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NXP Semiconductors MIMXRT1052CVJ5B
- Part No.:
- MIMXRT1052CVJ5B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LFBGA
- Datasheet:
-
MIMXRT1052CVJ5B.pdf
- Description:
- IC MCU 32BIT 196MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:940
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Product details
Overview
MIMXRT1052CVJ5B from NXP Semiconductors is an Arm Cortex-M7-based crossover processor operating at 528 MHz, featuring 512 KB on-chip RAM (configurable as TCM or OCRAM), integrated DCDC/LDO power management, and full multimedia support including LCDIF, CSI, and PXP graphics acceleration. It targets industrial HMI, motor control, and smart home appliance designs requiring real-time performance with display and camera interfacing.
For engineers reviewing the MIMXRT1052CVJ5B datasheet, MIMXRT1052CVJ5B pinout, MIMXRT1052CVJ5B application, or MIMXRT1052CVJ5B equivalent, key selection criteria include its 12×12 mm 196-pin MAPBGA package, -40°C to +105°C industrial temperature rating, dual FlexCAN, quad FlexPWM, and hardware-accelerated security (HAB/DCP/BEE/TRNG/SNVS).
Technical Context
The MIMXRT1052CVJ5B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, and VFPv5 FPU, enabling deterministic real-time execution at 528 MHz. Its memory subsystem includes 96 KB boot ROM and 512 KB FlexRAM configurable across I-TCM, D-TCM, and OCRAM - critical for latency-sensitive TCM-resident code and data.
It integrates SEMC for SDRAM/NAND/NOR/PSRAM, dual uSDHC supporting eMMC 4.5 (200 MB/s) and SD 3.0 (100 MB/s), and FlexSPI for XIP-capable Quad SPI flash. Hardware peripherals include four FlexPWM modules (16-bit resolution, up to 8 channels each), four quadrature encoders, and three SAI modules supporting I2S/AC97/TDM audio protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Arm Cortex-M7 @ 528 MHz with 32 KB I-cache, 32 KB D-cache, and VFPv5 FPU - enables high-throughput signal processing and floating-point math without external coprocessor. |
| On-Chip Memory | 512 KB FlexRAM (configurable as I-TCM/D-TCM/OCRAM in 32 KB blocks) + 96 KB boot ROM - supports zero-wait-state TCM execution and flexible memory mapping for RTOS or bare-metal systems. |
| Display & Imaging | LCDIF (24-bit RGB, up to 1366×768), CSI (8/16/24-bit parallel), PXP (2D graphics engine with rotation, CSC, alpha blending) - enables local GUI rendering and camera preprocessing without GPU offload. |
| Security Acceleration | HAB (High Assurance Boot), DCP (AES-128/SHA-256/CRC-32), BEE (on-the-fly QSPI decryption), TRNG, SNVS (secure RTC + ZMK) - provides root-of-trust, encrypted firmware storage, and tamper-resistant runtime environment. |
| Power Management | Integrated DCDC converter (0.9–1.3 V output) and LDOs - eliminates need for external PMIC, simplifies power sequencing, and reduces BOM count in space-constrained industrial designs. |
| Industrial Interfaces | Dual FlexCAN 2.0B, eight UARTs (up to 20 Mbps), four I2C, four SPI, 10/100 ENET with IEEE 1588 - supports robust fieldbus communication, time-synchronized sensor networks, and legacy protocol bridging. |
| Package & Temp | 196-pin MAPBGA, 12×12 mm, 0.8 mm pitch; industrial grade (-40°C to +105°C) - ensures mechanical reliability and thermal stability in harsh factory-floor or automotive under-hood environments. |
Pinout & Package
196-pin MAPBGA, 12×12 mm body, 0.8 mm pitch, RoHS-compliant plastic package with exposed thermal pad (JEDEC MO-277 compliant). Pin assignments follow NXP's i.MX RT1050 reference layout; ball map includes dedicated VDD_SOC/VDD_ARM/VDDA domains, differential clock inputs (XTAL_IN/XTAL_OUT), and function-multiplexed pads for LCD/CSI/PWM/USB/ENET.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core logic supply | 1.0–1.25 V input for SoC logic domain; requires low-noise regulation and local decoupling per NXP layout guidelines. |
| VDD_ARM | CPU core supply | 0.9–1.3 V input for Cortex-M7 core; tied to internal DCDC output; must be filtered independently from VDD_SOC. |
| VDDA | Analog supply | 3.0–3.6 V input for ADC/ACMP/TSC; isolated analog rail essential for <12-bit ADC accuracy and touch sensing linearity. |
| XTAL_IN / XTAL_OUT | Primary oscillator interface | 32.768 kHz crystal connection for RTC; 24 MHz crystal for system clock - both require matched trace length and guard ring per datasheet Section 6.2. |
| USB_OTG1_DP / USB_OTG1_DM | USB 2.0 differential pair | Full-speed USB OTG interface with integrated PHY; requires 90 Ω differential impedance and ESD protection per USB-IF compliance. |
| ENET_RXD0–3 / TXD0–3 | Ethernet MAC interface | 10/100 Mbit/s RMII/MII signals; routed with controlled impedance (50 Ω single-ended, 100 Ω differential) and matched length for IEEE 1588 timestamp accuracy. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-accelerated 2D graphics (PXP) | Enables real-time image rotation, color-space conversion (RGB/YUV), and alpha-blended overlay at 1 pixel/clock - eliminates CPU load for GUI composition in HMI applications. |
| Quad FlexPWM with fault protection | Four independent PWM modules, each with up to 8 channels and 16-bit resolution - supports three-phase motor control with dead-time insertion and hardware fault shutdown. |
| Secure boot and runtime encryption | HAB validates signed firmware images; DCP encrypts/decrypts data; BEE decrypts QSPI flash on-the-fly - ensures firmware integrity and protects IP in production devices. |
| Integrated DCDC + LDO power system | Reduces external component count by >6 vs discrete PMIC solutions; supports dynamic voltage scaling and low-power stop modes with sub-μA retention current. |
| Flexible memory controller (SEMC) | Supports simultaneous SDRAM, NOR, NAND, and PSRAM on shared bus - enables cost-optimized memory architecture with expandable code/data storage in resource-constrained designs. |
Applications
| Industrial HMI | Smart Motor Drive |
|---|---|
|
Use Scenario: Touch-enabled operator panel with real-time status visualization, alarm logging, and parameter configuration in factory automation. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving 720p RGB LCD via LCDIF, capturing resistive touch via TSC, and communicating over CANopen/EtherCAT via FlexCAN/ENET. Use Value: PXP offloads GUI rendering; dual FlexCAN enables master/slave device coordination; integrated DCDC simplifies 24 V DC-powered enclosure design. |
Use Scenario: Compact servo drive controlling BLDC/PMSM motors with position feedback, current sensing, and safety monitoring. IC Role / Device Role / Timing Role: Real-time motion controller running field-oriented control (FOC) algorithms, generating PWM waveforms via FlexPWM, reading encoder pulses via ENC, and sampling analog currents via ADC. Use Value: 528 MHz M7 core executes FOC loops in <1 μs; hardware quadrature decoding eliminates CPU polling; 12-bit ADC with programmable gain supports ±10 V current shunt sensing. |
| Home Appliance Control | Edge-AI Vision Node |
|
Use Scenario: Smart refrigerator or washing machine with display, voice prompt, Wi-Fi connectivity, and sensor fusion (temp/humidity/motor vibration). IC Role / Device Role / Timing Role: Central MCU managing UI, sensor acquisition (ADC/ACMP/TSC), audio playback via SAI/MQS, and host interface to Wi-Fi module via UART/SDIO. Use Value: Integrated SAI and MQS eliminate external audio codec; TRNG and SNVS enable secure OTA updates; -40°C to +105°C rating covers condenser compartment extremes. |
Use Scenario: Low-cost vision sensor for occupancy detection or anomaly recognition using local neural network inference. IC Role / Device Role / Timing Role: Vision preprocessor capturing 640×480 video via CSI, applying PXP-based resizing/color correction, and feeding quantized CNN model (TensorFlow Lite Micro) in TCM-resident memory. Use Value: CSI+PXP pipeline achieves 30 fps preprocessing; 512 KB TCM allows full model + feature buffer residency; BEE secures model weights in external QSPI flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar crossover processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT1052CVL5B | Same core, memory, and peripheral set but in 10×10 mm 196-pin MAPBGA (0.65 mm pitch); lower thermal mass and smaller PCB footprint. | Better suited for space-constrained consumer or portable industrial devices where board area is premium. | Select MIMXRT1052CVL5B when layout density outweighs thermal margin; verify thermal pad soldering and power delivery for same 528 MHz operation. |
| MIMXRT1062CVJ5B | Higher-performance variant: 600 MHz Cortex-M7, dual-band 2.4/5 GHz Wi-Fi co-processor (NXP MW320), and enhanced crypto (AES-256, SHA-384). | Targets wireless-connected edge nodes requiring cloud integration, OTA security, and higher compute throughput. | Choose MIMXRT1062CVJ5B only if Wi-Fi/BLE connectivity and 600 MHz headroom are required; otherwise, MIMXRT1052CVJ5B offers better cost/performance for wired industrial use cases. |
Compared with MIMXRT1052CVJ5B, MIMXRT1052CVL5B trades thermal headroom for compactness, while MIMXRT1062CVJ5B adds wireless and cryptographic extensions at higher cost and power - making MIMXRT1052CVJ5B the optimal balance of display/audio/peripheral richness, industrial ruggedness, and BOM efficiency.
Availability
MIMXRT1052CVJ5B is available at Aetrix Electronics and suitable for industrial HMI, motor control, and smart home appliance designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production programs.
Supply support for MIMXRT1052CVJ5B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in Arm-based microcontrollers and crossover processors.
The i.MX RT series was designed as high-performance, real-time-capable crossover processors bridging the gap between MCUs and application processors - specifically targeting deterministic response, rich peripheral integration, and industrial-grade reliability without Linux complexity.
FAQ
What is the maximum operating frequency of the MIMXRT1052CVJ5B?
The MIMXRT1052CVJ5B operates at a maximum core frequency of 528 MHz. This speed is guaranteed across the full industrial temperature range (-40°C to +105°C) and under specified voltage conditions (VDD_ARM = 1.25 V). The frequency is derived from the internal PLL and is validated per NXP's IMXRT1050IEC datasheet Section 4.2.
Does the MIMXRT1052CVJ5B support external SDRAM?
Yes, the MIMXRT1052CVJ5B supports external SDRAM via its Smart External Memory Controller (SEMC). It interfaces with 8/16-bit SDRAM up to SDRAM-166 speed class, enabling up to 256 MB of expandable memory for frame buffers, audio streaming, or large data logging - all accessible with cache-coherent DMA transfers.
How does the MIMXRT1052CVJ5B handle secure boot and firmware updates?
The MIMXRT1052CVJ5B implements High Assurance Boot (HAB) to authenticate signed firmware images during startup, and supports encrypted firmware updates via the Data Co-Processor (DCP) and Bus Encryption Engine (BEE). Secure Non-Volatile Storage (SNVS) stores keys and maintains a secure RTC, ensuring end-to-end chain-of-trust from boot to runtime.
Can the MIMXRT1052CVJ5B drive a parallel RGB LCD display?
Yes, the MIMXRT1052CVJ5B includes a dedicated LCD Interface (LCDIF) supporting 8/16/24-bit parallel RGB output up to 1366×768 resolution (WXGA). It operates in both dumb (synchronous RGB) and smart (asynchronous 8080/MPU) modes, and pairs with the Pixel Processing Pipeline (PXP) for hardware-accelerated scaling and color conversion without CPU overhead.
What is the difference between MIMXRT1052CVJ5B and MIMXRT1051CVJ5B?
The MIMXRT1052CVJ5B includes LCDIF, CSI, and PXP graphics acceleration modules, while the MIMXRT1051CVJ5B omits these - making the MIMXRT1052CVJ5B suitable for display- and camera-enabled applications. Both share identical CPU, memory, security, and communication peripherals (FlexCAN, ENET, USB, etc.) and the same 12×12 mm 196-pin MAPBGA package.
MIMXRT1052CVJ5B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LFBGA
- Series:
- RT1050
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 528MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 127
- Program Memory Size:
- -
- Program Memory Type:
- External Program Memory
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT1052CVJ5B FAQ
1.How can I place an order for MIMXRT1052CVJ5B through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT1052CVJ5B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT1052CVJ5B reliable?
The price and inventory of MIMXRT1052CVJ5B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1052CVJ5B is usually 5 days.
3.What payment methods are accepted for MIMXRT1052CVJ5B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1052CVJ5B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT1052CVJ5B?
MIMXRT1052CVJ5B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT1052CVJ5B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT1052CVJ5B?
For technical support, including MIMXRT1052CVJ5B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1052CVJ5B requirements.
6.How does Aetrix verify that MIMXRT1052CVJ5B is sourced from the original manufacturer or authorized distributors?
All MIMXRT1052CVJ5B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1052CVJ5B meets industry standards.
7.What is the process for return or replacement of MIMXRT1052CVJ5B?
All MIMXRT1052CVJ5B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1052CVJ5B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT1052CVJ5B part is unused and in its original packaging.
Return procedure for MIMXRT1052CVJ5B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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