NXP Semiconductors MIMX9331CVTXMAB

Overview

MIMX9331CVTXMAB from NXP Semiconductors is an industrial-grade dual-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with a Cortex®-M33 real-time core (250 MHz), dual Gigabit Ethernet controllers (one with TSN), and MIPI CSI-2/DSI interfaces - deployed in industrial HMI, EV charging stations, and touchless access control systems.

For engineers reviewing the MIMX9331CVTXMAB datasheet, MIMX9331CVTXMAB pinout, MIMX9331CVTXMAB application, or MIMX9331CVTXMAB equivalent, this page delivers verified technical context, package mapping, validated alternatives, and design-critical specifications including LPDDR4X support, 12-bit SAR ADC, CAN-FD, and EdgeLock® secure enclave - all confirmed for the industrial temperature grade (–40°C to +105°C) and 14 × 14 mm FCBGA306 package.

Technical Context

The MIMX9331CVTXMAB implements a heterogeneous compute architecture: two Cortex-A55 cores (1.7 GHz, 64 KB L2 cache per core, 256 KB cluster L3 cache with ECC) handle high-level OS and application tasks, while the Cortex-M33 (250 MHz, 256 KB TCM, MPU/FPU/NVIC) manages real-time I/O, power state coordination, and security boot supervision. Both domains share unified CoreSight™ debug infrastructure and cross-triggering capability.

Its connectivity stack includes two FlexCAN modules (CAN-FD capable), two GbE controllers (one IEEE 1588/TSN-compliant), eight LPUARTs (up to 5 Mbps), and three uSDHC interfaces supporting eMMC 5.1, SDXC, and SDIO - all routed through a centralized IOMUXC with GPIO interrupt support and flexible pad control.

Key Specifications

Pinout & Package

Package: 14 × 14 mm, 0.65 mm pitch, FCBGA306 - thermally optimized for industrial ambient (–40°C to +105°C) with R_θJA = 21.7°C/W (JESD51-9, 2s2p board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MIMX9331CVTXMAB, MIMX9332CVTXMAC provides fault-tolerant real-time control via dual M33 isolation, while MIMX9351CVTXMAC adds AI acceleration - both retain identical industrial temperature rating, 14×14 mm FCBGA306 footprint, and TSN/Ethernet AVB compatibility, enabling reuse of thermal and mechanical design.

Availability

MIMX9331CVTXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid equipment requiring stable component supply across extended product lifecycles and rigorous environmental qualification.

Supply support for MIMX9331CVTXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, connected, and intelligent edge solutions for automotive, industrial, and IoT markets.

The i.MX 93 family - including MIMX9331CVTXMAB - was designed specifically for industrial edge gateways and human-machine interfaces demanding real-time responsiveness, hardware-enforced security, and multi-protocol connectivity under harsh thermal conditions.

FAQ

What is the maximum operating temperature range for the MIMX9331CVTXMAB?

The MIMX9331CVTXMAB is qualified for industrial operation from –40°C to +105°C junction temperature, as defined in the IMX93IEC data sheet. This rating applies to the full functional specification including dual Cortex-A55 at 1.7 GHz, TSN Ethernet, and MIPI interfaces - validated across process corners and voltage extremes within this range.

Does the MIMX9331CVTXMAB include a Neural Processing Unit (NPU)?

No, the MIMX9331CVTXMAB does not include an NPU. Per Table 2 in the IMX93IEC data sheet, the "31" sub-family (e.g., MIMX9331CVTXMAB) is explicitly designated as NPU-disabled, distinguishing it from "32", "51", and "52" variants which integrate the 256-MAC NPU. Machine learning workloads must be executed on the Cortex-A55 cores or offloaded externally.

What package type and pin count does the MIMX9331CVTXMAB use?

The MIMX9331CVTXMAB uses a 14 × 14 mm, 0.65 mm pitch, FCBGA306 package - confirmed in Table 2 of the IMX93IEC data sheet and Figure 1's nomenclature guide ("VT" suffix). It has 306 solder balls with defined signal/power/ground assignments documented in the i.MX 93 Reference Manual (IMX93RM) package information section.

Which Ethernet features are supported on the MIMX9331CVTXMAB's dual GbE controllers?

The MIMX9331CVTXMAB integrates two Gigabit Ethernet controllers: one supports Energy Efficient Ethernet (EEE), Audio Video Bridging (AVB), and IEEE 1588 precision time protocol; the second adds Time-Sensitive Networking (TSN) capabilities including 802.1AS (time sync), 802.1Qbv (time-aware shaper), and 802.1Qci (per-stream filtering) - all implemented in hardware for deterministic latency.

How is security implemented on the MIMX9331CVTXMAB?

Security on the MIMX9331CVTXMAB is implemented via EdgeLock® secure enclave, Arm TrustZone® for both A55 (TrustZone-A) and M33 (TrustZone-M), Trusted Resource Domain Controller (TRDC) with 16 configurable domains, Battery Backed Security Module (BBSM) with secure RTC, and tamper detection circuitry - enabling secure boot, runtime attestation, and isolated execution environments without external security ICs.