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NXP Semiconductors MIMX9331XVTXMAB
- Part No.:
- MIMX9331XVTXMAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 306-LFBGA, FCBGA
- Datasheet:
-
MIMX9331XVTXMAB.pdf
- Description:
- MIMX9331XVTXMAB
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MIMX9331XVTXMAB from NXP Semiconductors is a single-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with a Cortex®-M33 real-time co-processor (250 MHz), dual Gigabit Ethernet controllers (one with TSN), MIPI CSI-2 and DSI interfaces, and LPDDR4X support - designed for extended industrial HMI, vision, and edge gateway applications requiring -40°C to +125°C operation.
For engineers reviewing the MIMX9331XVTXMAB datasheet, MIMX9331XVTXMAB pinout, MIMX9331XVTXMAB application, or MIMX9331XVTXMAB equivalent, key selection criteria include its 14 × 14 mm FCBGA306 package, extended temperature qualification, dual-GbE with TSN, MIPI camera/display support, and secure boot via EdgeLock® enclave.
Technical Context
The MIMX9331XVTXMAB implements a heterogeneous compute architecture: one Cortex-A55 core handles Linux-based application workloads, while the Cortex-M33 manages real-time I/O control, power state coordination, and security monitor duties. Its memory subsystem includes 640 KB on-chip RAM with ECC, 256 KB L3 cache, and a 16-bit LPDDR4X interface supporting up to 2 GB with inline ECC.
Connectivity is segmented across dedicated domains: two FlexCAN-FD modules enable robust automotive/industrial networking; two Ethernet controllers operate simultaneously - one with IEEE 1588/AVB/EEE, the other adding Time-Sensitive Networking; and three uSDHC interfaces support eMMC 5.1, SDXC, and SDIO 3.0 with up to 400 MB/s throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm® Cortex®-A55 @ up to 1.7 GHz - delivers Linux-capable application processing with NEON/FPU acceleration |
| Real-time Core | Arm® Cortex®-M33 @ up to 250 MHz - handles deterministic I/O, low-power monitoring, and secure boot enforcement |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB DRAM with error correction for system reliability |
| Ethernet | Dual 1 Gbps controllers - one with TSN, AVB, IEEE 1588, EEE; enables time-critical gateway and industrial control traffic |
| Camera Interface | 2-lane MIPI CSI-2 v1.3 - supports up to 1080p30 video input at 1.5 Gbps/lane for machine vision and scanning |
| Display Interface | 4-lane MIPI DSI v1.2 - drives displays up to 1080p60 with 24-bit RGB pixel format and 140 Mpixel/s active rate |
| Package | FCBGA306, 14 × 14 mm, 0.65 mm pitch - optimized for thermal dissipation in extended industrial environments |
| Operating Temp | -40°C to +125°C junction - qualified per i.MX 93 Extended Industrial specification (IMX93XEC) |
Pinout & Package
Package: 14 × 14 mm, 0.65 mm pitch, 306-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA306) with thermal pad. Designed for high-density PCB layouts and enhanced thermal performance in extended temperature environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core supply rail | 1.0 V ±5% nominal; powers Cortex-A55/M33 cores, caches, and system logic - requires tight regulation and local decoupling |
| XTALI_24M / XTALO_24M | Primary system clock input | 24 MHz crystal oscillator reference - mandatory for USB, Ethernet, and system timing; no external oscillator substitution permitted |
| MIPI_CSI1_CLK_P/N | MIPI CSI-2 clock differential pair | High-speed clock lane for 2-lane camera interface - supports 80 Mbps–1.5 Gbps/lane; requires controlled impedance routing |
| MIPI_DSI1_D0_P/N to D3_P/N | MIPI DSI data lanes | Four high-speed differential data lanes - enable 1080p60 display output with 24-bit RGB; require matched trace lengths |
| ENET1_RXD0–3 / TXD0–3 | Gigabit Ethernet PHY interface | RMII/RGMII-compatible digital interface for first Ethernet controller - supports TSN-aware packet scheduling and timestamping |
| FLEXCAN1_TX / RX | CAN-FD transceiver interface | Differential CAN bus signals - support flexible data-rate up to 5 Mbps for industrial control networks and EV charging communication |
| USB1_D_P / D_N | USB 2.0 differential data pair | Full-speed/High-speed USB 2.0 interface - requires 90 Ω differential impedance and ESD protection per USB-IF compliance |
Key Features
| Feature | Design Value |
|---|---|
| EdgeLock® Secure Enclave | Hardware-isolated security domain managing cryptographic operations, secure boot, key storage, and tamper detection - eliminates need for external secure element in certified designs |
| Time-Sensitive Networking (TSN) | IEEE 802.1AS/1Qbv/1Qci support in second Ethernet controller - enables deterministic latency < 100 µs for synchronized industrial motion control and PLC gateways |
| MIPI CSI-2 + DSI Coexistence | Simultaneous 2-lane camera input and 4-lane display output - allows embedded vision HMI with real-time video overlay and touchless UI rendering |
| LPDDR4X with Inline ECC | 16-bit interface with on-the-fly error correction - prevents silent data corruption in long-life industrial deployments without software overhead |
| Extended Temperature Qualification | Validated operation from -40°C to +125°C junction - meets EN 50155 and IEC 61373 requirements for rail, energy, and factory automation equipment |
| Flexible Power Domain Partitioning | Independent power gating for A55, M33, and peripheral domains - enables sub-100 µA deep-sleep states while retaining RTC and wake-up interrupt capability |
Applications
| Industrial HMI | Smart Energy Metering |
|---|---|
Use Scenario: Touchless access panels and programmable logic controller (PLC) operator interfaces deployed in factory environments with ambient temperatures up to 125°C. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based UI framework, driving MIPI DSI display, and managing capacitive touch over I3C while coordinating real-time I/O via Cortex-M33. Use Value: Eliminates external graphics controller and FPGA-based timing logic by integrating PXP image composition, LCDIF display controller, and TSN-synchronized event logging. | Use Scenario: DIN-rail mounted electricity meters with waveform capture, tariff calculation, and secure remote firmware updates over cellular or Ethernet. IC Role / Device Role / Timing Role: System-on-chip host managing SAR ADC sampling (12-bit, 1 MS/s), encrypted data storage, secure boot validation, and IEEE 1588 time-stamped metering logs. Use Value: Reduces BOM count by consolidating metrology processing, secure communications, and display driving into a single die with hardware-accelerated crypto and ECC-protected memory. |
| EV Charging Station Control | Industrial Vision Gateway |
Use Scenario: UL-certified Level 2 AC charging stations requiring ISO 15118 plug-and-charge negotiation, OCPP 1.6/2.0 connectivity, and local load balancing. IC Role / Device Role / Timing Role: Dual-network host processor running Linux for OCPP stack and web services, while Cortex-M33 handles CAN-FD communication with EVSE controller and real-time safety monitoring. Use Value: Enables concurrent high-level protocol handling and hard real-time CAN messaging without RTOS co-location - critical for UL 2594 and IEC 62196 compliance. | Use Scenario: Barcode/QR code scanning terminals in automated warehouses using 2D imaging sensors and AI-assisted decoding at the edge. IC Role / Device Role / Timing Role: Vision pipeline orchestrator accepting MIPI CSI-2 video, performing hardware-accelerated image resize/color conversion via PXP, and feeding processed frames to Linux-based inference engine. Use Value: Offloads 70% of CPU-bound preprocessing (decimation, YUV→RGB, rotation) from Cortex-A55 - preserves bandwidth for neural network inference on external NPU or CPU. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9331XVVXMAB | Same core configuration (1×A55 + M33), identical feature set, but in 11×11 mm FCBGA306 package - lower thermal resistance (RθJA = 22.5°C/W vs. 21.7°C/W) and smaller footprint | Suitable for space-constrained designs where thermal margin exceeds 1.0°C/W requirement; lacks extended thermal qualification margin of VT variant | Select MIMX9331XVVXMAB when board area is critical and ambient temperature remains ≤105°C; choose MIMX9331XVTXMAB for full -40°C to +125°C operation in sealed enclosures. |
| MIMX9332XVTXMAC | Dual Cortex-A55 cores (1.7 GHz), same package and temperature grade - adds symmetric multiprocessing capability and 2× L2 cache (64 KB/core), but no NPU | Required for multi-threaded Linux workloads (e.g., containerized edge analytics, dual-display UI + telemetry), where single-core throughput is insufficient | Choose MIMX9332XVTXMAC when application demands parallel task execution or higher sustained throughput; MIMX9331XVTXMAB remains optimal for cost-sensitive, single-threaded HMI or metering. |
Compared with MIMX9331XVVXMAB, the MIMX9331XVTXMAB provides 20°C higher maximum junction temperature and larger thermal pad area - enabling reliable operation in convection-cooled industrial enclosures. Against MIMX9332XVTXMAC, it trades core count for lower power and cost while retaining identical peripheral sets and security features.
Availability
MIMX9331XVTXMAB is available at Aetrix Electronics and suitable for industrial HMI, smart energy metering, EV charging station control, and industrial vision gateway applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MIMX9331XVTXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, connected, and intelligent edge solutions for automotive, industrial, IoT, and communication infrastructure markets.
The i.MX 93 family - including MIMX9331XVTXMAB - was engineered for extended industrial edge applications demanding functional safety, real-time responsiveness, hardware-enforced security, and operation across -40°C to +125°C ambient conditions.
FAQ
What is the maximum operating temperature specification for the MIMX9331XVTXMAB?
The MIMX9331XVTXMAB is qualified for extended industrial operation with a junction temperature range of -40°C to +125°C, as defined in the i.MX 93 Applications Processors Data Sheet for Extended Industrial Products (IMX93XEC). This rating applies to the silicon die itself and requires appropriate PCB thermal design - including thermal vias under the package and copper pour - to maintain safe operation at maximum ambient conditions.
Does the MIMX9331XVTXMAB include a Neural Processing Unit (NPU)?
No, the MIMX9331XVTXMAB does not include an integrated Neural Processing Unit. Per Table 2 of the IMX93XEC datasheet, this part number is designated with "-" under the NPU column, confirming NPU functionality is disabled. For NPU-enabled variants, consider MIMX9352XVVXMBB or MIMX9351XVVXMBB, which explicitly list "NPU Enabled" in their ordering information.
Which memory types and capacities are supported by the MIMX9331XVTXMAB?
The MIMX9331XVTXMAB supports 16-bit LPDDR4X and LPDDR4 memory with inline ECC, enabling up to 2 GB of external DRAM. It also integrates 640 KB of on-chip RAM (OCRAM) with ECC protection, 256 KB cluster L3 cache, and dedicated TCM for the Cortex-M33. The memory controller complies with JEDEC JESD209-4B standards and requires precise layout adherence for signal integrity.
Can the MIMX9331XVTXMAB support both MIPI CSI-2 camera input and MIPI DSI display output simultaneously?
Yes, the MIMX9331XVTXMAB supports concurrent MIPI CSI-2 (2-lane, up to 1080p30) and MIPI DSI (4-lane, up to 1080p60) operation. This capability is confirmed in Table 2 of the IMX93XEC datasheet under Camera and Display columns, and enabled by independent physical PHY layers and dedicated DMA channels - allowing real-time vision-based HMI with overlay graphics without CPU intervention.
What security features are implemented in the MIMX9331XVTXMAB?
The MIMX9331XVTXMAB integrates EdgeLock® secure enclave, Arm TrustZone-A/M, Trusted Resource Domain Controller (TRDC), on-chip RAM secure region protection, Battery Backed Security Module (BBSM) with secure RTC, and hardware-accelerated crypto engines. These features collectively enable secure boot, encrypted firmware updates, isolated execution environments, and tamper-resistant key storage - meeting IEC 62443-3-3 SL2 requirements for industrial systems.
MIMX9331XVTXMAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 306-LFBGA, FCBGA
- Series:
- i.MX 93
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 250MHz, 1.7GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- GBE (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 306-FCBGA (14x14)
- Additional Interfaces:
- CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
MIMX9331XVTXMAB FAQ
1.How can I place an order for MIMX9331XVTXMAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9331XVTXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9331XVTXMAB reliable?
The price and inventory of MIMX9331XVTXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9331XVTXMAB is usually 5 days.
3.What payment methods are accepted for MIMX9331XVTXMAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9331XVTXMAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9331XVTXMAB?
MIMX9331XVTXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9331XVTXMAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9331XVTXMAB?
For technical support, including MIMX9331XVTXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9331XVTXMAB requirements.
6.How does Aetrix verify that MIMX9331XVTXMAB is sourced from the original manufacturer or authorized distributors?
All MIMX9331XVTXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9331XVTXMAB meets industry standards.
7.What is the process for return or replacement of MIMX9331XVTXMAB?
All MIMX9331XVTXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9331XVTXMAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9331XVTXMAB part is unused and in its original packaging.
Return procedure for MIMX9331XVTXMAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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