Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MIMXRT1041DJM6B

Part No.:
MIMXRT1041DJM6B
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
169-LFBGA
Datasheet:
AetrixMIMXRT1041DJM6B.pdf
Description:
IC MCU 32BIT 128KB ROM 169LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:880

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MIMXRT1041DJM6B from NXP Semiconductors is a 600 MHz Arm Cortex-M7 crossover processor with 512 KB FlexRAM (configurable as I-TCM/D-TCM/OCRAM), integrated DCDC/LDO power management, and dual FlexSPI interfaces. It supports eMMC 4.5/SD 3.0, USB OTG, 10/100 Ethernet with IEEE 1588, two FlexCAN modules (one with CAN FD), and 114 GPIOs - deployed in industrial HMI and motor control systems requiring real-time responsiveness and secure boot.

For engineers reviewing the MIMXRT1041DJM6B datasheet, MIMXRT1041DJM6B pinout, MIMXRT1041DJM6B application, or MIMXRT1041DJM6B equivalent, key selection criteria include absence of LCD/PXP hardware, confirmed 11 × 11 mm 0.8 mm pitch BGA package, 600 MHz core frequency, dual FlexSPI with XIP support, and full HAB/DCP/BEE security acceleration - all verified for consumer-grade (0 to +95 °C) operation.

Technical Context

The MIMXRT1041DJM6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, VFPv5 FPU, and MPU supporting 16 protection regions. Its memory subsystem integrates 128 KB boot ROM, 512 KB FlexRAM, and external memory controllers for SDRAM, NAND/NOR, and Quad SPI flash.

Peripherals include four FlexPWM modules (up to 8 channels total), four Quad Timers with quadrature decoding, two ADCs (12-channel total), four ACMPs, three LPI2C, three LPSPI, eight LPUART, and dual FlexCAN with CAN FD - all routed through centralized IOMUXC with tightly coupled GPIOs operating at core frequency.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Arm Cortex-M7 @ 600 MHz with 32 KB I-cache, 32 KB D-cache, and VFPv5 FPU - enables deterministic real-time execution and floating-point math for motor control algorithms.
On-chip RAM 512 KB FlexRAM configurable in 32 KB granularity as I-TCM, D-TCM, or OCRAM - allows optimization of critical code/data placement for latency-sensitive tasks.
Memory Interfaces Dual FlexSPI with XIP support, SEMC for SDRAM/NAND/NOR, uSDHC x2 (eMMC 4.5/SD 3.0) - provides flexible boot and runtime storage options without external memory controller logic.
Security Acceleration HAB, DCP (AES-128/SHA-256/CRC-32), BEE (AES-128 CTR), TRNG, SNVS - enables authenticated boot, encrypted firmware updates, and secure key storage in resource-constrained edge devices.
Connectivity Peripherals 10/100 Ethernet w/ IEEE 1588, USB OTG w/ PHY, FlexCAN x2 (one with CAN FD), UART x8, I2C x4, SPI x3 - supports time-synchronized industrial networking and multi-protocol fieldbus integration.
Analog & Timing ADC x2 (12-channel total), ACMP x4, GPT x2, PIT x4, QTimer x4, ENC x4, WDOG x4 - delivers sensor acquisition, comparator-based event detection, and precise motor position/speed feedback.
Power Management Integrated DCDC and LDO regulators, temperature sensor, GPC hardware controller - reduces external PMIC count and simplifies power sequencing for cost-sensitive consumer applications.

Pinout & Package

169-pin BGA, 11 × 11 mm body, 0.8 mm pitch, plastic package - compatible with standard reflow profiles and IPC Class 2/3 assembly processes.

Pin/Terminal Circuit Role Design Meaning
VDD_SOC Core power supply Supplies 0.9–1.3 V to Cortex-M7 core and on-chip logic; requires low-noise regulation per datasheet decoupling guidelines.
VDDA Analog power supply Provides clean 3.3 V for ADC/ACMP reference; must be isolated from digital noise sources to maintain 12-bit accuracy.
BOOT_MODE0/1 Boot configuration Strapped at power-up to select boot source (FlexSPI, SD, USB, etc.); determines initial vector fetch location and peripheral initialization sequence.
ENET_RXD0–3 / TXD0–3 Ethernet physical layer interface Direct connection to external PHY; supports RMII/MII modes and IEEE 1588 timestamping via dedicated hardware registers.
FLEXSPI_A_DATA0–3 / B_DATA0–3 Quad SPI flash interface Two independent 4-bit bidirectional data buses enabling concurrent XIP from two external flash devices - critical for fast boot and overlay code loading.
GPIO_AD_B0_00–15 / AD_B1_00–15 General-purpose I/O bank 114 total GPIOs (112 tightly coupled to core clock); each pin supports programmable pull-up/down, slew rate, and drive strength for mixed-signal board interfacing.

Key Features

Feature Design Value
Arm Cortex-M7 Core 600 MHz operation with TCM-configurable RAM ensures sub-microsecond interrupt latency and deterministic execution for hard real-time motor control loops.
No LCD/PXP Hardware Omits display controller and 2D graphics engine - reduces silicon area, power consumption, and BOM cost in headless industrial controllers where UI is handled remotely.
Dual FlexSPI with XIP Enables direct code execution from two external QSPI flashes simultaneously - eliminates need for large external RAM during boot and supports secure over-the-air firmware updates.
Integrated Power Management On-die DCDC and LDO eliminate external regulators, reduce PCB footprint by >30%, and simplify thermal design for compact enclosures in home appliance applications.
Secure Boot & Cryptography HAB validates signed firmware images; DCP/BEE accelerate AES/SHA operations - meets IEC 62443-3-3 SL2 requirements for secure firmware deployment in networked industrial equipment.

Applications

Industrial HMI Controller Smart Home Appliance MCU

Use Scenario: Embedded controller for touch-enabled kitchen appliances with local processing, cloud connectivity, and OTA update capability.

IC Role / Device Role / Timing Role: Primary application processor executing RTOS, managing display-less UI via remote app, handling sensor inputs (temp, door switch), and driving relay/SSR outputs.

Use Value: Integrated DCDC/LDO and 512 KB FlexRAM reduce component count and enable compact 4-layer PCB design while maintaining 600 MHz performance for responsive local control.

Use Scenario: Central control unit in washing machine or HVAC system coordinating motor drivers, water valves, temperature sensors, and user interface.

IC Role / Device Role / Timing Role: Real-time motion controller interfacing with FlexPWM outputs and quadrature encoder inputs to regulate BLDC motor speed and position.

Use Value: Four FlexPWM modules (8 channels) and four ENC blocks provide native hardware support for multi-motor control without external timing ICs or FPGA glue logic.

Networked Motor Drive Secure Edge Gateway

Use Scenario: DIN-rail mounted servo drive with EtherNet/IP or Modbus TCP communication and local safety monitoring.

IC Role / Device Role / Timing Role: Deterministic real-time processor running motion profile generation, current loop control, and IEEE 1588-synchronized network stack.

Use Value: 10/100 Ethernet with hardware timestamping and dual FlexCAN (one CAN FD) enable synchronized multi-axis motion control across industrial networks.

Use Scenario: Field-deployed gateway aggregating sensor data from legacy RS-485 devices and forwarding to cloud via TLS-secured MQTT.

IC Role / Device Role / Timing Role: Secure protocol translator performing cryptographic offload (AES/SHA), secure boot validation, and trusted execution environment isolation.

Use Value: DCP/BEE accelerators achieve 2× faster TLS handshake vs software-only implementation, reducing connection latency for battery-powered remote nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MIMXRT1041DFP6B Same core, RAM, and peripheral set but in 9 × 9 mm 0.65 mm pitch BGA package - 2.25× smaller footprint, higher routing density required. Suitable for space-constrained portable or wearable designs where thermal envelope permits tighter BGA pitch. Select MIMXRT1041DFP6B when PCB area is premium and assembly capability supports 0.65 mm pitch; retain same firmware and security configuration.
MIMXRT1042DJM6B Adds LCDIF and PXP graphics engine; otherwise identical package, clock, RAM, and security features. Required for local RGB display output (WXGA) and hardware-accelerated 2D composition in HMI front-ends. Choose MIMXRT1042DJM6B only if display functionality is needed; MIMXRT1041DJM6B avoids unnecessary silicon cost and power draw in headless systems.

Compared with MIMXRT1041DFP6B, the MIMXRT1041DJM6B offers relaxed PCB layout constraints at the cost of larger board area; versus MIMXRT1042DJM6B, it removes unused display logic to lower power and bill-of-materials cost in non-visual control applications.

Availability

MIMXRT1041DJM6B is available at Aetrix Electronics and suitable for industrial HMI, smart home appliance control, and networked motor drive applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MIMXRT1041DJM6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.

The i.MX RT1040 family targets cost-sensitive consumer and industrial crossover applications, balancing Cortex-M7 performance with integrated power management, security, and rich peripheral sets - designed to replace discrete MCU+FPGA+PMIC combinations.

FAQ

What is the maximum operating frequency of the MIMXRT1041DJM6B?

The MIMXRT1041DJM6B operates at a maximum core frequency of 600 MHz, as specified in its commercial-grade temperature range (0 to +95 °C). This frequency is sustained under full load with proper thermal management and voltage regulation per NXP's recommended power supply specifications. The MIMXRT1041DJM6B achieves this using an optimized Arm Cortex-M7 implementation with integrated cache and FPU.

Does the MIMXRT1041DJM6B support display interfaces like LCD or PXP?

No, the MIMXRT1041DJM6B explicitly omits LCDIF and PXP hardware, as confirmed in Table 1 of the i.MX RT1040 datasheet. This distinguishes it from MIMXRT1042DJM6B and MIMXRT1043DJM6B variants. The MIMXRT1041DJM6B is intended for headless applications where display processing is handled externally or omitted entirely.

What security features are implemented in the MIMXRT1041DJM6B?

The MIMXRT1041DJM6B includes High Assurance Boot (HAB), Data Co-Processor (DCP) for AES-128/SHA-256/CRC-32, Bus Encryption Engine (BEE) for on-the-fly QSPI decryption, True Random Number Generator (TRNG), Secure Non-Volatile Storage (SNVS), and Secure JTAG Controller (SJC). These features are fully enabled and documented in the MIMXRT1041DJM6B security reference manual.

Which package type does the MIMXRT1041DJM6B use?

The MIMXRT1041DJM6B uses a 169-pin plastic BGA package with 11 × 11 mm body size and 0.8 mm ball pitch, designated as "VL" in NXP's part numbering nomenclature. This package is distinct from the 9 × 9 mm 0.65 mm pitch (JM) and 7 × 7 mm 0.5 mm pitch (AE) variants used by other members of the i.MX RT1040 family.

How much on-chip RAM does the MIMXRT1041DJM6B provide, and how is it allocated?

The MIMXRT1041DJM6B provides 512 KB of on-chip FlexRAM, which can be dynamically partitioned in 32 KB increments among instruction TCM (I-TCM), data TCM (D-TCM), and general-purpose OCRAM. This allocation is configured at boot time via the SRC_GPR register and remains flexible across runtime - a key capability of the MIMXRT1041DJM6B's memory architecture.

MIMXRT1041DJM6B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
169-LFBGA
Series:
RT1040
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
114
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
ROM
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MIMXRT1041DJM6B FAQ

1.How can I place an order for MIMXRT1041DJM6B through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMXRT1041DJM6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMXRT1041DJM6B reliable?

The price and inventory of MIMXRT1041DJM6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1041DJM6B is usually 5 days.

3.What payment methods are accepted for MIMXRT1041DJM6B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1041DJM6B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMXRT1041DJM6B?

MIMXRT1041DJM6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMXRT1041DJM6B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMXRT1041DJM6B?

For technical support, including MIMXRT1041DJM6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1041DJM6B requirements.

6.How does Aetrix verify that MIMXRT1041DJM6B is sourced from the original manufacturer or authorized distributors?

All MIMXRT1041DJM6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1041DJM6B meets industry standards.

7.What is the process for return or replacement of MIMXRT1041DJM6B?

All MIMXRT1041DJM6B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1041DJM6B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMXRT1041DJM6B part is unused and in its original packaging.

Return procedure for MIMXRT1041DJM6B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MIMXRT1041DJM6B Tags

  • MIMXRT1041DJM6B
  • MIMXRT1041DJM6B PDF
  • MIMXRT1041DJM6B Datasheet
  • MIMXRT1041DJM6B Specifications
  • MIMXRT1041DJM6B Images
  • NXP Semiconductors
  • NXP Semiconductors MIMXRT1041DJM6B
  • Buy MIMXRT1041DJM6B
  • MIMXRT1041DJM6B Price
  • MIMXRT1041DJM6B Distributor
  • MIMXRT1041DJM6B Supplier
  • MIMXRT1041DJM6B Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER