precision Time Protocol, Audio Video Bridging (AVB), and full Time-Sensitive Networking (TSN) features including time-aware shapers and frame preemption. This single TSN-capable Ethernet port enables deterministic packet scheduling for industrial control loops and synchronized gateway traffic, as specified in Section 1.1 and Table 2 of the IMX93IEC datasheet. The MIMX9322CVXXMAB does not include the second GbE controller found in higher-tier i.MX 93 variants.

What is the package type and thermal performance of the MIMX9322CVXXMAB?

The MIMX9322CVXXMAB uses a 208-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA) package measuring 9 mm × 9 mm with 0.5 mm ball pitch. Its thermal resistance is characterized as RθJA = 23.5°C/W (Junction-to-Ambient, JEDEC JESD51-9 2s2p board), RθJC = 5.2°C/W (Junction-to-Case), and ΨJT = 0.1°C/W (Junction-to-Top). These values are validated for industrial temperature operation and published in Table 12 of the IMX93IEC datasheet, confirming suitability for convection-cooled industrial enclosures.