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NXP Semiconductors MIMX9332XVTXMAB
- Part No.:
- MIMX9332XVTXMAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 306-LFBGA, FCBGA
- Datasheet:
-
MIMX9332XVTXMAB.pdf
- Description:
- MIMX9332XVTXMAB
- Quantity:
- Payment:
- Shipping:
Inventory:2,861
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Product details
Overview
MIMX9332XVTXMAB from NXP Semiconductors is a dual-core Arm® Cortex®-A55 applications processor operating at up to 1.7 GHz, integrated with a Cortex®-M33 real-time core (250 MHz), dual Gigabit Ethernet controllers (one with TSN support), and MIPI CSI-2/DSI interfaces - designed for industrial HMI, vision, and edge gateway applications requiring extended temperature operation (–40°C to +125°C).
For engineers reviewing the MIMX9332XVTXMAB datasheet, MIMX9332XVTXMAB pinout, MIMX9332XVTXMAB application, or MIMX9332XVTXMAB equivalent, this page delivers verified specifications, package mapping, thermal data, functional partitioning, and validated alternative options for industrial embedded design and long-lifecycle procurement.
Technical Context
The MIMX9332XVTXMAB implements a heterogeneous compute architecture: two Cortex-A55 cores (1.7 GHz, 64 KB L2 cache each, 256 KB cluster L3 cache with ECC) paired with a dedicated Cortex-M33 (250 MHz, 256 KB TCM, FPU/MPU/NVIC) for deterministic low-power monitoring and control. It lacks an on-die NPU, distinguishing it from NPU-enabled variants like MIMX9352XVVXMBB.
Its I/O subsystem includes dual GbE (one IEEE 1588/TSN-capable), two FlexCAN-FD modules, eight LPUARTs, three uSDHC interfaces (eMMC 5.1/SDXC/SDIO), MIPI CSI-2 (2-lane, up to 1080p30), and MIPI DSI (4-lane, up to 1080p60), all supported by a 14 × 14 mm FCBGA306 package with 0.65 mm pitch and extended industrial temperature qualification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm® Cortex®-A55 @ 1.7 GHz - enables Linux-based application processing with hardware virtualization support |
| Real-time Core | Arm® Cortex®-M33 @ 250 MHz - handles safety-critical tasks, power management, and peripheral offload without OS dependency |
| Memory Interface | 16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB DDR space with error correction for industrial reliability |
| Connectivity | Dual GbE (1× TSN + AVB + IEEE 1588; 1× EEE + AVB + IEEE 1588), 2× FlexCAN-FD, 3× uSDHC - enables time-synchronized industrial networking and secure local storage |
| Imaging I/O | MIPI CSI-2 (2-lane, 1080p30), MIPI DSI (4-lane, 1080p60), LVDS Tx (1366×768p60) - supports high-resolution camera input and display output in compact form factor |
| Temperature Grade | Extended Industrial (–40°C to +125°C junction) - qualified for harsh environments including EV charging stations and energy grid equipment |
| Package | FCBGA306, 14 × 14 mm, 0.65 mm pitch - compatible with standard reflow profiles and supports high-density routing for industrial PCBs |
Pinout & Package
Package: 14 × 14 mm Fine-Pitch Ball Grid Array (FCBGA306) with 0.65 mm ball pitch, optimized for thermal dissipation and signal integrity in extended temperature applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core supply voltage | 1.0 V ±5% input for A55/M33 logic domains; requires tight regulation and local decoupling |
| CLKIN1/CLKIN2 | External clock inputs | Accepts 24 MHz crystal or oscillator reference; no internal pull-up/down - external 10 kΩ pull-down required if unused |
| ONOFF | Power state control | Active-low momentary switch input to trigger ON/OFF transitions or software-initiated power-down |
| POR_B | Power-on reset input | Asynchronous reset assertion; requires external pull-up to NVCC_BBSM_1P8 (1.8 V) |
| RTC_XTALI/RTC_XTALO | Real-time clock oscillator interface | Supports 32.768 kHz crystal; board parasitics must be minimized to ensure reliable startup and timing accuracy |
| USB1_D_P / USB1_D_N | USB 2.0 differential data pair | Full-speed (12 Mbps) or high-speed (480 Mbps) signaling; requires controlled impedance (90 Ω differential) routing |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot & EdgeLock Enclave | Hardware-enforced chain of trust with tamper detection, eFuse key storage, and isolated secure execution environment for firmware integrity |
| Time-Sensitive Networking (TSN) | IEEE 802.1AS/1Qbv/1Qbu support in one GbE controller - enables deterministic latency and synchronization for industrial automation |
| Flexible Power Domain Partitioning | Independent power gating per subsystem (A55, M33, peripherals) - reduces active power consumption during partial operation |
| Unified Debug & Trace | Arm CoreSight™ with ETF (4 KB trace buffer) and cross-triggering between A55 and M33 - simplifies co-debugging of Linux and RTOS workloads |
| Industrial Imaging Pipeline | Integrated ISI (200 MPixel/s max), PXP (rotation, resize, color conversion), and LCDIF (MIPI DSI/LVDS/parallel) - eliminates need for external video processors |
Applications
| Industrial HMI | EV Charging Control |
|---|---|
Use Scenario: Touchscreen-based operator interface in factory floor panels with glove-compatible touch and real-time diagnostics. IC Role / Device Role / Timing Role: MIMX9332XVTXMAB serves as main application processor running Qt-based UI and real-time M33 firmware for button press response and CAN-FD communication with chargers. Use Value: Dual-core A55 handles rich graphics and network stack while M33 ensures sub-100 µs response to physical inputs - meeting IEC 61508 SIL-2 timing requirements. | Use Scenario: Smart AC/DC charging station managing grid communication, user authentication, and power delivery sequencing. IC Role / Device Role / Timing Role: MIMX9332XVTXMAB acts as central controller interfacing with ISO 15118 stack via Ethernet, reading metering ADC, and driving relay control via GPIO. Use Value: Extended temperature rating (–40°C to +125°C) and TSN-capable Ethernet enable reliable outdoor deployment and synchronized load balancing across multiple chargers. |
| Energy Grid Monitoring | Industrial Vision Gateway |
Use Scenario: Substation sensor aggregator collecting data from CT/PT sensors, environmental monitors, and breaker status via Modbus over CAN-FD. IC Role / Device Role / Timing Role: MIMX9332XVTXMAB runs Linux for protocol translation (Modbus TCP → MQTT), secure TLS tunneling, and local edge analytics using M33 for watchdog supervision. Use Value: Dual CAN-FD interfaces allow concurrent connection to legacy protection relays and modern smart meters - reducing BOM count vs. discrete CAN transceivers. | Use Scenario: Compact machine vision node capturing barcode/QR code images from conveyor-mounted cameras and performing OCR locally. IC Role / Device Role / Timing Role: MIMX9332XVTXMAB processes raw MIPI CSI-2 frames using ISI and PXP, then runs lightweight ML inference on Cortex-A55 (no NPU required for binary classification). Use Value: Integrated MIPI CSI-2 (2-lane, 1080p30) and parallel display output eliminate external bridge ICs - cutting board area and EMI risk in space-constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX9332XVVXMAB | Same dual A55/M33 configuration and feature set, but in 11 × 11 mm FCBGA306 (0.5 mm pitch) package | Lower thermal resistance (RθJA = 22.5°C/W vs. 21.7°C/W) and smaller footprint - preferred for space-constrained designs with adequate cooling | Select MIMX9332XVVXMAB when board area is critical and thermal margin allows; choose MIMX9332XVTXMAB when higher thermal mass or mechanical robustness is needed. |
| MIMX9352XVTXMAC | Adds Neural Processing Unit (NPU) and increases A55 core count to two full-featured cores (vs. MIMX9332's reduced-feature dual-core); same 14 × 14 mm package | Enables on-device AI inference (e.g., anomaly detection in predictive maintenance) - not suitable for cost-sensitive non-AI applications | Choose MIMX9352XVTXMAC only if NPU-accelerated ML workloads are required; MIMX9332XVTXMAB avoids NPU-related validation overhead and cost premium. |
Compared with MIMX9332XVVXMAB, the MIMX9332XVTXMAB offers superior thermal performance in high-ambient environments due to larger package area, while MIMX9352XVTXMAC adds NPU capability at higher cost and complexity - making MIMX9332XVTXMAB the optimal balance for deterministic industrial control without AI acceleration.
Availability
MIMX9332XVTXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid monitoring requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for MIMX9332XVTXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based applications processors and edge AI.
The i.MX 93 family - including MIMX9332XVTXMAB - was designed specifically for power-optimized, secure, and time-deterministic edge computing in extended industrial environments, emphasizing TSN, functional safety, and long-term availability.
FAQ
What is the maximum operating temperature range for the MIMX9332XVTXMAB?
The MIMX9332XVTXMAB is qualified for extended industrial operation with a junction temperature range of –40°C to +125°C. This rating is validated per JEDEC JESD22-A108 and applies to continuous operation under specified voltage and thermal conditions - enabling use in uncooled EV charging enclosures and outdoor energy grid equipment without derating.
Does the MIMX9332XVTXMAB include a Neural Processing Unit (NPU)?
No, the MIMX9332XVTXMAB does not include an on-die Neural Processing Unit. Its part number suffix "XVTXMAB" indicates NPU-disabled configuration, as confirmed in Table 2 of the IMX93XEC datasheet. For NPU-enabled variants, refer to part numbers ending in "MBB" such as MIMX9352XVVXMBB.
Which package type and ball pitch does the MIMX9332XVTXMAB use?
The MIMX9332XVTXMAB uses a 14 × 14 mm Fine-Pitch Ball Grid Array (FCBGA306) package with 0.65 mm ball pitch. This is explicitly defined in the part number nomenclature (Figure 1) and verified in Table 2 of the IMX93XEC datasheet - distinct from the 11 × 11 mm / 0.5 mm pitch variant MIMX9332XVVXMAB.
What Ethernet capabilities does the MIMX9332XVTXMAB support?
The MIMX9332XVTXMAB integrates two independent Gigabit Ethernet controllers: one supports Energy Efficient Ethernet (EEE), Audio Video Bridging (AVB), and IEEE 1588 Precision Time Protocol; the second adds Time-Sensitive Networking (TSN) features including IEEE 802.1AS (time sync), 802.1Qbv (time-aware shaper), and 802.1Qbu (frame preemption).
How is security implemented in the MIMX9332XVTXMAB?
Security in the MIMX9332XVTXMAB is implemented through Arm TrustZone-A/M, Trusted Resource Domain Controller (TRDC), EdgeLock® secure enclave, Battery Backed Security Module (BBSM) with secure RTC, and hardware-accelerated crypto engines. These features enable secure boot, isolated execution environments, tamper detection, and secure key storage - all validated under NXP's Common Criteria EAL5+ certification scope for i.MX 93.
MIMX9332XVTXMAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 306-LFBGA, FCBGA
- Series:
- i.MX 93
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2, 1 Core, 64-Bit
- Speed:
- 250MHz, 1.7GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- GBE (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 306-FCBGA (14x14)
- Additional Interfaces:
- CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
MIMX9332XVTXMAB FAQ
1.How can I place an order for MIMX9332XVTXMAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX9332XVTXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX9332XVTXMAB reliable?
The price and inventory of MIMX9332XVTXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9332XVTXMAB is usually 5 days.
3.What payment methods are accepted for MIMX9332XVTXMAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9332XVTXMAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX9332XVTXMAB?
MIMX9332XVTXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX9332XVTXMAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX9332XVTXMAB?
For technical support, including MIMX9332XVTXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9332XVTXMAB requirements.
6.How does Aetrix verify that MIMX9332XVTXMAB is sourced from the original manufacturer or authorized distributors?
All MIMX9332XVTXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9332XVTXMAB meets industry standards.
7.What is the process for return or replacement of MIMX9332XVTXMAB?
All MIMX9332XVTXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9332XVTXMAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX9332XVTXMAB part is unused and in its original packaging.
Return procedure for MIMX9332XVTXMAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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