NXP Semiconductors MIMXRT1052DVJ6B
- Part No.:
- MIMXRT1052DVJ6B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LFBGA
- Datasheet:
-
MIMXRT1052DVJ6B.pdf
- Description:
- IC MCU 32BIT 196MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:229
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIMXRT1052DVJ6B from NXP Semiconductors is a 600 MHz Arm Cortex-M7 crossover processor with 512 KB on-chip RAM, integrated DCDC/LDO power management, and full multimedia support including LCDIF, CSI, and PXP graphics acceleration. It features dual USB 2.0 OTG with PHY, dual uSDHC (eMMC 4.5/SD 3.0), Ethernet with IEEE 1588, and hardware security (HAB/DCP/BEE/TRNG/SNVS). It targets high-performance industrial HMI and motor control systems requiring real-time response and rich peripheral integration.
For engineers reviewing the MIMXRT1052DVJ6B datasheet, MIMXRT1052DVJ6B pinout, MIMXRT1052DVJ6B application, or MIMXRT1052DVJ6B equivalent, key selection considerations include its 196-pin 10 × 10 mm MAPBGA package, 0–95 °C junction temperature rating, LCD/CSI/PXP enablement versus MIMXRT1051 variants, and FlexSPI + SEMC dual external memory controller capability for deterministic boot and code execution.
Technical Context
The MIMXRT1052DVJ6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, and VFPv5 FPU, operating at up to 600 MHz with full CoreSight debug support. Its memory subsystem includes 96 KB boot ROM and 512 KB flexibly allocatable on-chip RAM (TCM/OCRAM), managed by FlexRAM.
It integrates dual memory controllers-SEMC for SDRAM/NOR/NAND/PSRAM and FlexSPI for Quad SPI flash-with XIP support. Peripheral connectivity includes two FlexCAN 2.0B modules, eight LPUARTs, four LPI2Cs, four LPSPIs, three SAI audio interfaces, SPDIF, MQS, and four FlexPWMs with 16-bit resolution for motor control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Arm Cortex-M7 @ 600 MHz with FPU, MPU, 32 KB I/D cache |
| On-chip Memory | 512 KB RAM configurable as TCM/OCRAM; 96 KB boot ROM |
| External Memory Support | SEMC: SDRAM-166, NOR, NAND, PSRAM; FlexSPI: dual-channel Quad SPI with XIP |
| Graphics & Display | LCDIF supporting 1366×768 RGB; CSI parallel input up to 24-bit; PXP 2D accelerator |
| Security Features | HAB, DCP (AES-128/SHA-256), BEE (on-the-fly QSPI decryption), TRNG, SNVS, SJC |
| Package & Temp | 196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch; commercial grade (0–95 °C) |
| Power Management | Integrated DCDC + LDO; GPC hardware power controller; temperature sensor with trip points |
Pinout & Package
196-pin MAPBGA, 10 × 10 mm body, 0.65 mm pitch, RoHS-compliant plastic package with exposed thermal pad (per NXP Package Outline Drawing SOT1122-2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core Power Supply | 1.0–1.3 V supply for Cortex-M7 core and TCM; regulated by internal DCDC |
| VDD_USB | USB PHY Power | 3.3 V supply dedicated to integrated USB 2.0 OTG PHY blocks |
| VDDA | Analog Reference | 3.3 V analog supply for ADC, ACMP, and TSC; requires low-noise filtering |
| BOOT_MODE[1:0] | Boot Configuration | Strapped inputs determining boot source (FlexSPI, SEMC, SD, USB, etc.) at reset |
| ENET_RX_DATA[3:0] | Ethernet Receive Interface | 4-bit RMII receive data bus; supports IEEE 1588 timestamping via ENET_MAC |
| LCD_DATA[23:0] | Parallel RGB Display Bus | 24-bit pixel data interface supporting WXGA (1366×768) timing with programmable polarity/delay |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-accelerated 2D graphics | PXP engine enables real-time alpha blending, rotation, color-space conversion, and overlay without CPU load |
| Dual external memory controllers | SEMC + FlexSPI allow simultaneous execution from QSPI and buffering in SDRAM - critical for deterministic HMI rendering |
| Motor control peripherals | Four FlexPWM modules (up to 8 channels each, 16-bit resolution) with fault protection and quadrature encoder sync |
| Secure boot & runtime protection | HAB validates signed images; DCP/BEE encrypt/decrypt code/data; SNVS isolates secure RTC and keys |
| Low-power audio output | MQS generates stereo PWM audio directly on GPIO pins - eliminates need for external DAC in cost-sensitive designs |
Applications
| Industrial HMI | Smart Home Gateway |
|---|---|
Use Scenario: Touch-enabled panel with 720p display, real-time sensor dashboard, and local voice command processing. IC Role / Device Role / Timing Role: Primary application processor managing LCDIF, TSC, CSI (for optional camera), PXP compositing, and SAI audio playback. Use Value: Integrated PXP and LCDIF eliminate external display controller; 600 MHz M7 core handles UI logic and local inference with <100 µs interrupt latency. | Use Scenario: Central hub aggregating Zigbee/Z-Wave sensors, controlling lighting/motorized blinds, and streaming audio to speakers. IC Role / Device Role / Timing Role: System-on-chip host running RTOS, managing dual uSDHC (for local storage), Ethernet (for cloud sync), and FlexCAN (for legacy HVAC interface). Use Value: Dual uSDHC supports concurrent eMMC firmware partition and SD card logging; integrated DCDC reduces BOM count by 3 regulators. |
| Brushless Motor Drive | Edge AI Vision Node |
Use Scenario: 3-phase BLDC drive with field-oriented control (FOC), current sensing, and CAN-based diagnostics. IC Role / Device Role / Timing Role: Real-time motor controller using FlexPWM outputs, ADC sampling, ENC feedback, and CAN communication. Use Value: Four FlexPWM modules provide independent channel control with synchronized dead-time insertion; 12-bit ADC supports 1 µs conversion for current loop closure. | Use Scenario: Low-power vision node capturing 640×480 video via CSI, running lightweight CNN inference, and transmitting alerts over Ethernet. IC Role / Device Role / Timing Role: Vision SoC executing neural network kernels in TCM, feeding CSI frames to PXP for preprocessing, and offloading results via ENET. Use Value: CSI + PXP pipeline enables hardware-accelerated image resize/color conversion before inference; 512 KB TCM allows full model residency for zero DDR access latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar crossover processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT1052DVL6B | Same core, memory, and peripherals; differs only in 196-pin 10×10 mm (VJ) vs. 12×12 mm (VL) MAPBGA package | Requires PCB redesign due to larger footprint and 0.8 mm pitch; no functional change | Select when board layout accommodates 12×12 mm area and thermal dissipation benefits from larger pad exposure |
| MIMXRT1062DVJ6B | Same VJ package but adds 4 MB on-die HyperFlash SIP and enhanced security (CAAM), no LCD/CSI/PXP removed | Targeted at secure boot-critical applications without display/camera; higher BOM cost | Select when embedded root-of-trust and flash integration outweigh need for graphics/peripheral flexibility |
Compared with MIMXRT1052DVL6B, the MIMXRT1052DVJ6B saves 1.44 mm² PCB area and enables tighter routing density; compared with MIMXRT1062DVJ6B, it retains full multimedia capability at lower unit cost and power, making it optimal for display-rich edge devices.
Availability
MIMXRT1052DVJ6B is available at Aetrix Electronics and suitable for industrial HMI, motor control, smart home gateway, and edge vision applications requiring stable component supply, long-term manufacturability, and NXP's full ecosystem support.
Supply support for MIMXRT1052DVJ6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and crossover processors.
The i.MX RT1050 product line delivers high-performance real-time processing for resource-constrained edge applications, bridging the gap between traditional MCUs and application processors through Cortex-M7 performance with MCU-level power efficiency and toolchain simplicity.
FAQ
What is the maximum operating frequency of the MIMXRT1052DVJ6B?
The MIMXRT1052DVJ6B operates at a maximum core frequency of 600 MHz, achieved using the Arm Cortex-M7 processor with integrated L1 caches and FPU. This frequency is guaranteed across the full commercial temperature range (0–95 °C) under specified voltage and cooling conditions per the IMXRT1050CEC datasheet Section 4.2. The device supports dynamic frequency scaling via the CCM module for power optimization.
Does the MIMXRT1052DVJ6B support external SDRAM, and what interface does it use?
Yes, the MIMXRT1052DVJ6B supports external SDRAM via its Smart External Memory Controller (SEMC), which implements an 8/16-bit SDRAM interface compliant with SDRAM-166 timing. The SEMC supports burst lengths, auto-refresh, and programmable timing parameters, enabling direct connection to standard DDR1/DDR2-compatible SDRAM chips without external glue logic.
How does the MIMXRT1052DVJ6B differ from the MIMXRT1051DVJ6B in terms of peripheral integration?
The MIMXRT1052DVJ6B includes LCDIF, CSI, and PXP graphics acceleration modules not present in the MIMXRT1051DVJ6B. Both share identical core, memory, power, security, and communication peripherals (USB, Ethernet, CAN, UART, SPI, I2C), but only the "2" variant enables parallel display and camera interfaces required for HMI and vision applications.
What security features are implemented in hardware on the MIMXRT1052DVJ6B?
The MIMXRT1052DVJ6B integrates multiple hardware security blocks: High Assurance Boot (HAB) for signed image validation; Data Co-Processor (DCP) supporting AES-128 and SHA-256; Bus Encryption Engine (BEE) for on-the-fly QSPI decryption; Secure Non-Volatile Storage (SNVS) with tamper-resistant RTC and keys; and Secure JTAG Controller (SJC) with eFUSE-configurable access modes.
Is the MIMXRT1052DVJ6B pin-compatible with other i.MX RT105x variants in the same package option?
Yes, all i.MX RT105x parts with the "VJ" suffix (e.g., MIMXRT1051DVJ6B, MIMXRT1052DVJ6B) share identical 196-pin 10×10 mm MAPBGA pinout and electrical characteristics. Functionality differences (e.g., LCD/CSI presence) are enabled/disabled via internal configuration and do not affect pin assignment or signal compatibility.
MIMXRT1052DVJ6B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LFBGA
- Series:
- RT1050
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 127
- Program Memory Size:
- -
- Program Memory Type:
- External Program Memory
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT1052DVJ6B FAQ
1.How can I place an order for MIMXRT1052DVJ6B through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT1052DVJ6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT1052DVJ6B reliable?
The price and inventory of MIMXRT1052DVJ6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1052DVJ6B is usually 5 days.
3.What payment methods are accepted for MIMXRT1052DVJ6B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1052DVJ6B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT1052DVJ6B?
MIMXRT1052DVJ6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT1052DVJ6B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT1052DVJ6B?
For technical support, including MIMXRT1052DVJ6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1052DVJ6B requirements.
6.How does Aetrix verify that MIMXRT1052DVJ6B is sourced from the original manufacturer or authorized distributors?
All MIMXRT1052DVJ6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1052DVJ6B meets industry standards.
7.What is the process for return or replacement of MIMXRT1052DVJ6B?
All MIMXRT1052DVJ6B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1052DVJ6B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT1052DVJ6B part is unused and in its original packaging.
Return procedure for MIMXRT1052DVJ6B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIMXRT1052DVJ6B Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

