Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MIMXRT117CDVMAA

Part No.:
MIMXRT117CDVMAA
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
289-LFBGA
Datasheet:
AetrixMIMXRT117CDVMAA.pdf
Description:
IC MCU 32BIT EXT MEM 289LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:152

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MIMXRT117CDVMAA from NXP Semiconductors is a dual-core Arm® Cortex®-M7/M4 crossover processor operating at 800 MHz/400 MHz, featuring 2 MB on-chip RAM (including 512 KB configurable TCM), integrated DCDC/LDO power management, and support for industrial HMI, motor control, and high-end audio applications.

For engineers reviewing the MIMXRT117CDVMAA datasheet, MIMXRT117CDVMAA pinout, MIMXRT117CDVMAA application, or MIMXRT117CDVMAA equivalent, key selection criteria include dual-core clock speeds, SRAM configuration flexibility, industrial temperature range (-40°C to +105°C), 289-pin MAPBGA package compatibility, and feature differentiation versus other i.MX RT117x variants.

Technical Context

The MIMXRT117CDVMAA implements a heterogeneous dual-core architecture: the Cortex-M7 core runs at 800 MHz with 32 KB I/D cache, FPU, ECC-enabled TCM, and Forward Body Biasing; the Cortex-M4 core operates at 400 MHz with 16 KB I/D cache, 256 KB TCM, and ECC/parity support. Both cores share access to 2 MB on-chip memory, including 1.25 MB OCRAM and configurable TCM partitions.

It integrates full PMIC functionality (on-die DCDC and LDOs), hardware security accelerators (CAAM, HAB, OTFAD, SNVS), and extensive peripheral sets-including three FlexCAN-FD controllers, two Gigabit Ethernet interfaces (one with AVB, one with TSN), four SAI modules, dual FlexSPI, and parallel/MIPI display & camera interfaces-subject to variant-specific enablement per Table 1 of IMXRT1170IEC Rev. 5.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual-core: Arm Cortex-M7 @ 800 MHz + Cortex-M4 @ 400 MHz - enables real-time deterministic control (M4) alongside high-performance application processing (M7).
On-chip Memory 2 MB total SRAM: 512 KB configurable as M7/M4 TCM or OCRAM, 1.25 MB dedicated OCRAM, 4 KB secure always-on RAM - supports tight-loop control code in TCM and large buffers in OCRAM.
Operating Temperature -40°C to +105°C junction - qualified for industrial environments without derating or external thermal management.
Package 289-pin MAPBGA, 14 × 14 mm, 0.8 mm pitch - standard footprint compatible with automated PCB assembly and thermal vias for power delivery.
Power Management Integrated DCDC (1.0 V / 1.8 V outputs) and LDO regulators - eliminates need for external PMIC, reduces BOM count, and simplifies power sequencing.
Security Features HAB, CAAM (PKHA, AES-128/256, RNG4), OTFAD, SNVS with SRTC and tamper detection - enables secure boot, encrypted XIP, and trusted runtime for industrial firmware integrity.
Connectivity Peripherals 3× FlexCAN-FD, 2× USB 2.0 OTG (w/ PHY), 2× uSDHC (eMMC 5.0/SD 3.0), 12× UART, 6× I²C, 6× SPI, 2× Gigabit Ethernet (AVB + TSN) - supports robust industrial networking, fieldbus bridging, and multimedia I/O.

Pinout & Package

289-pin plastic MAPBGA package, 14 mm × 14 mm body, 0.8 mm ball pitch, RoHS-compliant. Ball grid layout follows JEDEC MO-277AA standard with defined power, ground, I/O, and dedicated function ball assignments per Section 6.1 of IMXRT1170IEC Rev. 5.

Pin/Terminal Circuit Role Design Meaning
VDD_SOC Core power supply 1.0 V input for M7/M4 logic domains; requires low-noise regulation and local decoupling per datasheet layout guidelines.
VDD_ARM M7 core voltage rail Supplies Cortex-M7 CPU core; tied internally to VDD_SOC in this variant; not independently configurable.
VDDA_3P3 Analog I/O supply 3.3 V analog domain for ADC, DAC, comparators, and analog PHYs; must be filtered separately from digital rails.
BOOT_MODE0–3 Boot configuration inputs Strapped at power-up to select boot source (FlexSPI, SD, NAND, etc.); internal pull-ups active; require external resistors for reliable state setting.
ENET1_RX_DATA[3:0] Gigabit Ethernet receive data LVDS-capable RGMII inputs for first 1 GbE interface; require matched trace lengths and 100 Ω differential termination.
FLEXSPI_A_DATA[7:0] Octal SPI data bus Bidirectional octal data lines for FlexSPI1; supports HyperFlash/HyperRAM at up to 166 MHz DDR; shared with GPIO in alternate function mode.

Key Features

Feature Design Value
Dual-core asymmetric processing Enables concurrent real-time control (M4) and rich UI/audio processing (M7) without OS-level scheduling overhead or inter-core contention.
Configurable TCM allocation 512 KB FlexRAM partitioned in 32 KB increments between M7 I/D-TCM and M4 TCM - guarantees zero-wait-state execution for time-critical ISR and control loops.
Hardware-accelerated graphics PXP 2D engine + GPU2D vector accelerator - offloads alpha blending, rotation, color space conversion, and Bezier curve rendering from CPU, reducing frame latency in HMI displays.
Secure boot with HAB v4 Immutable ROM-based High Assurance Boot validates signed firmware images using ECDSA P-384 before execution - prevents unauthorized code injection in field-deployed devices.
On-the-Fly AES Decryption (OTFAD) Decrypts FlexSPI-connected external flash contents in real time using AES-128 CTR mode - enables secure XIP from untrusted storage without exposing decrypted code in DRAM.

Applications

Industrial HMI Motor Control Gateway

Use Scenario: Touch-enabled panel PC for factory floor visualization and parameter adjustment in PLC-controlled machinery.

IC Role / Device Role / Timing Role: Primary application processor managing GUI rendering via LCDIFv2/MIPI DSI, real-time motion control via FlexPWM and QDEC, and EtherCAT/TSN network bridging.

Use Value: Dual-core isolation ensures deterministic 100 µs PWM update cycles (M4) while M7 handles Qt-based UI, video playback, and cloud telemetry - no RTOS co-scheduling required.

Use Scenario: Field-oriented control (FOC) gateway aggregating multi-axis servo drives over CAN FD and relaying status to SCADA via Gigabit TSN Ethernet.

IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithms at 20 kHz loop rate (M4), while M7 manages protocol translation (CAN FD ↔ TSN), web server, and firmware OTA updates.

Use Value: Integrated CAN FD (3 channels) and TSN-capable ENET_QOS eliminate external protocol ICs; on-chip 2 MB RAM stores dual control loop buffers and packet queues without external SDRAM latency.

High-End Audio Appliance Smart Home Hub

Use Scenario: Multi-room streaming amplifier with Dolby Atmos decoding, HDMI ARC passthrough, and voice assistant integration.

IC Role / Device Role / Timing Role: Audio subsystem controller handling SPDIF/I2S/SAI routing, ASRC sample rate conversion, MQS analog output, and PDM microphone array processing.

Use Value: Four SAI modules support simultaneous 8-channel input (PDM mic array) and 8-channel output (multi-zone DACs); hardware ASRC eliminates software resampling jitter in synchronized multi-device audio systems.

Use Scenario: Central hub coordinating Zigbee, Matter-over-Thread, and Bluetooth LE peripherals while running local AI inference for occupancy and anomaly detection.

IC Role / Device Role / Timing Role: Edge AI host running lightweight vision models (via PXP/GPU2D acceleration) and managing secure device onboarding via CAAM-encrypted TLS handshakes.

Use Value: Secure boot + CAAM + PUF ensures trusted execution environment; dual FlexSPI interfaces allow concurrent OTA update staging and active firmware execution - zero-downtime updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MIMXRT1176CVM8A Includes GPU2D, MIPI CSI/DSI, parallel LCD, and enhanced security (tamper detection); same 289-pin MAPBGA package. Required for MIPI display/camera integration and advanced vector graphics; supports higher-resolution HMI with hardware-accelerated UI rendering. Select when MIPI DSI/CSI or GPU2D vector acceleration is mandatory; otherwise MIMXRT117CDVMAA offers identical dual-core performance at lower cost.
MIMXRT1172CVM8A Omits GPU2D, MIPI interfaces, and one Gigabit Ethernet; retains dual-core 800/400 MHz, 2 MB RAM, and industrial temp grade. Suitable for cost-sensitive industrial gateways where only basic display (parallel RGB) and single Ethernet are needed. Choose for budget-constrained designs requiring core compute and connectivity but not advanced graphics or dual 1 GbE; pin-compatible with MIMXRT117CDVMAA.

Compared with MIMXRT1176CVM8A, MIMXRT117CDVMAA removes MIPI and GPU2D to reduce cost while retaining full dual-core performance and security; versus MIMXRT1172CVM8A, it adds second Gigabit Ethernet and full feature set - making it the balanced mid-tier option for industrial HMI and gateway applications.

Availability

MIMXRT117CDVMAA is available at Aetrix Electronics and suitable for industrial HMI, motor control gateways, and high-end audio appliances requiring stable component supply across extended product lifecycles.

Supply support for MIMXRT117CDVMAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, connected, and intelligent edge solutions for automotive, industrial, and IoT markets.

The i.MX RT1170 series - including MIMXRT117CDVMAA - was designed as a high-performance crossover processor family bridging MCU simplicity with MPU capability, targeting industrial automation, human-machine interfaces, and real-time edge AI applications.

FAQ

What is the maximum operating frequency of each core in the MIMXRT117CDVMAA?

The MIMXRT117CDVMAA features an Arm Cortex-M7 core rated for 800 MHz operation with Forward Body Biasing and an Arm Cortex-M4 core rated for 400 MHz operation without body biasing. These frequencies are guaranteed across the full industrial temperature range (-40°C to +105°C) per IMXRT1170IEC Rev. 5 specifications.

Does the MIMXRT117CDVMAA support secure boot and cryptographic acceleration?

Yes, the MIMXRT117CDVMAA includes High Assurance Boot (HAB) v4 for immutable signed image validation, Cryptographic Acceleration and Assurance Module (CAAM) with PKHA, AES-128/256, SHA-1/2, and RNG4, plus On-the-Fly AES Decryption (OTFAD) for secure external flash execution - all documented in the IMXRT1170IEC datasheet security chapter.

What package type and pin count does the MIMXRT117CDVMAA use?

The MIMXRT117CDVMAA uses a 289-pin plastic MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. This package is mechanically and thermally optimized for industrial PCB layouts and is identical across all i.MX RT117x CVM8A variants per Section 6.1 of IMXRT1170IEC Rev. 5.

How much on-chip RAM does the MIMXRT117CDVMAA provide, and how is it allocated?

The MIMXRT117CDVMAA provides 2 MB of on-chip RAM: 512 KB configurable as TCM (shared between M7 and M4), 1.25 MB dedicated OCRAM, 256 KB reserved for M4 TCM, and 4 KB secure always-on RAM. Configuration is managed by the FlexRAM controller with 32 KB granularity per IMXRT1170IEC Section 1.1.

Which Ethernet capabilities are included in the MIMXRT117CDVMAA?

The MIMXRT117CDVMAA integrates one 10/100 Mbps Ethernet controller with IEEE 1588 support, one Gigabit Ethernet controller with AVB compliance, and one Gigabit Ethernet controller with Time-Sensitive Networking (TSN) capability - enabling deterministic industrial networking, audio/video bridging, and synchronized multi-device control per Table 1 of IMXRT1170IEC Rev. 5.

MIMXRT117CDVMAA Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
289-LFBGA
Series:
RT1170
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
800MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
-
Program Memory Type:
External Program Memory
EEPROM Size:
-
RAM Size:
2M x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MIMXRT117CDVMAA FAQ

1.How can I place an order for MIMXRT117CDVMAA through Aetrix?

Please submit a Request for Quotation (RFQ) for MIMXRT117CDVMAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIMXRT117CDVMAA reliable?

The price and inventory of MIMXRT117CDVMAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT117CDVMAA is usually 5 days.

3.What payment methods are accepted for MIMXRT117CDVMAA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT117CDVMAA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIMXRT117CDVMAA?

MIMXRT117CDVMAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIMXRT117CDVMAA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIMXRT117CDVMAA?

For technical support, including MIMXRT117CDVMAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT117CDVMAA requirements.

6.How does Aetrix verify that MIMXRT117CDVMAA is sourced from the original manufacturer or authorized distributors?

All MIMXRT117CDVMAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT117CDVMAA meets industry standards.

7.What is the process for return or replacement of MIMXRT117CDVMAA?

All MIMXRT117CDVMAA units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT117CDVMAA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIMXRT117CDVMAA part is unused and in its original packaging.

Return procedure for MIMXRT117CDVMAA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MIMXRT117CDVMAA Tags

  • MIMXRT117CDVMAA
  • MIMXRT117CDVMAA PDF
  • MIMXRT117CDVMAA Datasheet
  • MIMXRT117CDVMAA Specifications
  • MIMXRT117CDVMAA Images
  • NXP Semiconductors
  • NXP Semiconductors MIMXRT117CDVMAA
  • Buy MIMXRT117CDVMAA
  • MIMXRT117CDVMAA Price
  • MIMXRT117CDVMAA Distributor
  • MIMXRT117CDVMAA Supplier
  • MIMXRT117CDVMAA Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER