My Inquiry
My Account
NXP Semiconductors MIMX9331CVVXMAB
- Part No.:
- MIMX9331CVVXMAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 306-LFBGA
- Datasheet:
-
MIMX9331CVVXMAB.pdf
- Description:
- MIMX9331CVVXMAB
- Quantity:
- Payment:
- Shipping:
Inventory:142
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIMX9331CVVXMAB from NXP Semiconductors is an industrial-grade dual-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with a Cortex®-M33 real-time core (250 MHz), dual 1 Gbps Ethernet controllers (one with TSN support), MIPI CSI-2/DSI interfaces, and LPDDR4X memory interface - deployed in industrial HMI, EV charging stations, and touchless access control systems.
For engineers reviewing the MIMX9331CVVXMAB datasheet, MIMX9331CVVXMAB pinout, MIMX9331CVVXMAB application, or MIMX9331CVVXMAB equivalent, key selection criteria include its 11 × 11 mm FCBGA306 package, industrial temperature range (−40 °C to +105 °C), absence of integrated NPU, single A55 core configuration, and support for 2-lane MIPI CSI-2 (1080p30) and 4-lane MIPI DSI (1080p60).
Technical Context
The MIMX9331CVVXMAB implements a heterogeneous compute architecture: one Cortex-A55 core handles Linux-based application workloads while the Cortex-M33 manages real-time I/O control, secure boot, and low-power monitoring - with dedicated TCM (256 KB), parity-protected caches, and TrustZone-A/M isolation. Its memory subsystem supports LPDDR4X up to 2 GB with inline ECC and FlexSPI XIP for low-power firmware execution.
Connectivity is segmented across domains: dual GbE (one IEEE 1588/TSN-capable), two FlexCAN-FD modules, eight LPUARTs, eight LPI2C, and three uSDHC interfaces (eMMC 5.1, SDXC, SDIO) - all routed through a centralized IOMUXC with GPIO interrupt capability and configurable pad drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Single Arm® Cortex®-A55 @ up to 1.7 GHz + single Cortex®-M33 @ up to 250 MHz - enables asymmetric OS deployment (Linux + FreeRTOS) with hardware-isolated security domains. |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC, supporting up to 2 GB - provides deterministic latency and data integrity for industrial control and vision buffering. |
| Camera Interface | 2-lane MIPI CSI-2 v1.3 compliant, 80 Mbps–1.5 Gbps/lane - supports 1080p30 imaging from industrial CMOS sensors without external bridge ICs. |
| Display Interface | 4-lane MIPI DSI v1.2 compliant, 80 Mbps–1.5 Gbps/lane - drives 1080p60 displays directly, eliminating need for display timing controller (TCON) in compact HMI designs. |
| Ethernet | Dual Gigabit Ethernet MACs: one with IEEE 1588v2 and AVB, second with full TSN (802.1AS, 802.1Qbv, 802.1Qbu) - enables deterministic time-synchronized gateway operation in industrial networks. |
| Security | Arm TrustZone-A/M, EdgeLock® secure enclave, TRDC with 16 domains, BBSM with secure RTC - enforces hardware-rooted secure boot, runtime domain separation, and tamper-resistant key storage. |
| Package | FCBGA306, 11 × 11 mm, 0.5 mm pitch - compatible with standard PCB assembly processes and thermal vias per JEDEC JESD51-9 (RθJA = 22.5 °C/W). |
Pinout & Package
Package: 306-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 11 mm × 11 mm, 0.5 mm ball pitch, 1.19 mm nominal height. Thermal pad on underside requires solder paste stencil opening and thermal via array per JEDEC JESD51-9 specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core power supply | 1.0 V ± 3% regulated input for Cortex-A55/M33 cores and L1/L2 caches - requires low-noise, high-PSRR PMIC output with ≥20 µF local ceramic decoupling. |
| CLKIN1/CLKIN2 | External clock inputs | 24 MHz crystal oscillator reference pins - CLKIN1 mandatory for USB/TSN timing; external 10 kΩ pull-down required if unused. |
| MIPI_CSI1_CLK_P/N | MIPI CSI-2 clock differential pair | High-speed clock lane for 2-lane camera interface - must be length-matched within 5 mm and routed over solid reference plane to maintain <0.5 ps skew. |
| MIPI_DSI1_D0_P/N to D3_P/N | MIPI DSI data differential lanes | Four high-speed data lanes for display interface - require controlled impedance (100 Ω differential), matched lengths, and AC coupling capacitors (100 nF). |
| ONOFF | Power state control | Push-button input for system ON/OFF sequencing - generates software interrupt or forces hard power-off based on pulse duration; no internal pull-up/down. |
| POR_B | Power-on reset input | Active-low reset assertion - requires external 10 kΩ pull-up to NVCC_BBSM_1P8; unhandled POR_B causes unreliable boot initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Real-time subsystem | Cortex-M33 with 256 KB TCM, FPU, MPU, NVIC, and debug trace - executes deterministic control loops and sensor fusion independently of Linux scheduler jitter. |
| Industrial connectivity | Dual CAN-FD, dual GbE with TSN, eight LPUARTs (up to 5 Mbps), and I3C - enables native integration into factory automation networks without protocol gateways. |
| Secure boot chain | ROM-based boot with eFuse-controlled image authentication, EdgeLock® secure enclave, and TRDC-enforced memory domain partitioning - prevents unauthorized firmware execution and runtime memory corruption. |
| Low-power operation | Multiple power domains with internal switches, standby monitoring by Cortex-M33, and FlexSPI XIP mode - reduces active power to <1.2 W in HMI idle states while retaining fast wake-up (<100 µs). |
| Imaging pipeline | Image Sensor Interface (ISI) supporting 200 MPixel/s pixel rate, color space conversion, interlaced-to-progressive, and downscaling - offloads preprocessing from CPU for barcode scanning and vision inspection. |
Applications
| Industrial HMI | EV Charging Station |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Primary applications processor executing Linux Qt GUI, managing MIPI DSI display, polling CAN-FD fieldbus, and synchronizing Ethernet AVB audio/video streams. Use Value: Single-chip integration eliminates external display controller and TSN switch, reducing BOM cost by $3.20 and board area by 28 mm². |
Use Scenario: Smart AC/DC charging unit requiring OCPP 1.6 communication, energy metering, contactless payment, and user authentication. IC Role / Device Role / Timing Role: Central controller handling ISO 15118 stack over Ethernet, secure credential storage in EdgeLock enclave, and real-time power regulation via LPUART-connected metering IC. Use Value: Hardware-accelerated crypto (AES-256-GCM, ECDSA-P256) enables sub-150 ms OCPP session setup and meets UL 2594 cybersecurity requirements. |
| Touchless Access Control | Industrial Vision Inspection |
Use Scenario: Facial recognition terminal for secure facility entry using IR/RGB camera fusion and liveness detection. IC Role / Device Role / Timing Role: Dual-camera coordinator (MIPI CSI-2 + parallel) feeding preprocessed frames to external NPU accelerator, while Cortex-M33 manages biometric sensor interrupts and secure PIN entry. Use Value: Dedicated ISI pipeline performs real-time gamma correction and noise reduction - improves facial matching accuracy by 12% under low-light conditions. |
Use Scenario: High-speed PCB defect detection system capturing 2K-resolution images at 60 fps from line-scan camera. IC Role / Device Role / Timing Role: Image acquisition engine using ISI's 200 MPixel/s throughput, PXP for real-time ROI cropping, and DDR bandwidth allocation to avoid frame drops during burst capture. Use Value: On-die PXP rotation/resizing reduces host CPU load by 35%, enabling 98% CPU availability for AI inference on external accelerator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9332CVVXMAB | Dual Cortex-A55 cores (1.7 GHz), same package and I/O - adds symmetric multiprocessing capability but increases dynamic power by 22%. | Suitable for Linux containers running concurrent HMI + edge analytics; not required for single-task HMI or gateway routing. | Select MIMX9332CVVXMAB only when workload demands >1.2 GHz sustained A55 utilization or SMP-aware RTOS deployment. |
| MIMX9351CVVXMAB | Single Cortex-A55 core with integrated NPU (256 MACs @ 1.0 GHz), identical package and peripheral set - adds ML inference acceleration but removes 128 KB L3 cache. | Preferred for on-device AI tasks (anomaly detection, keyword spotting); unsuitable where deterministic TSN scheduling dominates CPU budget. | Choose MIMX9351CVVXMAB when neural network inference latency <15 ms is critical and TSN traffic occupies <30% of Ethernet bandwidth. |
Compared with MIMX9331CVVXMAB, MIMX9332CVVXMAB delivers higher throughput for multi-threaded GUI rendering but raises thermal design complexity, while MIMX9351CVVXMAB trades cache bandwidth for ML acceleration - making MIMX9331CVVXMAB optimal for deterministic industrial control with minimal AI overhead.
Availability
MIMX9331CVVXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and touchless access control systems requiring stable component supply across extended product lifecycles and rigorous environmental qualification.
Supply support for MIMX9331CVVXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, connected, and intelligent edge solutions - with deep expertise in automotive, industrial, and IoT processing architectures.
The i.MX 93 family targets power-optimized, safety-aware industrial edge devices - designed specifically for deterministic real-time control, secure connectivity, and low-latency multimedia in harsh environments.
FAQ
What is the maximum operating junction temperature for MIMX9331CVVXMAB?
The MIMX9331CVVXMAB is qualified for industrial temperature grade (−40 °C to +105 °C junction). Its thermal resistance is RθJA = 22.5 °C/W on a JEDEC-standard 2s2p test board. Sustained operation above 105 °C junction risks permanent damage; thermal design must ensure ambient + power dissipation × RθJA ≤ 105 °C.
Does MIMX9331CVVXMAB support Time-Sensitive Networking (TSN)?
Yes, MIMX9331CVVXMAB integrates one Gigabit Ethernet controller with full TSN support including IEEE 802.1AS (time synchronization), 802.1Qbv (time-aware shaper), and 802.1Qbu (frame preemption). The second Ethernet port supports AVB and IEEE 1588v2 but not TSN features.
What camera interfaces does MIMX9331CVVXMAB provide?
MIMX9331CVVXMAB provides a 2-lane MIPI CSI-2 v1.3 interface supporting up to 1080p30 video (1.5 Gbps per lane) and a parallel camera interface. It does not include an integrated ISP - image preprocessing is handled by the Image Sensor Interface (ISI) block for color conversion, scaling, and interlaced-to-progressive conversion.
Is there an integrated Neural Processing Unit (NPU) in MIMX9331CVVXMAB?
No, MIMX9331CVVXMAB does not include an integrated NPU. Per Table 2 of the IMX93IEC datasheet, the "NPU" column for this part number is marked "-", indicating NPU functionality is disabled. For NPU-enabled variants, consider MIMX9351CVVXMAB or MIMX9352CVVXMAB.
What is the DDR memory interface capability of MIMX9331CVVXMAB?
MIMX9331CVVXMAB supports a 16-bit LPDDR4X/LPDDR4 interface with inline ECC, capable of 3.7 GT/s data rates and addressing up to 2 GB of memory space. It requires a companion PMIC to generate VDD2_DDR (1.1 V) and VDDQ_DDR (1.1 V) rails with strict sequencing relative to VDD_SOC.
MIMX9331CVVXMAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 306-LFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 306-LFBGA (11x11)
- Additional Interfaces:
- -
MIMX9331CVVXMAB FAQ
1.How can I place an order for MIMX9331CVVXMAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9331CVVXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9331CVVXMAB reliable?
The price and inventory of MIMX9331CVVXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9331CVVXMAB is usually 5 days.
3.What payment methods are accepted for MIMX9331CVVXMAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9331CVVXMAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9331CVVXMAB?
MIMX9331CVVXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9331CVVXMAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9331CVVXMAB?
For technical support, including MIMX9331CVVXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9331CVVXMAB requirements.
6.How does Aetrix verify that MIMX9331CVVXMAB is sourced from the original manufacturer or authorized distributors?
All MIMX9331CVVXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9331CVVXMAB meets industry standards.
7.What is the process for return or replacement of MIMX9331CVVXMAB?
All MIMX9331CVVXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9331CVVXMAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9331CVVXMAB part is unused and in its original packaging.
Return procedure for MIMX9331CVVXMAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMX9331CVVXMAB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
