NXP Semiconductors MIMX9352CVVXMAB

Overview

MIMX9352CVVXMAB from NXP Semiconductors is an industrial-grade dual-core Arm® Cortex®-A55 applications processor with integrated Neural Processing Unit (NPU), operating up to 1.7 GHz, supporting LPDDR4X/LPDDR4 with inline ECC, dual Gigabit Ethernet (one with TSN), and MIPI CSI-2/DSI interfaces - deployed in industrial HMI, vision systems, and EV charging gateways.

For engineers reviewing the MIMX9352CVVXMAB datasheet, MIMX9352CVVXMAB pinout, MIMX9352CVVXMAB application, or MIMX9352CVVXMAB equivalent, key selection criteria include its 11 × 11 mm FCBGA306 package, industrial temperature range (−40°C to +105°C), dual-A55 + M33 heterogeneous architecture, NPU acceleration for edge ML inference, and TSN-capable Ethernet for deterministic networking.

Technical Context

The MIMX9352CVVXMAB implements a heterogeneous compute architecture: two Cortex-A55 cores (1.7 GHz) handle high-throughput Linux-based application workloads, while a dedicated Cortex-M33 core (250 MHz) manages real-time control, power state coordination, and secure boot services - all sharing coherent cache hierarchy and protected memory domains via Arm TrustZone-A/M.

Its connectivity stack includes two FlexCAN-FD controllers, dual GbE with IEEE 1588/TSN support, three uSDHC interfaces (eMMC 5.1/SDXC/SDIO), and dual USB 2.0 PHYs; multimedia subsystems comprise MIPI CSI-2 (2-lane, 1080p30), MIPI DSI (4-lane, 1080p60), LVDS Tx, and PXP-based 2D graphics acceleration.

Key Specifications

Pinout & Package

Package: 306-ball Fine-Pitch Ball Grid Array (FCBGA), 11 mm × 11 mm, 0.5 mm ball pitch, 0.8 mm nominal height. Thermal pad exposed on underside for PCB-level heat dissipation. Compatible with standard reflow profiles for Pb-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MIMX9352CVVXMAB, MIMX9352CVTXMAC offers improved thermal dissipation in space-permitting designs, while MIMX9332CVVXMAB removes NPU silicon to lower unit cost - both retain identical peripheral sets and industrial qualification, enabling direct migration within the i.MX 93 family.

Availability

MIMX9352CVVXMAB is available at Aetrix Electronics and suitable for industrial HMI, smart EV charging infrastructure, and machine vision gateway designs requiring stable component supply, long-term industrial qualification, and NPU-accelerated edge intelligence.

Supply support for MIMX9352CVVXMAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, and mobile applications - headquartered in Eindhoven, Netherlands.

The i.MX 93 family, including MIMX9352CVVXMAB, was designed specifically for power-constrained industrial edge devices requiring real-time responsiveness, AI inferencing, and robust functional safety - targeting HMI, vision, and gateway use cases demanding ASIL-B readiness and extended temperature operation.

FAQ

What is the maximum operating frequency of the Cortex-A55 cores in the MIMX9352CVVXMAB?

The MIMX9352CVVXMAB features two Arm® Cortex®-A55 application processor cores rated for operation up to 1.7 GHz under industrial temperature conditions (−40°C to +105°C). This frequency is guaranteed with proper thermal management and compliant power delivery per the IMX93IEC datasheet specifications. The MIMX9352CVVXMAB maintains this speed across its full industrial operating range when supplied with stable 1.0 V ±3% VDD_SOC and adequate PCB thermal design.

Does the MIMX9352CVVXMAB include hardware support for Time-Sensitive Networking (TSN)?

Yes, the MIMX9352CVVXMAB integrates one Gigabit Ethernet controller with full IEEE 802.1AS, 802.1Qbv, and 802.1Qbu TSN support, including hardware timestamping, time-aware shaper, and frame preemption. This TSN-capable Ethernet port operates alongside a second GbE controller supporting AVB and EEE - enabling deterministic traffic scheduling essential for industrial automation and synchronized gateway applications using the MIMX9352CVVXMAB.

What camera interfaces does the MIMX9352CVVXMAB support, and what resolutions are achievable?

The MIMX9352CVVXMAB supports MIPI CSI-2 (2-lane, up to 1.5 Gbps per lane) and parallel YUV/RGB camera inputs. With its Image Sensor Interface (ISI), it processes up to 1080p30 video (200 MPixel/s pixel rate) and performs on-the-fly downscaling, color space conversion, and interlaced-to-progressive conversion. The MIMX9352CVVXMAB does not support MIPI CSI-2 v2.0 or 4-lane configurations - its camera capability is strictly defined by the MIX93IEC datasheet for this variant.

Is the Neural Processing Unit (NPU) enabled in the MIMX9352CVVXMAB, and what precision does it support?

Yes, the MIMX9352CVVXMAB includes a fully enabled Neural Processing Unit (NPU) delivering 512 GOPS peak integer performance at 1.0 GHz. It supports 8-bit and 16-bit integer RNN inference with 8-bit weight quantization, optimized for edge ML models such as MobileNetV2 and Tiny-YOLO. The NPU is accessible via NXP's eIQ™ Toolkit and integrated into the Linux BSP - confirming that the MIMX9352CVVXMAB provides production-ready AI acceleration without external coprocessors.

What is the package type and ball count for the MIMX9352CVVXMAB?

The MIMX9352CVVXMAB uses a 306-ball Fine-Pitch Ball Grid Array (FCBGA) package measuring 11 mm × 11 mm with 0.5 mm ball pitch. This package is designated "VV" in NXP's part numbering nomenclature and is qualified for industrial temperature operation (−40°C to +105°C). The MIMX9352CVVXMAB's FCBGA306 footprint is documented in the i.MX 93 Applications Processor Reference Manual and supported by NXP's official EVK design files.