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NXP Semiconductors MIMXRT1176AVM8AR
- Part No.:
- MIMXRT1176AVM8AR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 289-LFBGA
- Datasheet:
-
MIMXRT1176AVM8AR.pdf
- Description:
- IC MCU 32BIT EXT MEM 289MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,639
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Product details
Overview
MIMXRT1176AVM8AR from NXP Semiconductors is an automotive-qualified dual-core crossover processor integrating an 800 MHz Arm Cortex-M7 and a 400 MHz Arm Cortex-M4, with 2 MB on-chip SRAM (1.75 MB with ECC), dual FlexSPI interfaces, three FlexCAN-FD controllers, and hardware-accelerated security including CAAM and HAB. It targets high-reliability industrial HMI and automotive instrument cluster applications requiring deterministic real-time control and rich multimedia I/O.
For engineers reviewing the MIMXRT1176AVM8AR datasheet, MIMXRT1176AVM8AR pinout, MIMXRT1176AVM8AR application, or MIMXRT1176AVM8AR equivalent, key selection considerations include its -40°C to +125°C junction temperature rating, 289-pin MAPBGA package with 0.8 mm pitch, dual Ethernet support (10/100M with IEEE 1588 and 1 Gb with AVB), and full automotive qualification per AEC-Q100 Grade 2.
Technical Context
The MIMXRT1176AVM8AR implements a tightly coupled dual-core architecture where the Cortex-M7 executes high-performance application code and graphics processing while the Cortex-M4 handles real-time control tasks, communication stack offload, and safety-critical functions. Core isolation is enforced via RDC and SEMA4 hardware modules.
Its memory subsystem includes 512 KB configurable TCM (shared between cores), 1.25 MB OCRAM, 256 KB boot ROM, and 4 KB secure always-on RAM. Power management integrates on-die DCDC and LDO regulators, enabling simplified external power supply design and precise voltage sequencing for automotive-grade reliability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual-core: 800 MHz Arm Cortex-M7 + 400 MHz Arm Cortex-M4, each with FPU, MPU, and cache (32 KB I/D cache on M7, 16 KB I/D cache on M4) |
| On-chip Memory | 2 MB SRAM total: 512 KB configurable as TCM (M7/M4 shared), 256 KB M4 TCM, 1.25 MB OCRAM, plus 256 KB boot ROM and 4 KB secure RAM |
| Temperature Range | -40°C to +125°C junction temperature, AEC-Q100 Grade 2 qualified for automotive use |
| Package | 289-pin MAPBGA, 14 mm × 14 mm, 0.8 mm pitch - enables high I/O density while meeting automotive thermal and mechanical robustness requirements |
| Security Features | HAB v4, CAAM with PKHA/RNG4/AES-128/SHA-2, OTFAD, IEE, SNVS with SRTC, PUF, and secure key management - supports secure boot and encrypted XIP |
| Connectivity | 3× FlexCAN-FD, 2× USB 2.0 OTG (with PHY), 2× uSDHC (eMMC 5.0 HS400, SD 3.0), 12× UART, 6× I²C, 6× SPI, 1× 10/100M ENET (IEEE 1588), 1× 1Gb ENET (AVB), 1× 1Gb ENET (TSN) |
| Display & Camera | Parallel LCD (eLCDIF, up to WXGA@60fps), LCDIFv2 (8-layer alpha blending), MIPI DSI (2-lane, 1.5 Gbps), MIPI CSI (2-lane, 1.5 Gbps), parallel CSI |
Pinout & Package
289-pin plastic MAPBGA package, 14 mm × 14 mm body size, 0.8 mm ball pitch, RoHS-compliant, designed for automotive PCB assembly and thermal cycling reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Core power supply | 1.0 V ±3% supply for Cortex-M7/M4 logic; requires low-noise regulation and local decoupling |
| VDD_ARM | ARM core voltage rail | 1.1 V ±3% supply for Cortex-M7 core; tied to VDD_SOC in most configurations but supports independent scaling |
| VDDA_3P3 | Analog I/O supply | 3.3 V analog domain for ADC, DAC, comparators, and analog I/O buffers; must be isolated from digital noise |
| BOOT_MODE0–3 | Boot configuration inputs | Strapped at power-up to select boot source (FlexSPI, SD, NAND, etc.); internal pull-ups enable default FlexSPI boot |
| ENET1_RX_DATA0–3 | Gigabit Ethernet receive data | RGMII interface pins for 1 Gb ENET with AVB; require controlled impedance routing and matched trace lengths |
| CANFD1_TX / CANFD1_RX | CAN FD transceiver interface | Differential pair for first FlexCAN-FD controller; compatible with ISO 11898-1 and CAN FD protocol up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Subsystem | CAAM with PKHA, RNG4, AES-128/256, SHA-1/2, and secure key storage enables certified secure boot and runtime cryptographic operations without software overhead |
| Dual Ethernet with TSN | Integrated 1 Gb ENET_QOS supporting IEEE 802.1AS (gPTP) and 802.1Qav (AVB) enables deterministic audio/video streaming and time-synchronized control in automotive networks |
| Flexible Memory Interface | Dual FlexSPI controllers (one with 8-bit bidirectional data bus) support XIP from Octal/Quad SPI flash, HyperRAM, and legacy NOR/NAND - eliminating need for external memory controllers |
| Real-time Graphics Acceleration | PXP 2D engine with alpha blending, rotation, resize, CSC, and Porter-Duff compositing offloads GUI rendering from CPU, reducing M7 load in HMI applications |
| Automotive I/O Robustness | GPIOs with programmable drive strength, slew rate, pull-up/down, and hysteresis; all I/Os rated for -40°C to +125°C operation and AEC-Q100 stress testing |
Applications
| Industrial HMI | Automotive Instrument Cluster |
|---|---|
|
Use Scenario: High-resolution touchscreen dashboard with animated gauges, vehicle status overlays, and multi-language UI. IC Role / Device Role / Timing Role: Primary application processor executing FreeRTOS/Linux-based GUI framework, driving eLCDIF and MIPI DSI displays while managing CAN-FD vehicle bus communication. Use Value: Dual-core separation allows M7 to render graphics at 60 fps while M4 handles CAN message filtering, sensor fusion, and watchdog supervision - ensuring deterministic response under load. |
Use Scenario: Digital cockpit display with real-time speed, RPM, ADAS warnings, and navigation turn-by-turn guidance. IC Role / Device Role / Timing Role: Safety-aware system-on-chip providing ASIL-B capable partitioning via RDC, running certified RTOS on M4 for critical alerts while M7 renders vector graphics via GPU2D. Use Value: Integrated TSN Ethernet and IEEE 1588 support enables synchronized rendering across multiple displays and time-coordinated ADAS data ingestion without external timing ICs. |
| Motor Control Gateway | Smart Audio Appliance |
|
Use Scenario: Field-oriented control (FOC) gateway aggregating motor feedback, power stage telemetry, and cloud connectivity in HVAC or EV charging systems. IC Role / Device Role / Timing Role: Real-time controller using FlexPWM (16-bit resolution, 8 channels per module) and QDEC for encoder feedback, with CAN-FD for actuator command distribution. Use Value: On-chip 12-bit ADC (2×), ACMP (4×), and dedicated PWM fault protection channels allow closed-loop control loop execution in <1 µs without external analog front-end components. |
Use Scenario: Voice-controlled smart speaker with far-field microphone array, multi-zone audio playback, and Bluetooth/Wi-Fi coexistence. IC Role / Device Role / Timing Role: Audio hub managing four SAI modules (I²S/TDM), SPDIF, ASRC, and PDM microphone inputs while running voice assistant inference on M7 and audio DSP on M4. Use Value: Hardware ASRC and eight-channel DMIC interface eliminate need for external audio codecs, reducing BOM cost and PCB area while supporting simultaneous wake-word detection and playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core crossover processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT1175AVM8A | Omits MIPI DSI/CSI, GPU2D, and second 1 Gb ENET; retains same dual-core clocks, memory, and CAN-FD count | Suitable for non-display HMI or control-only gateways where display acceleration and TSN are not required | Select when cost reduction is prioritized over display/audio features and TSN capability is unnecessary |
| MIMXRT1172AVM8A | Removes second 1 Gb ENET, MIPI interfaces, GPU2D, and one FlexCAN-FD; reduces SRAM to 1.5 MB (no ECC option) | Targeted at entry-level automotive clusters or industrial panels with basic LCD and single-CAN networking | Choose for simpler designs needing only parallel LCD, single CAN-FD, and no TSN - lower pin count and reduced thermal envelope |
Compared with MIMXRT1175AVM8A and MIMXRT1172AVM8A, the MIMXRT1176AVM8AR delivers full automotive feature parity - including dual MIPI interfaces, GPU2D, TSN Ethernet, and hardware security extensions - making it the only variant qualified for advanced digital cockpit implementations requiring concurrent display, camera, and time-sensitive networking.
Availability
MIMXRT1176AVM8AR is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and smart audio appliances requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MIMXRT1176AVM8AR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based microcontrollers and crossover processors.
The i.MX RT1170 family - including MIMXRT1176AVM8AR - was designed specifically for automotive-qualified, high-performance real-time applications demanding both rich multimedia capability and functional safety readiness, bridging the gap between MCUs and application processors.
FAQ
What is the operating temperature range for MIMXRT1176AVM8AR?
The MIMXRT1176AVM8AR is rated for a junction temperature range of -40°C to +125°C and is AEC-Q100 Grade 2 qualified, making it suitable for under-hood and dashboard-mounted automotive applications where thermal stability and long-term reliability are critical. This specification is defined in the IMXRT1170AEC Rev. 5 datasheet and verified across production lots.
Does MIMXRT1176AVM8AR support secure boot and encrypted external memory?
Yes, MIMXRT1176AVM8AR supports High Assurance Boot (HAB v4) with signature verification and On-the-Fly AES Decryption (OTFAD) for FlexSPI-connected external flash. The CAAM module provides hardware-accelerated AES-128/256, SHA-2, and PKHA, enabling secure key management and encrypted XIP without performance penalty - all confirmed in Section 1.1 and Chapter 6 of the official datasheet.
How many Ethernet interfaces does MIMXRT1176AVM8AR integrate?
MIMXRT1176AVM8AR integrates three distinct Ethernet controllers: one 10/100 Mbps MAC with IEEE 1588 support, one 1 Gbps MAC with AVB compliance, and one 1 Gbps Quality-of-Service (ENET_QOS) controller with full TSN capability (IEEE 802.1AS and 802.1Qav). These are physically separate IP blocks with independent PHY interfaces, as detailed in Table 1 and Section 4.9 of the IMXRT1170AEC datasheet.
What display interfaces are supported by MIMXRT1176AVM8AR?
MIMXRT1176AVM8AR supports parallel RGB LCD (eLCDIF, up to WXGA@60fps), enhanced LCDIFv2 (8-layer alpha blending), MIPI DSI (2-lane, 1.5 Gbps), and MIPI CSI (2-lane, 1.5 Gbps), plus parallel camera sensor interface (CSI). All are silicon-verified and enabled in the MIMXRT1176AVM8AR variant per Table 1 of the IMXRT1170AEC datasheet - unlike MIMXRT1175AVM8A or MIMXRT1172AVM8A which omit MIPI interfaces.
Is MIMXRT1176AVM8AR pin-compatible with other i.MX RT117x variants?
No, MIMXRT1176AVM8AR is not pin-compatible with other i.MX RT117x variants such as MIMXRT1175AVM8A or MIMXRT1172AVM8A. While all share the same 289-pin MAPBGA package footprint and pitch, signal assignments differ significantly - especially for MIPI DSI/CSI, GPU2D, and TSN Ethernet interfaces - requiring unique PCB layout per variant as confirmed in Section 6.1 and Figure 3 of the IMXRT1170AEC datasheet.
MIMXRT1176AVM8AR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- RT1170
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4, Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 400MHz, 800MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 13
- Program Memory Size:
- -
- Program Memory Type:
- External Program Memory
- EEPROM Size:
- -
- RAM Size:
- 2M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 1.95V, 3V ~ 3.6V
- Data Converters:
- A/D 20x12b SAR; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT1176AVM8AR FAQ
1.How can I place an order for MIMXRT1176AVM8AR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT1176AVM8AR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT1176AVM8AR reliable?
The price and inventory of MIMXRT1176AVM8AR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT1176AVM8AR is usually 5 days.
3.What payment methods are accepted for MIMXRT1176AVM8AR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT1176AVM8AR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT1176AVM8AR?
MIMXRT1176AVM8AR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT1176AVM8AR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT1176AVM8AR?
For technical support, including MIMXRT1176AVM8AR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT1176AVM8AR requirements.
6.How does Aetrix verify that MIMXRT1176AVM8AR is sourced from the original manufacturer or authorized distributors?
All MIMXRT1176AVM8AR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT1176AVM8AR meets industry standards.
7.What is the process for return or replacement of MIMXRT1176AVM8AR?
All MIMXRT1176AVM8AR units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT1176AVM8AR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT1176AVM8AR part is unused and in its original packaging.
Return procedure for MIMXRT1176AVM8AR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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