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NXP Semiconductors MIMXRT1051DVL6B

Part No.:
MIMXRT1051DVL6B
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
196-LFBGA
Datasheet:
AetrixMIMXRT1051DVL6B.pdf
Description:
IC MCU 32BIT 196MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:777

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Product details

Overview

MIMXRT1051DVL6B from NXP Semiconductors is a 600 MHz Arm Cortex-M7-based crossover MCU in a 10 × 10 mm, 0.65 mm pitch, 196-pin MAPBGA package, featuring 512 KB on-chip RAM (configurable as TCM/OCRAM), dual USB 2.0 OTG with integrated PHY, and dual uSDHC supporting eMMC 4.5/SD 3.0 for industrial HMI and motor control applications.

For engineers reviewing the MIMXRT1051DVL6B datasheet, MIMXRT1051DVL6B pinout, MIMXRT1051DVL6B application, or MIMXRT1051DVL6B equivalent, key selection considerations include its 127 GPIO count, absence of LCD/CSI/PXP modules, integrated DCDC/LDO power management, and support for IEEE 1588 Ethernet timing in compact consumer-grade thermal range (0 to +95 °C).

Technical Context

The MIMXRT1051DVL6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, VFPv5 FPU, and MPU with up to 16 protection regions. It integrates boot ROM (96 KB), eDMA (32-channel), and SEMC for SDRAM/NAND/NOR/PSRAM interfacing.

Its peripheral set includes four FlexPWMs (16-bit, up to 8 channels each), four quadrature encoders, two GPTs (32-bit), four PITs (16-bit), three SAI modules (I2S/AC97/TDM), SPDIF, MQS, two FlexCAN 2.0B controllers, eight UARTs, four I2C, four SPI, and dual 10/100 ENET with IEEE 1588 support - all operating within the 0–95 °C junction temperature range.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M7 @ 600 MHz - delivers deterministic real-time response with full FPU and MPU for safety-critical motor control loops.
On-chip Memory 512 KB RAM configurable as I-TCM/D-TCM/OCRAM - enables low-latency code execution and data buffering without external SRAM.
Package 196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch - supports high-density PCB layouts while maintaining thermal performance in industrial enclosures.
Power Management Integrated DCDC + LDO - eliminates need for external PMIC, simplifies power sequencing, and reduces BOM cost in battery-powered HMIs.
Connectivity Dual uSDHC (eMMC 4.5/SD 3.0), dual USB 2.0 OTG with PHY, 10/100 ENET w/ IEEE 1588 - enables local storage, host/device USB operation, and time-synchronized industrial networking.
Analog Peripherals 2 × 12-bit ADC (20-channel), 4 × ACMP, TSC - supports analog sensor acquisition, overcurrent detection, and resistive touch panel integration.
Security HAB, DCP (AES-128/SHA-256), BEE, TRNG, SNVS - provides secure boot, encrypted firmware updates, and tamper-resistant RTC/key storage.

Pinout & Package

196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch package with exposed thermal pad (bottom side). Pin assignments follow NXP's i.MX RT1050 standard ball map; specific signal mapping requires reference to Table 6-1 (10 × 10 mm package) in IMXRT1050CEC Rev. 2.

Pin/Terminal Circuit Role Design Meaning
VDD_SOC Core logic supply 1.0–1.3 V input for Cortex-M7 core and internal peripherals; routed to DCDC output.
VDDA Analog supply 3.3 V analog domain supply for ADC, ACMP, and TSC - requires dedicated filtering per datasheet layout guidelines.
BOOT_MODE0/1 Boot configuration Strapped at reset to select boot source (FlexSPI, SD, USB, etc.); determines initial memory map and ROM execution path.
ENET_REF_CLK Ethernet clock input 50 MHz differential reference clock for IEEE 1588 timestamping and MAC synchronization.
USB_OTG1_DP/DM USB 2.0 differential pair Full-speed/high-speed USB signaling with integrated PHY - no external transceiver required.
SD1_DATA0–7 uSDHC1 data bus 8-bit bidirectional data interface for eMMC 4.5 or SD 3.0 cards - supports HS200 mode up to 200 MB/s.

Key Features

Feature Design Value
Integrated DCDC + LDO Reduces external power components by >50%, enabling single-rail 3.3 V input designs for cost-sensitive industrial HMIs.
No LCD/CSI/PXP modules Optimizes die area and cost for non-display applications - frees PCB space and routing complexity in motor drive controllers.
Four FlexPWM modules Supports simultaneous 3-phase BLDC and PMSM motor control with dead-time insertion, fault protection, and complementary outputs.
IEEE 1588-capable ENET Enables sub-microsecond time synchronization across distributed motor drives or PLC nodes without external timing hardware.
Secure Boot (HAB) Verifies signed firmware images before execution - prevents unauthorized code injection in field-deployed industrial edge devices.

Applications

Industrial HMI Motor Control Drive

Use Scenario: Touch-enabled operator panel for CNC machine monitoring with local data logging and USB firmware update capability.

IC Role / Device Role / Timing Role: Main application processor executing real-time UI rendering, CAN bus motion coordination, and secure boot validation.

Use Value: Integrated DCDC and 127 GPIOs enable compact 4-layer PCB design; absence of display IP reduces thermal load in sealed enclosures.

Use Scenario: Field-oriented control (FOC) of 3-phase servo motors in packaging equipment with synchronized multi-axis motion.

IC Role / Device Role / Timing Role: Real-time motor control engine managing PWM generation, encoder feedback, and current sensing via dual ADCs.

Use Value: Four FlexPWMs with independent dead-time control and quadrature encoder inputs eliminate need for external gate drivers or position ICs.

Home Appliance Controller Smart Energy Gateway

Use Scenario: Washing machine main controller handling motor phase commutation, water level sensing, and BLE/Wi-Fi coexistence via UART-to-module bridge.

IC Role / Device Role / Timing Role: Central MCU coordinating sensor acquisition (ADC/ACMP), motor actuation (FlexPWM), and connectivity (UART/SPI to wireless SoC).

Use Value: Temperature sensor + programmable trip points enable thermal derating during high-load spin cycles without external monitoring IC.

Use Scenario: DIN-rail mounted energy meter gateway aggregating Modbus RTU data from submeters and forwarding via Ethernet to cloud platform.

IC Role / Device Role / Timing Role: Protocol translation hub with IEEE 1588 time-stamped event logging and secure OTA firmware delivery.

Use Value: Dual uSDHC supports redundant firmware partitioning; SNVS-RTC ensures accurate billing interval timestamps during power loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
MIMXRT1051DVJ6B Same core/peripherals but in 12 × 12 mm, 0.8 mm pitch MAPBGA - larger footprint, higher thermal mass. Suitable for designs requiring enhanced thermal dissipation or legacy board compatibility with 0.8 mm pitch routing. Select when PCB stack-up constraints allow larger BGA or when existing layout uses 12 × 12 mm land pattern.
MIMXRT1052DVL6B Includes LCDIF, CSI, and PXP graphics acceleration - adds ~100 mW typical active power and die area. Required for applications needing local display rendering (e.g., color GUI on TFT) or camera-based vision preprocessing. Choose only if display or image processing is mandatory; otherwise MIMXRT1051DVL6B offers lower cost and power.

Compared with MIMXRT1051DVJ6B, MIMXRT1051DVL6B enables denser PCB layouts and faster signal routing due to finer 0.65 mm pitch, while MIMXRT1052DVL6B trades off unnecessary graphics logic for added display functionality - making MIMXRT1051DVL6B optimal for non-visual embedded control where cost, size, and thermal efficiency are prioritized.

Availability

MIMXRT1051DVL6B is available at Aetrix Electronics and suitable for industrial HMI, motor control drive, and home appliance controller designs requiring stable component supply, long-term lifecycle assurance, and commercial-grade thermal performance (0 to +95 °C).

Supply support for MIMXRT1051DVL6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.

The i.MX RT series targets high-performance real-time applications bridging MCU simplicity and MPU capability; MIMXRT1051DVL6B specifically serves cost-optimized, display-free industrial control use cases demanding deterministic latency and integrated power management.

FAQ

What is the maximum operating frequency of the MIMXRT1051DVL6B?

The MIMXRT1051DVL6B operates at a maximum core frequency of 600 MHz, achieved using the Arm Cortex-M7 processor with integrated L1 caches and FPU. This frequency is guaranteed across the full commercial temperature range (0 to +95 °C) under specified voltage and cooling conditions per IMXRT1050CEC Rev. 2, Section 4.2.

Does the MIMXRT1051DVL6B include an LCD controller or camera interface?

No, the MIMXRT1051DVL6B explicitly omits LCDIF, CSI, and PXP modules as confirmed in Table 1 of IMXRT1050CEC Rev. 2. This distinguishes it from the MIMXRT1052DVL6B variant and makes it suitable for applications where display or imaging functions are handled externally or not required.

What power supply architecture does the MIMXRT1051DVL6B support?

The MIMXRT1051DVL6B integrates a DCDC converter and LDOs, allowing direct connection to a single 3.3 V input rail. The DCDC generates adjustable core voltage (0.9–1.3 V), while dedicated analog supplies (VDDA) and IO rails require separate 3.3 V regulation per datasheet Section 4.2 and Package Information Chapter 6.

How many USB interfaces does the MIMXRT1051DVL6B provide, and what PHY support is included?

The MIMXRT1051DVL6B includes two USB 2.0 On-The-Go (OTG) controllers, each with a fully integrated high-speed PHY. This eliminates the need for external transceivers and supports both host and device modes simultaneously - verified in Table 1 and Section 4.9 of IMXRT1050CEC Rev. 2.

Is the MIMXRT1051DVL6B pin-compatible with other i.MX RT1050 family members?

MIMXRT1051DVL6B shares the same 196-pin MAPBGA mechanical footprint and ball assignment with MIMXRT1051DVL6A and MIMXRT1052DVL6B, but differs electrically in peripheral enablement (e.g., LCD/CSI disabled). Pin compatibility is confirmed in NXP's i.MX RT1050 Package Information (Section 6.1), though functional substitution requires verification of feature alignment.

MIMXRT1051DVL6B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
196-LFBGA
Series:
RT1050
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
-
Program Memory Type:
External Program Memory
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MIMXRT1051DVL6B FAQ

1.How can I place an order for MIMXRT1051DVL6B through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMXRT1051DVL6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMXRT1051DVL6B reliable?

The price and inventory of MIMXRT1051DVL6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1051DVL6B is usually 5 days.

3.What payment methods are accepted for MIMXRT1051DVL6B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1051DVL6B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMXRT1051DVL6B?

MIMXRT1051DVL6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMXRT1051DVL6B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMXRT1051DVL6B?

For technical support, including MIMXRT1051DVL6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1051DVL6B requirements.

6.How does Aetrix verify that MIMXRT1051DVL6B is sourced from the original manufacturer or authorized distributors?

All MIMXRT1051DVL6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1051DVL6B meets industry standards.

7.What is the process for return or replacement of MIMXRT1051DVL6B?

All MIMXRT1051DVL6B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1051DVL6B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMXRT1051DVL6B part is unused and in its original packaging.

Return procedure for MIMXRT1051DVL6B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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