NXP Semiconductors MIMXRT1061DVL6B
- Part No.:
- MIMXRT1061DVL6B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LFBGA
- Datasheet:
-
MIMXRT1061DVL6B.pdf
- Description:
- IC MCU 32BIT 196MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:366
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Product details
Overview
MIMXRT1061DVL6B from NXP Semiconductors is a 600 MHz Arm Cortex-M7 crossover processor with MPU/FPU, 1 MB on-chip RAM (512 KB OCRAM + 512 KB TCM), integrated DCDC/LDO power management, and 127 GPIOs - deployed in industrial HMI, motor control, and home appliance systems requiring real-time responsiveness and secure boot.
For engineers reviewing the MIMXRT1061DVL6B datasheet, MIMXRT1061DVL6B pinout, MIMXRT1061DVL6B application, or MIMXRT1061DVL6B equivalent, this page delivers verified specifications, package mapping, functional differentiation from RT1062/RT1064 variants, and validated alternative parts for cost, feature, and footprint-aware selection.
Technical Context
The MIMXRT1061DVL6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, VFPv5 FPU, and MPU supporting up to 16 protection regions. It executes at 600 MHz with tightly coupled GPIOs and eDMA-driven peripheral offload.
Its memory subsystem includes 128 KB boot ROM, configurable FlexRAM (I-TCM/D-TCM/OCRAM), and SEMC for external SDRAM/NAND/NOR. Security is enforced via HAB, DCP (AES-128/SHA-256), BEE (on-the-fly QSPI decryption), TRNG, and SNVS-RTC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Arm Cortex-M7 @ 600 MHz with FPU, MPU, 32 KB I-cache, 32 KB D-cache |
| On-Chip Memory | 1 MB RAM: 512 KB OCRAM + 512 KB flexibly allocated as I-TCM/D-TCM |
| Package | 196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch - compact footprint for space-constrained PCBs |
| Power Management | Integrated DCDC regulator (0.9–1.3 V output) and LDOs - eliminates need for external PMIC |
| Security Features | HAB, DCP (AES-128/SHA-256), BEE (QSPI flash decryption), TRNG, SNVS-RTC |
| I/O & Peripherals | 127 GPIOs (124 tightly coupled), FlexCAN ×2 (one with FD), USB OTG ×2, Ethernet ×2, UART ×8, SAI ×3, ADC ×2 (20-channel), FlexPWM ×4 |
| Temperature Range | 0 °C to +95 °C junction - commercial-grade operation for indoor embedded applications |
Pinout & Package
196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch - RoHS-compliant plastic package with exposed thermal pad for thermal dissipation in high-throughput MCU applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core Power Supply | 1.0–1.3 V input for Arm core and internal logic; requires local decoupling per datasheet layout guidelines |
| VDDA | Analog Power Supply | 3.3 V analog domain supply for ADC/ACMP; must be filtered separately from digital rails |
| BOOT_MODE0 / BOOT_MODE1 | Boot Configuration | Strapped inputs determining boot source (FlexSPI, SD, USB, etc.); require pull-up/pull-down resistors per Table 5-1 |
| ENET_RX_DATA0–3 | Ethernet PHY Interface | Differential receive data lines for 10/100 Mbps IEEE 802.3 MAC; routed as controlled-impedance pairs |
| USB_OTG1_DP / USB_OTG1_DM | USB 2.0 Differential Pair | Full-speed USB OTG interface with integrated PHY - no external transceiver required |
| WDOG_B | Watchdog Reset Output | Active-low system reset signal asserted on watchdog timeout; drives external reset supervisor or power sequencer |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCDC + LDO | Reduces external power components by >50% and simplifies power sequencing versus discrete regulator solutions |
| Secure Boot (HAB) | Enables authenticated firmware loading from untrusted media - mandatory for OTA update integrity in consumer devices |
| eDMA Engine (32-channel) | Offloads CPU from peripheral data movement (e.g., ADC → RAM, SAI → buffer), freeing M7 core for deterministic real-time tasks |
| FlexPWM ×4 (16-bit) | Supports 8 independent PWM channels with dead-time insertion and fault monitoring - suitable for 3-phase motor gate drive |
| Quad Timer ×4 (16-bit) | Provides quadrature decoding for encoder-based position feedback and precise timing capture in motion control loops |
Applications
| Industrial HMI | Smart Home Appliance Control |
|---|---|
Use Scenario: Touch-enabled panel controlling HVAC, lighting, and security subsystems in residential buildings. IC Role / Device Role / Timing Role: Main application processor handling GUI rendering (via MQS/SAI), sensor fusion (ADC/ACMP), and local decision logic with sub-100 µs interrupt latency. Use Value: Integrated 1 MB RAM enables dual-buffered UI rendering without external SDRAM; DCDC reduces BOM count and thermal load. |
Use Scenario: Washing machine main controller managing motor phase commutation, water level sensing, and BLE/Wi-Fi connectivity. IC Role / Device Role / Timing Role: Real-time motor control hub executing FOC algorithms on Cortex-M7 while managing communication stacks via FlexCAN/UART. Use Value: Four FlexPWM modules deliver synchronized 16-bit gate drive signals; integrated ADC supports direct current sensing without external amplifiers. |
| Factory Automation Gateway | Edge-AI Sensor Node |
Use Scenario: Protocol translator bridging Modbus RTU field devices to MQTT cloud infrastructure via Ethernet/USB. IC Role / Device Role / Timing Role: Dual-role processor running deterministic Modbus stack on M7 core while hosting Linux-compatible RTOS for network stack offload. Use Value: Two 10/100M Ethernet controllers enable redundant LAN links; FlexIO supports custom serial protocols without FPGA co-processor. |
Use Scenario: Voice-controlled smart speaker using local wake-word detection before streaming audio to cloud. IC Role / Device Role / Timing Role: Audio preprocessing engine performing noise suppression and keyword spotting on raw SAI input prior to encryption and transmission. Use Value: DCP accelerates AES-128 encryption of voice payloads; TRNG seeds secure session keys for TLS handshake. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar crossover processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT1062DVL6B | Includes LCDIF, CSI, and PXP graphics acceleration blocks not present in MIMXRT1061DVL6B | Required for RGB display or camera-based vision applications; adds ~$0.80 BOM cost and 0.5 mm² PCB area | Select when display/video pipeline is needed; otherwise MIMXRT1061DVL6B offers lower cost and identical compute/peripheral set for headless control. |
| MIMXRT1052DVL6B | Lower 500 MHz core speed, 512 KB RAM, no FlexCAN FD, reduced FlexPWM count (×2), no BEE or SNVS | Suitable for non-security-critical, lower-performance motor control or sensor aggregation where AES/SHA acceleration is unnecessary | Choose for cost-sensitive designs lacking secure boot or high-bandwidth encrypted storage requirements. |
Compared with MIMXRT1062DVL6B, MIMXRT1061DVL6B removes display/camera hardware to reduce cost and power while retaining full real-time control capability; versus MIMXRT1052DVL6B, it delivers 20% higher CPU throughput, double RAM, and certified cryptographic acceleration for secure edge deployment.
Availability
MIMXRT1061DVL6B is available at Aetrix Electronics and suitable for industrial HMI, motor control, and home appliance applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized NXP channels.
Supply support for MIMXRT1061DVL6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.
The i.MX RT series targets high-performance, real-time embedded applications where MCU simplicity meets application-processor capability - designed specifically for deterministic control, rich peripheral integration, and hardware-accelerated security in resource-constrained edge nodes.
FAQ
What is the maximum operating frequency of the MIMXRT1061DVL6B?
The MIMXRT1061DVL6B operates at a maximum core frequency of 600 MHz. This speed is guaranteed across its specified commercial temperature range (0 °C to +95 °C junction). The Arm Cortex-M7 core achieves this performance with 32 KB instruction and data caches, enabling high instruction-per-cycle efficiency in real-time control and signal processing workloads. MIMXRT1061DVL6B maintains this frequency without thermal throttling under typical board-level cooling conditions.
Does the MIMXRT1061DVL6B support secure boot and cryptographic acceleration?
Yes, the MIMXRT1061DVL6B includes High Assurance Boot (HAB) for authenticated firmware loading, Data Co-Processor (DCP) supporting AES-128 (ECB/CBC) and SHA-256, Bus Encryption Engine (BEE) for on-the-fly QSPI flash decryption, True Random Number Generator (TRNG), and Secure Non-Volatile Storage (SNVS) with RTC. These features are silicon-verified and enabled in production silicon - MIMXRT1061DVL6B delivers end-to-end hardware-rooted security without external co-processors.
How does the MIMXRT1061DVL6B differ from the MIMXRT1062DVL6B?
The MIMXRT1061DVL6B omits the LCDIF, CSI, and PXP modules present in the MIMXRT1062DVL6B - making it functionally identical for headless control applications but lower-cost and lower-power. Both share identical CPU, RAM, peripherals (FlexCAN ×2, USB ×2, Ethernet ×2, FlexPWM ×4), and security blocks. MIMXRT1061DVL6B is selected when display or camera interfaces are unnecessary, preserving design flexibility and reducing BOM cost.
What package type and pin count does the MIMXRT1061DVL6B use?
The MIMXRT1061DVL6B uses a 196-pin MAPBGA package measuring 10 mm × 10 mm with 0.65 mm ball pitch. This compact footprint supports high-density PCB layouts while maintaining thermal performance via an exposed die paddle. Pin assignments match the i.MX RT1060 family's standardized IOMUXC mapping - allowing reuse of reference schematics and layout patterns across compatible derivatives like MIMXRT1062DVL6B.
Can the MIMXRT1061DVL6B interface directly with SDRAM and Quad SPI flash?
Yes, the MIMXRT1061DVL6B integrates a System External Memory Controller (SEMC) supporting 8/16-bit SDRAM up to 133 MHz and two FlexSPI controllers for dual-channel Quad SPI NOR/NAND flash with XIP capability. These interfaces are production-validated and supported in NXP's MCUXpresso SDK - MIMXRT1061DVL6B boots directly from FlexSPI flash and executes code from SDRAM without external glue logic.
MIMXRT1061DVL6B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LFBGA
- Series:
- RT1060
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 127
- Program Memory Size:
- -
- Program Memory Type:
- External Program Memory
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT1061DVL6B FAQ
1.How can I place an order for MIMXRT1061DVL6B through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT1061DVL6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT1061DVL6B reliable?
The price and inventory of MIMXRT1061DVL6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1061DVL6B is usually 5 days.
3.What payment methods are accepted for MIMXRT1061DVL6B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1061DVL6B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT1061DVL6B?
MIMXRT1061DVL6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT1061DVL6B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT1061DVL6B?
For technical support, including MIMXRT1061DVL6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1061DVL6B requirements.
6.How does Aetrix verify that MIMXRT1061DVL6B is sourced from the original manufacturer or authorized distributors?
All MIMXRT1061DVL6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1061DVL6B meets industry standards.
7.What is the process for return or replacement of MIMXRT1061DVL6B?
All MIMXRT1061DVL6B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1061DVL6B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT1061DVL6B part is unused and in its original packaging.
Return procedure for MIMXRT1061DVL6B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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