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NXP Semiconductors MIMX9351XVTXMAB

Part No.:
MIMX9351XVTXMAB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
306-LFBGA, FCBGA
Datasheet:
AetrixMIMX9351XVTXMAB.pdf
Description:
MIMX9351XVTXMAB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,629

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Product details

Overview

MIMX9351XVTXMAB from NXP Semiconductors is a single-core Arm® Cortex®-A55 (1.7 GHz) + Arm® Cortex®-M33 (250 MHz) applications processor with integrated Neural Processing Unit (NPU), dual Gigabit Ethernet (one with TSN), MIPI CSI-2 and DSI, LPDDR4X support, and EdgeLock® secure enclave - designed for extended industrial HMI, EV charging control, and touchless access systems operating from –40°C to +125°C.

For engineers reviewing the MIMX9351XVTXMAB datasheet, MIMX9351XVTXMAB pinout, MIMX9351XVTXMAB application, or MIMX9351XVTXMAB equivalent, key selection criteria include its 14 × 14 mm FCBGA306 package, NPU-disabled configuration, extended temperature qualification, dual-GbE with TSN capability, and secure boot with TrustZone-A/M.

Technical Context

The MIMX9351XVTXMAB implements a heterogeneous compute architecture: one Cortex-A55 core handles Linux-based application workloads at up to 1.7 GHz with 64 KB L2 cache and Neon/FPU, while the Cortex-M33 (250 MHz) manages real-time tasks, power state coordination, and peripheral offload. Its memory subsystem includes 640 KB on-chip RAM with ECC, LPDDR4X interface (3.7 GT/s, up to 2 GB), and FlexSPI for XIP-capable flash.

Connectivity is anchored by two Gigabit Ethernet controllers (one IEEE 1588/TSN-compliant), two FlexCAN-FD modules, dual I3C, eight LPUARTs, and three uSDHC interfaces supporting eMMC 5.1, SDXC, and SDIO - all routed through a centralized IOMUXC with GPIO interrupt capability and tamper detection support.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreSingle Arm® Cortex®-A55 @ 1.7 GHz - enables deterministic Linux execution with 64 KB per-core L2 cache and VFPv4-D16 FPU support
Real-time CoreArm® Cortex®-M33 @ 250 MHz - provides low-latency RTOS or bare-metal control with MPU, NVIC, and 256 KB TCM
NPU StatusDisabled - reduces dynamic power and simplifies thermal design for non-ML inference use cases
Memory Interface16-bit LPDDR4X/LPDDR4 with inline ECC - supports up to 2 GB DDR space at 3.7 GT/s with error correction for industrial reliability
ConnectivityDual GbE (one with TSN), 2× FlexCAN-FD, 3× uSDHC, 8× LPUART - enables gateway-class edge routing, CAN-based automation, and high-throughput storage
Display & ImagingMIPI DSI (4-lane, 1080p60), MIPI CSI-2 (2-lane, 1080p30), LCDIF - supports embedded displays and vision input without external bridge ICs
SecurityEdgeLock® secure enclave, Arm TrustZone-A/M, TRDC with 16 domains, BBSM with secure RTC - meets extended industrial security requirements
Temperature Range–40°C to +125°C junction - qualified for extended industrial environments including EV charging stations and energy grid equipment

Pinout & Package

Package: 14 × 14 mm, 0.65 mm pitch, FCBGA306 - thermally optimized for extended industrial operation with RθJA = 21.7°C/W (JESD51-9, 2s2p board).

Pin/TerminalCircuit RoleDesign Meaning
ONOFFPower state control inputHardware-triggered ON/OFF transition and software-controllable power-down interrupt; long press forces forced OFF via PMIC_ON_REQ
POR_BPower-on reset inputActive-low reset requiring external pull-up to NVCC_BBSM_1P8; critical for reliable cold-start sequencing
RTC_XTALI / RTC_XTALOLow-frequency crystal oscillator inputsSupports 32.768 kHz crystal; requires board capacitance tuning and >100 MΩ leakage isolation for stable RTC operation
XTALI_24M / XTALO_24MMain system clock input24 MHz crystal reference mandatory; not replaceable with oscillator; strict jitter/tolerance specs for USB timing compliance
VDD_SOCMain core supply1.0 V nominal (±5%), –0.3 V to 1.15 V absolute max - powers Cortex-A55, Cortex-M33, and L3 cache
VDD2_DDR / VDDQ_DDRDDR PHY and I/O supply1.1 V LPDDR4X core (VDD2_DDR) and 1.1 V I/O (VDDQ_DDR); both require inline ECC and tight regulation

Key Features

FeatureDesign Value
Heterogeneous dual-domain CPUSeparate Cortex-A55 (Linux app layer) and Cortex-M33 (real-time control) enable concurrent high-level and deterministic task execution
Time-Sensitive Networking (TSN)Hardware-accelerated IEEE 802.1AS/1Qbv/1Qci in one GbE controller enables synchronized industrial Ethernet communication
Secure boot chainROM-based boot with eFuse key storage, EdgeLock® secure enclave, and TrustZone-A/M isolation ensures authenticated firmware loading
Flexible display interfaceSingle LCDIF drives MIPI DSI (4-lane), LVDS (4-lane), or parallel RGB - eliminates need for external display bridge ICs
Industrial-grade connectivityTwo FlexCAN-FD modules support automotive-grade fieldbus communication; dual GbE with AVB/EEE/1588 satisfies factory automation latency demands
Thermal robustnessExtended industrial qualification (–40°C to +125°C) with validated thermal resistance (RθJA = 21.7°C/W) enables fanless deployment in harsh enclosures

Applications

Industrial HMIEV Charging Control

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time status visualization and remote diagnostics.

IC Role / Device Role / Timing Role: MIMX9351XVTXMAB serves as the main application processor running Qt-based UI and Linux services, coordinating with Cortex-M33 for CAN-FD motor control feedback loops.

Use Value: Dual GbE with TSN enables synchronized data exchange between HMI and PLC; MIPI DSI directly drives 1080p60 displays without bridge IC overhead.

Use Scenario: Smart AC/DC charging station managing power delivery, user authentication, grid communication, and safety monitoring.

IC Role / Device Role / Timing Role: MIMX9351XVTXMAB hosts the charging stack (OCPP), processes ISO 15118 handshaking, and executes secure metering via SAR ADC and crypto acceleration.

Use Value: EdgeLock® secure enclave protects private keys; extended temperature rating ensures reliability inside outdoor-rated enclosures; dual CAN-FD interfaces connect to battery management and grid interface modules.

Touchless Access ControlEnergy Grid Monitoring

Use Scenario: Facial recognition terminal using local inference for secure entry without cloud dependency or network latency.

IC Role / Device Role / Timing Role: MIMX9351XVTXMAB runs camera capture (MIPI CSI-2), image preprocessing (PXP), and lightweight neural inference - all on-device with no NPU required for sub-1W operation.

Use Value: Single-core A55 + M33 partitioning isolates biometric processing from network stacks; 12-bit SAR ADC monitors environmental sensors for anti-spoofing.

Use Scenario: Substation edge node collecting transformer telemetry, performing waveform analysis, and reporting anomalies via cellular backhaul.

IC Role / Device Role / Timing Role: MIMX9351XVTXMAB acts as the primary data concentrator - acquiring analog inputs (SAR ADC), timestamping via IEEE 1588, and forwarding time-aligned packets over TSN Ethernet.

Use Value: Hardware TSN support guarantees sub-1 µs time synchronization across distributed sensors; extended temp rating ensures uptime in unconditioned substations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MIMX9351XVVXMABSame core count, speed, and NPU-disabled config but in 11 × 11 mm FCBGA306 package (RθJA = 22.5°C/W)Better suited for space-constrained designs where thermal margin allows slightly higher junction riseSelect when PCB area is limited and thermal headroom permits higher ambient operation
MIMX9352XVTXMABDual Cortex-A55 cores (1.7 GHz), same package and temperature grade, NPU disabledRequired for symmetric multiprocessing workloads (e.g., containerized edge AI agents or dual-OS virtualization)Choose when application demands parallel Linux threads or higher sustained throughput than single-core A55 provides

Compared with MIMX9351XVTXMAB, MIMX9351XVVXMAB offers identical functionality in a smaller footprint but with marginally reduced thermal performance, while MIMX9352XVTXMAB doubles application CPU capacity at the cost of higher dynamic power - making each alternative optimal for distinct mechanical, thermal, or computational constraints.

Availability

MIMX9351XVTXMAB is available at Aetrix Electronics and suitable for industrial HMI, EV charging infrastructure, and energy grid monitoring requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for MIMX9351XVTXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications.

The i.MX 93 family - including MIMX9351XVTXMAB - was engineered for power-optimized, secure edge intelligence in extended industrial environments, integrating real-time control, TSN networking, and hardware-enforced security into a single SoC platform.

FAQ

What is the maximum operating temperature specification for the MIMX9351XVTXMAB?

The MIMX9351XVTXMAB is qualified for extended industrial operation with a junction temperature range of –40°C to +125°C. This rating is validated per JEDEC JESD22-A104 and confirmed in the IMX93XEC datasheet Rev. 8. Thermal design must maintain junction temperature within this limit under worst-case ambient and power conditions, leveraging its 14 × 14 mm FCBGA306 package with RθJA = 21.7°C/W.

Does the MIMX9351XVTXMAB include an integrated Neural Processing Unit (NPU)?

No, the MIMX9351XVTXMAB has the NPU disabled. Per Table 2 of the IMX93XEC datasheet, this part number belongs to the "NPU Disabled" variant group. It retains full Cortex-A55 and Cortex-M33 functionality, LPDDR4X interface, TSN Ethernet, and EdgeLock® security - making it ideal for applications requiring deterministic real-time response without ML inference overhead.

Which display interfaces does the MIMX9351XVTXMAB support natively?

The MIMX9351XVTXMAB supports MIPI DSI (4-lane, up to 1080p60), LVDS (4-lane, up to 1366x768p60), and parallel RGB (up to 1366x768p60) via its integrated LCDIF controller. All three outputs are mutually exclusive per design; no external bridge IC is required. The MIPI DSI interface complies with v1.2 and supports 80–1500 Mbps per lane in high-speed mode.

What Ethernet capabilities does the MIMX9351XVTXMAB provide?

The MIMX9351XVTXMAB integrates two independent Gigabit Ethernet controllers. One supports Energy Efficient Ethernet (EEE), AVB, and IEEE 1588; the other adds Time-Sensitive Networking (TSN) features including 802.1AS (time sync), 802.1Qbv (time-aware shaper), and 802.1Qci (per-stream filtering). Both operate simultaneously and are fully hardware-accelerated.

Is the MIMX9351XVTXMAB pin-compatible with other i.MX 93 variants in the same package size?

Yes, all i.MX 93 parts in the 14 × 14 mm FCBGA306 package - including MIMX9351XVTXMAB, MIMX9352XVTXMAB, and MIMX9332XVTXMAC - share identical pinouts and ball assignments per the IMX93XEC Package Information section. This enables hardware reuse across performance tiers (single/dual A55) and feature sets (NPU on/off) without PCB redesign.

MIMX9351XVTXMAB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
306-LFBGA, FCBGA
Series:
i.MX 93
Packaging:
Bulk
Product Status:
Active
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
SATA:
-
USB:
USB 2.0 (2)
Voltage - I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
306-FCBGA (14x14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART

MIMX9351XVTXMAB FAQ

1.How can I place an order for MIMX9351XVTXMAB through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMX9351XVTXMAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMX9351XVTXMAB reliable?

The price and inventory of MIMX9351XVTXMAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX9351XVTXMAB is usually 5 days.

3.What payment methods are accepted for MIMX9351XVTXMAB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX9351XVTXMAB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMX9351XVTXMAB?

MIMX9351XVTXMAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMX9351XVTXMAB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMX9351XVTXMAB?

For technical support, including MIMX9351XVTXMAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX9351XVTXMAB requirements.

6.How does Aetrix verify that MIMX9351XVTXMAB is sourced from the original manufacturer or authorized distributors?

All MIMX9351XVTXMAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX9351XVTXMAB meets industry standards.

7.What is the process for return or replacement of MIMX9351XVTXMAB?

All MIMX9351XVTXMAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX9351XVTXMAB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMX9351XVTXMAB part is unused and in its original packaging.

Return procedure for MIMX9351XVTXMAB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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