NXP Semiconductors MIMXRT1064DVL6B
- Part No.:
- MIMXRT1064DVL6B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LFBGA
- Datasheet:
-
MIMXRT1064DVL6B.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 196MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MIMXRT1064DVL6B from NXP Semiconductors is a crossover MCU based on the Arm Cortex-M7 core operating at 600 MHz, integrating 4 MB on-chip Flash, 1 MB on-chip RAM (512 KB configurable as TCM), dual USB 2.0 HS OTG with PHY, two 10/100M Ethernet controllers with IEEE 1588 support, and hardware-accelerated security including HAB, DCP (AES-128/SHA-256), BEE, and TRNG - deployed in industrial HMI and motor control systems.
For engineers reviewing the MIMXRT1064DVL6B datasheet, MIMXRT1064DVL6B pinout, MIMXRT1064DVL6B application, or MIMXRT1064DVL6B equivalent, key selection criteria include its 196-pin 10×10 mm MAPBGA package, 600 MHz real-time performance, integrated DCDC/LDO power management, FlexPWM for servo drive timing, and dual FlexCAN FD interfaces supporting up to 8 Mbps payload.
Technical Context
The MIMXRT1064DVL6B implements a single Arm Cortex-M7 core with 32 KB I-cache, 32 KB D-cache, VFPv5 FPU, and MPU supporting 16 protection regions. Its memory subsystem includes boot ROM (128 KB), 4 MB Flash, and 1 MB SRAM split into 512 KB OCRAM + 512 KB TCM/OCRAM flexible allocation.
Peripherals are organized via centralized IOMUXC with 127 GPIOs (124 tightly coupled), four FlexPWM modules (8 channels total, 16-bit resolution), four Quad Timers with quadrature decoding, and dual uSDHC controllers supporting eMMC 4.5 (200 MB/s) and SD 3.0 (100 MB/s). Security is enforced through HAB boot validation, DCP crypto acceleration, and BEE on-the-fly QSPI decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ 600 MHz - delivers deterministic real-time response with full FPU and MPU for safety-critical firmware execution. |
| On-chip Memory | 4 MB Flash + 1 MB SRAM (512 KB OCRAM + 512 KB TCM/OCRAM) - enables XIP from Flash and low-latency code/data access in TCM. |
| Package | 196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch - supports compact PCB layout with thermal pad for industrial ambient (0–85°C). |
| Power Management | Integrated DCDC + LDO - eliminates external PMIC, simplifies power sequencing, and reduces BOM count for cost-sensitive designs. |
| Security Acceleration | HAB, DCP (AES-128/SHA-256), BEE, TRNG, SNVS - enables secure boot, encrypted firmware updates, and tamper-resistant RTC operation. |
| Motor Control Peripherals | 4 × FlexPWM (8 channels, 16-bit), 4 × Quadrature Encoder Interfaces - provides synchronized PWM generation and shaft position feedback without CPU overhead. |
| Connectivity | 2 × FlexCAN FD (8 Mbps), 2 × 10/100M Ethernet w/ IEEE 1588, 2 × USB 2.0 HS OTG, 2 × uSDHC - supports industrial fieldbus bridging and time-synchronized networked control. |
Pinout & Package
196-pin MAPBGA, 10 × 10 mm, 0.65 mm pitch, with exposed thermal pad - optimized for thermal dissipation in continuous industrial operation and compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core logic supply | Accepts regulated 0.9–1.3 V from internal DCDC; powers Cortex-M7, caches, and TCM. |
| VDDA | Analog supply | Separate 3.3 V input for ADC, ACMP, and temperature sensor - isolates noise-sensitive analog circuits. |
| BOOT_MODE[1:0] | Boot configuration | Strapped at reset to select boot source (e.g., FlexSPI NOR, SD card, or USB); determines initial execution path. |
| ENET1_RX_DATA[3:0] | Ethernet receive interface | 4-bit RMII receive data bus - enables IEEE 1588 timestamp capture with sub-microsecond precision. |
| FLEXCAN1_TX / FLEXCAN1_RX | CAN FD differential pair | Direct connection to CAN transceiver; supports 8 Mbps data phase and ISO 11898-1 compliant signaling. |
| WDOG_B | Watchdog reset output | Active-low open-drain signal asserting system reset if WDOG1/WDOG2 not serviced within timeout window. |
Key Features
| Feature | Design Value |
|---|---|
| FlexRAM Configuration | Runtime-reconfigurable 1 MB SRAM partitioning between I-TCM, D-TCM, and OCRAM in 32 KB increments - optimizes cache vs. DMA buffer trade-offs per application phase. |
| Quad Timer Quadrature Decode | Hardware-accelerated position/speed measurement using PHASEA/PHASEB inputs - offloads CPU from high-frequency encoder polling. |
| PXP 2D Graphics Engine | Pixel-per-clock processing for rotation, alpha blending, and color-space conversion - enables smooth GUI rendering on RGB888 displays up to WXGA resolution. |
| SAI Audio Interface | Three SAI modules supporting I2S/AC97/TDM - allows simultaneous audio playback, recording, and codec interfacing without shared resource contention. |
| Temperature Sensor | On-die sensor with programmable trim points - enables closed-loop thermal management of DCDC output voltage and system throttling. |
Applications
| Industrial HMI | Brushless Motor Drive |
|---|---|
Use Scenario: Touch-enabled panel controlling PLC I/O, displaying real-time process variables, and logging events to eMMC. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving 24-bit RGB LCD via LCDIF, sampling resistive touch via TSC, and managing secure firmware updates over uSDHC. Use Value: Integrated 4 MB Flash eliminates external storage for bootloader and UI assets; PXP engine renders anti-aliased widgets at 60 fps without frame buffer overflow. | Use Scenario: Field-oriented control (FOC) of 3-phase BLDC motors in HVAC compressors with current sensing and thermal monitoring. IC Role / Device Role / Timing Role: Real-time controller generating synchronized 16-bit PWM waveforms via FlexPWM, capturing encoder position via Quad Timer, and regulating DCDC output based on die temperature. Use Value: 600 MHz Cortex-M7 executes FOC loop in < 1.2 µs; hardware quadrature decode ensures ±1-count position accuracy at 100 kRPM. |
| Smart Home Gateway | Networked Power Meter |
Use Scenario: Multi-protocol hub connecting Zigbee, BLE, and Wi-Fi modules while hosting local web UI and OTA update server. IC Role / Device Role / Timing Role: Secure application host running Linux Lite, authenticating firmware images via HAB, encrypting cloud payloads with DCP, and routing traffic between Ethernet and UART-connected radios. Use Value: Dual uSDHC supports concurrent SD card logging and eMMC-based rootfs; BEE decrypts QSPI-resident OTA packages on-the-fly during installation. | Use Scenario: DIN-rail mounted meter aggregating current/voltage samples from isolated ADCs and reporting kWh data via IEEE 1588-synchronized Ethernet. IC Role / Device Role / Timing Role: Time-critical data concentrator using ENET1's hardware timestamp unit to align phasor measurements across distributed sensors with < 100 ns jitter. Use Value: Dual Ethernet MACs enable redundant upstream links; integrated temperature sensor calibrates ADC gain drift across 0–85°C ambient range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar crossover MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT1064DVJ6B | Same core, memory, and peripheral set but in 12×12 mm, 0.8 mm pitch MAPBGA - larger footprint, higher thermal mass. | Preferred for designs requiring enhanced thermal margin or legacy 0.8 mm pitch assembly lines. | Select when board space permits larger package and thermal design prioritizes steady-state dissipation over transient response. |
| MIMXRT1052DVL6B | Omits 2 MB Flash (2 MB total), no DCDC regulator, no SNVS/RTC, and reduced security accelerators (no BEE, limited DCP modes). | Suitable for cost-optimized consumer HMI where external Flash and discrete power management are acceptable. | Choose only if Flash size, integrated power, and cryptographic features are non-critical and BOM cost reduction outweighs design complexity increase. |
Compared with MIMXRT1064DVJ6B, the MIMXRT1064DVL6B offers tighter PCB area usage and faster thermal response; versus MIMXRT1052DVL6B, it delivers full security stack, on-chip power regulation, and double Flash capacity - essential for certified industrial firmware deployments.
Availability
MIMXRT1064DVL6B is available at Aetrix Electronics and suitable for industrial HMI, brushless motor control, smart home gateways, and networked power metering requiring stable component supply across multi-year production cycles.
Supply support for MIMXRT1064DVL6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based MCUs and edge AI processing.
The i.MX RT series targets high-performance real-time applications demanding MCU simplicity with MPU-level capabilities - the MIMXRT1064DVL6B specifically bridges the gap between traditional microcontrollers and application processors for deterministic, secure, and graphics-capable edge devices.
FAQ
What is the maximum operating frequency of the MIMXRT1064DVL6B?
The MIMXRT1064DVL6B operates at a maximum core frequency of 600 MHz, as confirmed in Table 1 of the IMXRT1064CEC datasheet Rev. 3. This frequency is sustained under commercial temperature conditions (0–85°C junction) with appropriate voltage regulation via the integrated DCDC converter. The MIMXRT1064DVL6B achieves this speed using the Arm Cortex-M7 core with dual 32 KB caches and hardware floating-point unit, enabling deterministic real-time execution without dynamic frequency scaling.
Does the MIMXRT1064DVL6B support IEEE 1588 Precision Time Protocol?
Yes, the MIMXRT1064DVL6B integrates two 10/100M Ethernet controllers (ENET1 and ENET2) with dedicated hardware timestamp units compliant with IEEE 1588-2008. Each MAC supports hardware timestamping of ingress/egress frames with sub-microsecond resolution, enabling synchronization accuracy critical for industrial automation and power grid monitoring. This capability is documented in Section 4.4 ("System modules") and Figure 2 of the IMXRT1064CEC datasheet, and applies specifically to the MIMXRT1064DVL6B variant.
How much on-chip Flash and RAM does the MIMXRT1064DVL6B include?
The MIMXRT1064DVL6B includes 4 MB of on-chip Flash memory and 1 MB of on-chip SRAM. Of the SRAM, 512 KB is flexibly allocatable between instruction TCM (ITCM), data TCM (DTCM), and general-purpose OCRAM in 32 KB granularity, while the remaining 512 KB is fixed as OCRAM. This configuration is explicitly listed for MIMXRT1064DVL6B in Table 1 of the IMXRT1064CEC datasheet and enables XIP execution, low-latency interrupt handling, and large DMA buffers - all integral to the MIMXRT1064DVL6B's real-time performance profile.
What security features are implemented in hardware on the MIMXRT1064DVL6B?
The MIMXRT1064DVL6B implements multiple hardware security accelerators: High Assurance Boot (HAB) for authenticated boot, Data Co-Processor (DCP) supporting AES-128 (ECB/CBC) and SHA-256, Bus Encryption Engine (BEE) for on-the-fly QSPI Flash decryption, True Random Number Generator (TRNG), and Secure Non-Volatile Storage (SNVS) with secure RTC. These features are confirmed in Table 1 and Section 1.1 of the IMXRT1064CEC datasheet and are active in the MIMXRT1064DVL6B without software emulation - enabling secure firmware updates, encrypted storage, and tamper-resistant timekeeping.
Is the MIMXRT1064DVL6B pin-compatible with other i.MX RT1064 variants like MIMXRT1064DVJ6B?
No, the MIMXRT1064DVL6B is not pin-compatible with MIMXRT1064DVJ6B. Although both share identical functionality and electrical specifications, they use different packages: MIMXRT1064DVL6B uses a 196-pin 10×10 mm MAPBGA with 0.65 mm pitch, while MIMXRT1064DVJ6B uses a 196-pin 12×12 mm MAPBGA with 0.8 mm pitch. Pin assignments differ due to distinct ball maps - confirmed in Sections 7.1 and 7.2 of the IMXRT1064CEC datasheet. Therefore, PCB redesign is required when substituting between these variants, and the MIMXRT1064DVL6B requires its own dedicated footprint.
MIMXRT1064DVL6B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LFBGA
- Series:
- RT1064
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 127
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT1064DVL6B FAQ
1.How can I place an order for MIMXRT1064DVL6B through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT1064DVL6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT1064DVL6B reliable?
The price and inventory of MIMXRT1064DVL6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1064DVL6B is usually 5 days.
3.What payment methods are accepted for MIMXRT1064DVL6B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1064DVL6B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT1064DVL6B?
MIMXRT1064DVL6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT1064DVL6B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT1064DVL6B?
For technical support, including MIMXRT1064DVL6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1064DVL6B requirements.
6.How does Aetrix verify that MIMXRT1064DVL6B is sourced from the original manufacturer or authorized distributors?
All MIMXRT1064DVL6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1064DVL6B meets industry standards.
7.What is the process for return or replacement of MIMXRT1064DVL6B?
All MIMXRT1064DVL6B units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1064DVL6B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT1064DVL6B part is unused and in its original packaging.
Return procedure for MIMXRT1064DVL6B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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