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NXP Semiconductors MIMX9332CVTXMAB
- Part No.:
- MIMX9332CVTXMAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 306-LFBGA, FCBGA
- Datasheet:
-
MIMX9332CVTXMAB.pdf
- Description:
- MIMX9332CVTXMAB
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MIMX9332CVTXMAB from NXP Semiconductors is an industrial-grade dual-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with a Cortex®-M33 real-time core (250 MHz), dual 1 Gbps Ethernet controllers (one with TSN support), and MIPI CSI-2/DSI interfaces - deployed in industrial HMI, vision systems, and EV charging gateways.
For engineers reviewing the MIMX9332CVTXMAB datasheet, MIMX9332CVTXMAB pinout, MIMX9332CVTXMAB application, or MIMX9332CVTXMAB equivalent, key selection criteria include its 14 × 14 mm FCBGA306 package, LPDDR4X support with inline ECC, industrial temperature range (–40°C to +105°C), and hardware security features including EdgeLock® secure enclave and Arm TrustZone®.
Technical Context
The MIMX9332CVTXMAB implements a heterogeneous compute architecture: dual Cortex-A55 cores handle high-level OS tasks and multimedia processing, while the Cortex-M33 manages real-time control, power state monitoring, and low-power domain coordination. Its memory subsystem includes 256 KB cluster L3 cache with ECC, 640 KB on-chip RAM, and a 16-bit LPDDR4X interface supporting up to 2 GB with inline ECC.
Connectivity is segmented across dedicated domains: two FlexCAN modules (CAN-FD capable), two Gigabit Ethernet MACs (one IEEE 1588/TSN-compliant), three uSDHC interfaces (eMMC 5.1, SDXC, SDIO), and eight LPUARTs - all managed via centralized IOMUXC and supported by hardware-accelerated security primitives including TRDC, BBSM, and tamper detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A55 @ up to 1.7 GHz + single Cortex-M33 @ up to 250 MHz - enables Linux/RTOS coexistence with deterministic real-time response. |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB DDR space with error correction for industrial reliability. |
| Ethernet | Dual 1 Gbps MACs: one with TSN/IEEE 1588, one with AVB/EEE - enables time-critical gateway and industrial control networking. |
| Camera & Display | 2-lane MIPI CSI-2 (up to 1080p30) + 4-lane MIPI DSI (up to 1080p60) - delivers low-latency imaging and high-resolution touch HMI. |
| Security | EdgeLock® secure enclave, Arm TrustZone-A/M, TRDC (16 domains), BBSM with secure RTC - meets industrial functional safety and data integrity requirements. |
| Package | FCBGA306, 14 × 14 mm, 0.65 mm pitch - optimized for thermal dissipation in sealed industrial enclosures. |
| Temperature Range | Industrial grade: –40°C to +105°C junction - qualified for continuous operation in factory automation and energy infrastructure. |
Pinout & Package
Package: 14 × 14 mm Fine-Pitch Chip Scale Ball Grid Array (FCBGA306) with 0.65 mm ball pitch and 306 I/O balls. Thermal pad on underside for enhanced heat transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core supply voltage rail | 1.0 V ± 3% nominal; powers Cortex-A55/M33 cores and L1/L2 caches - requires tight regulation and low-noise filtering. |
| CLKIN1/CLKIN2 | External clock input | 24 MHz reference input for system PLLs; no internal pull-up/down - external 10 kΩ pull-down required if unused. |
| USB1_D_P / USB1_D_N | USB 2.0 differential data pair | Full-speed USB 2.0 PHY interface; supports host/device mode - requires controlled impedance routing (90 Ω differential). |
| MIPI_CSI1_CLK_P / MIPI_CSI1_CLK_N | MIPI CSI-2 clock lane | Differential clock for 2-lane camera interface; supports 80 Mbps–1.5 Gbps HS rates - needs matched trace length and 100 Ω termination. |
| POR_B | Power-on reset input | Active-low asynchronous reset; requires external pull-up to NVCC_BBSM_1P8 - critical for deterministic boot initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Enclave | EdgeLock® secure enclave with isolated execution environment, cryptographic accelerators, and secure boot ROM - enables root-of-trust for firmware updates and credential storage. |
| Time-Sensitive Networking | Dedicated TSN-capable Ethernet controller with IEEE 802.1AS (gPTP), 802.1Qbv (time-aware shaper), and 802.1Qci (per-stream filtering) - supports deterministic motion control and synchronized sensor networks. |
| Real-Time Subsystem | Cortex-M33 with 256 KB TCM, FPU, MPU, NVIC, and DWT - runs bare-metal or FreeRTOS tasks independent of A55 Linux domain, enabling ultra-low-latency I/O handling. |
| Industrial Connectivity | Two FlexCAN FD modules (5 Mbps data phase), eight LPUARTs (up to 5 Mbps), and dual I3C controllers - provides native support for CAN-based machinery, serial field devices, and sensor hubs. |
| Imaging Pipeline | MIPI CSI-2 (2-lane, 1080p30), ISI with pixel rate up to 200 MP/s, PXP for alpha blending and rotation - enables embedded vision in barcode scanners and inspection systems without external ISP. |
Applications
| Industrial HMI | EV Charging Gateway |
|---|---|
|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based UI stack, managing LVDS/MIPI display output, and coordinating CAN-FD communication with drive inverters. Use Value: Dual Cortex-A55 cores deliver responsive GUI rendering while Cortex-M33 handles safety-critical watchdog supervision and emergency stop logic - eliminating need for separate microcontroller. |
Use Scenario: Smart AC/DC charging station controller aggregating metering data, grid communication (IEC 61850), and user authentication via NFC/QR. IC Role / Device Role / Timing Role: Central gateway SoC running real-time charging protocol stack (OCPP 2.0.1), managing dual Ethernet ports (one for utility backhaul, one for local LAN), and securing transactions via EdgeLock®. Use Value: Integrated TSN Ethernet ensures precise time synchronization across distributed charge points; hardware crypto accelerators enable fast TLS 1.3 handshakes without CPU overhead. |
| Industrial Vision System | Energy Grid Monitoring |
|
Use Scenario: Compact machine vision unit inspecting printed circuit boards using rolling shutter CMOS sensors and real-time defect classification. IC Role / Device Role / Timing Role: Image acquisition and preprocessing engine: MIPI CSI-2 ingests raw sensor data, ISI performs color conversion and downscaling, PXP composites overlay graphics before LCDIF drives MIPI DSI display. Use Value: On-die ISI and PXP offload image processing from CPU - reduces latency to <15 ms end-to-end and eliminates external video processor IC. |
Use Scenario: Substation intelligent electronic device (IED) monitoring transformer temperature, current harmonics, and breaker status via analog/digital inputs. IC Role / Device Role / Timing Role: Secure edge analytics node: SAR ADC samples analog sensor signals, Cortex-M33 executes protection algorithms, and TSN Ethernet synchronizes phasor measurement units (PMUs) across grid nodes. Use Value: Hardware TRDC partitions safety-critical protection logic (M33) from non-safety telemetry (A55), meeting IEC 62443-4-2 and IEC 61508 SIL-2 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9332CVVXMAB | Same dual-core A55/M33 architecture but in 11 × 11 mm FCBGA306 package; lower thermal resistance (RθJA = 22.5°C/W vs. 21.7°C/W) but reduced board-level heat spreading area. | Better suited for space-constrained designs where thermal mass is limited; lacks same PCB copper area for heatsinking as 14 × 14 mm variant. | Select MIMX9332CVVXMAB when board area is premium and ambient temperature remains ≤85°C; choose MIMX9332CVTXMAB for sustained 105°C operation with active airflow. |
| MIMX9352CVTXMAC | Five-core configuration (2×A55 + 3×M33), adds Neural Processing Unit (NPU), higher DDR bandwidth (3.7 GT/s), and extended peripheral set including additional uSDHC and SAI channels. | Targeted at AI-enhanced edge inference (e.g., anomaly detection in predictive maintenance), requiring >1 TOPS INT8 throughput not present in MIMX9332CVTXMAB. | Choose MIMX9352CVTXMAC only when NPU acceleration and extra real-time cores are required; MIMX9332CVTXMAB offers optimal cost/performance for deterministic control + HMI without ML workloads. |
Compared with MIMX9332CVVXMAB, the MIMX9332CVTXMAB provides superior thermal headroom in high-ambient environments due to larger package footprint and lower RθJC (5.4°C/W); versus MIMX9352CVTXMAC, it delivers identical industrial connectivity and security while reducing BOM cost and power envelope by omitting the NPU and third M33 core.
Availability
MIMX9332CVTXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid monitoring applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.
Supply support for MIMX9332CVTXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, connected, and intelligent edge solutions for automotive, industrial, IoT, and communications markets.
The i.MX 93 family - including MIMX9332CVTXMAB - was designed specifically for industrial edge applications demanding real-time responsiveness, hardware-enforced security, and robust connectivity across CAN-FD, TSN Ethernet, and MIPI interfaces.
FAQ
What is the maximum operating temperature specification for MIMX9332CVTXMAB?
MIMX9332CVTXMAB is rated for industrial temperature operation with a junction temperature range of –40°C to +105°C. This specification is validated per JEDEC JESD22-A104 and applies under defined power dissipation and PCB thermal design conditions - including use of the recommended 14 × 14 mm FCBGA306 package with thermal vias to inner ground planes.
Does MIMX9332CVTXMAB include a Neural Processing Unit (NPU)?
No, MIMX9332CVTXMAB does not integrate a Neural Processing Unit. Per Table 2 of the IMX93IEC datasheet, the "NPU" column for this part number is marked "-", indicating NPU functionality is disabled. NPU support is available only in i.MX 93 variants with part numbers containing "52" or "51" in the sub-family field (e.g., MIMX9352CVTXMAC).
Which DDR memory types are supported by MIMX9332CVTXMAB?
MIMX9332CVTXMAB supports LPDDR4X and LPDDR4 memory via its 16-bit DRAM interface, with mandatory inline ECC for error detection and correction. It does not support DDR4, DDR3, or legacy LPDDR3. Maximum supported density is 2 GB, and the interface operates at up to 3.7 GT/s effective data rate as specified in the industrial temperature grade timing tables.
What debug interfaces are available on MIMX9332CVTXMAB?
MIMX9332CVTXMAB provides Arm CoreSight™ debug and trace infrastructure supporting both 4-pin JTAG and Serial Wire Debug (SWD). It includes Embedded Trace FIFO (ETF) with 4 KB internal buffer and cross-triggering interface (CTI) for synchronized debugging across the dual Cortex-A55 and Cortex-M33 cores - accessible through standard NXP LPC-Link2 or SEGGER J-Link probes.
Is MIMX9332CVTXMAB pin-compatible with other i.MX 93 family members?
MIMX9332CVTXMAB uses the 14 × 14 mm FCBGA306 package (VT suffix), which shares the same ball map and mechanical footprint with other VT-package i.MX 93 parts such as MIMX9352CVTXMAC and MIMX9332CVTXMAC. However, electrical compatibility depends on feature enablement - e.g., NPU signals are no-connect on MIMX9332CVTXMAB but active on NPU-enabled variants - requiring schematic review before substitution.
MIMX9332CVTXMAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 306-LFBGA, FCBGA
- Series:
- i.MX 93
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2, 1 Core, 64-Bit
- Speed:
- 250MHz, 1.7GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- GBE (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 306-FCBGA (14x14)
- Additional Interfaces:
- CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
MIMX9332CVTXMAB FAQ
1.How can I place an order for MIMX9332CVTXMAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9332CVTXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9332CVTXMAB reliable?
The price and inventory of MIMX9332CVTXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9332CVTXMAB is usually 5 days.
3.What payment methods are accepted for MIMX9332CVTXMAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9332CVTXMAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9332CVTXMAB?
MIMX9332CVTXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9332CVTXMAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9332CVTXMAB?
For technical support, including MIMX9332CVTXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9332CVTXMAB requirements.
6.How does Aetrix verify that MIMX9332CVTXMAB is sourced from the original manufacturer or authorized distributors?
All MIMX9332CVTXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9332CVTXMAB meets industry standards.
7.What is the process for return or replacement of MIMX9332CVTXMAB?
All MIMX9332CVTXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9332CVTXMAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9332CVTXMAB part is unused and in its original packaging.
Return procedure for MIMX9332CVTXMAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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