NXP Semiconductors MIMXRT1062DVN6B

Overview

MIMXRT1062DVN6B from NXP Semiconductors is a 600 MHz Arm Cortex-M7 crossover processor with 1 MB on-chip RAM (512 KB TCM/OCRAM configurable + 512 KB dedicated OCRAM), integrated DCDC/LDO power management, dual FlexSPI, dual uSDHC, dual 10/100 Ethernet with IEEE 1588, and dual FlexCAN (one supporting CAN FD). It serves as the central compute and interface hub in industrial HMI and motor control systems requiring real-time responsiveness, secure boot, and rich peripheral integration.

For engineers reviewing the MIMXRT1062DVN6B datasheet, MIMXRT1062DVN6B pinout, MIMXRT1062DVN6B application, or MIMXRT1062DVN6B equivalent, key selection criteria include its 225-pin BGA package (13 × 13 mm, 0.8 mm pitch), commercial temperature grade (0 to +95 °C), dual USB OTG with PHY, 149 GPIOs (146 tightly coupled), and hardware-accelerated security including HAB, DCP (AES-128/SHA-256), BEE, and TRNG.

Technical Context

The MIMXRT1062DVN6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, and full VFPv5 FPU, operating at up to 600 MHz with MPU support for 16 protection regions. Its memory subsystem includes 128 KB boot ROM and flexible on-chip RAM allocation managed by FlexRAM.

System-level integration includes dual SEMC-compatible external memory interfaces (SDRAM/NAND/NOR/Quad SPI), three SAI modules supporting I2S/TDM/AC97, PXP 2D graphics accelerator, CSI parallel camera interface (up to 24-bit), LCDIF controller, and four FlexPWM modules (16-bit resolution, up to 8 channels each) optimized for motor control feedback and commutation.

Key Specifications

Pinout & Package

225-ball BGA package (13 × 13 mm, 0.8 mm pitch) with defined supply, ground, functional, and debug ball assignments per NXP's official ball map (Section 6.1.3, DS Rev. 1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Compared with MIMXRT1062DVN6B, MIMXRT1064DVL6B provides scalable RAM and display capability for advanced UIs, while MIMXRT1052CVL5B reduces feature count and clock speed for entry-level applications-both retain pin-compatible packaging but differ in memory architecture, peripheral set, and security module inclusion.

Availability

MIMXRT1062DVN6B is available at Aetrix Electronics and suitable for industrial HMI, motor control, and smart home appliance designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MIMXRT1062DVN6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and crossover processors.

The i.MX RT series targets high-performance, real-time embedded applications bridging the gap between MCUs and application processors-designed specifically for deterministic response, rich peripheral integration, and hardware-enforced security in resource-constrained edge devices.

FAQ

What is the maximum operating frequency of the MIMXRT1062DVN6B?

The MIMXRT1062DVN6B operates at a maximum frequency of 600 MHz on its Arm Cortex-M7 core. This speed is guaranteed across the commercial temperature range (0 to +95 °C) under specified voltage and cooling conditions. The core includes 32 KB instruction and 32 KB data caches plus a full VFPv5 floating-point unit, enabling high-throughput deterministic execution for real-time control and signal processing tasks. All timing-critical peripherals-including FlexPWM, ENC, and GPT-are synchronized to this clock domain.

Does the MIMXRT1062DVN6B support CAN FD, and how is it implemented?

Yes, the MIMXRT1062DVN6B includes one FlexCAN module supporting CAN FD (Flexible Data-Rate), compliant with ISO 11898-1:2015. It enables payloads up to 64 bytes transmitted at bit rates up to 8 Mbps in the data phase, while maintaining backward compatibility with classical CAN 2.0B frames. The second FlexCAN module supports only standard CAN 2.0B. Both modules share the same register set and interrupt structure, allowing software reuse, but CAN FD requires separate message buffer configuration and enhanced bit-timing setup per ISO 11898-1 Annex C.

How is power management handled on the MIMXRT1062DVN6B?

The MIMXRT1062DVN6B integrates a fully featured on-chip DCDC converter and multiple LDOs, eliminating the need for external PMICs in most designs. The DCDC supports 3.3 V input and delivers adjustable 0.9–1.3 V output for core logic, with dedicated low-power standby mode (0.9–1.0 V). Power sequencing is simplified via internal GPC hardware controller, which manages domain isolation, clock gating, and state retention during stop modes. Thermal monitoring and over-current/voltage protection are built-in, and the integrated temperature sensor feeds real-time data to software for dynamic frequency scaling.

What types of external memory interfaces does the MIMXRT1062DVN6B support?

The MIMXRT1062DVN6B supports multiple external memory standards via dedicated controllers: SEMC handles 8/16-bit SDRAM (up to 133/166 MHz), parallel NOR/NAND flash, PSRAM, and 8080 display interfaces; two FlexSPI controllers support Quad/Octal/HyperFlash and RAM with XIP capability; dual uSDHC interfaces comply with eMMC 4.5 (HS200, up to 200 MB/s) and SD/SDIO 3.0 (100 MB/s). These interfaces can operate concurrently, enabling hybrid storage architectures-for example, booting from FlexSPI flash while running code from SDRAM and logging to eMMC.

Is the MIMXRT1062DVN6B pin-compatible with other i.MX RT1060 series variants?

Yes, the MIMXRT1062DVN6B shares the same 225-pin BGA package (13 × 13 mm, 0.8 mm pitch) and pinout with other i.MX RT1060X derivatives in the DVN6B suffix family, including MIMXRT1064DVL6B. Signal assignments for power, ground, clocks, JTAG, USB, Ethernet, and major peripherals are identical. However, some balls designated as GPIO or alternate functions may differ in availability or muxing options between variants-always verify against the specific part's "Ball Assignment" table (Section 6.1.2) and "Functional Contact Assignments" (Section 6.1.3) in the official datasheet before PCB layout.