NXP Semiconductors MIMXRT533SFAWCR

Overview

MIMXRT533SFAWCR from NXP Semiconductors is a dual-core low-power crossover processor featuring an Arm Cortex-M33 CPU (up to 275 MHz) and no integrated DSP or graphics engine, with 3 MB shared SRAM, SRAM-based PUF security, AES-256/SHA-256 crypto acceleration, and high-speed USB host/device support - deployed in voice-controlled edge nodes, secure IoT gateways, and battery-powered industrial sensors.

For engineers reviewing the MIMXRT533SFAWCR datasheet, MIMXRT533SFAWCR pinout, MIMXRT533SFAWCR application, or MIMXRT533SFAWCR equivalent, key selection criteria include its WLCSP141 package footprint, 9 FlexComm interfaces (with limited I²C/UART/SPI mapping), -20 °C to +85 °C industrial temperature rating, and absence of DSP/GPU hardware versus higher-tier RT500 variants.

Technical Context

The MIMXRT533SFAWCR implements a tightly coupled dual-CPU architecture: the Cortex-M33 core handles real-time control, secure boot, and peripheral management, while the device omits the Cadence Fusion F1 DSP and 2.5D GPU present in RT595/RT555 variants. Its security subsystem integrates TrustZone, on-the-fly AES decryption (OTFAD), and Physically Unclonable Function (PUF)-derived key generation.

Power delivery uses five independent VDDIO rails (1.71–1.89 V for VDDIO_0/1/2/4; 1.71–3.6 V for VDDIO_3), enabling mixed-voltage I/O interfacing. The 141-pin WLCSP package supports 136 GPIOs with configurable pull-up/down, edge/level interrupts, and Boolean pattern matching - all operating under a 0.58–1.155 V VDDCORE range across sleep and active modes.

Key Specifications

Pinout & Package

Package: WLCSP141 (141-ball wafer-level chip-scale package, 4.525 mm × 4.525 mm, 0.35 mm ball pitch, MSL Level 1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MIMXRT533SFAWCR, MIMXRT533SFFOC offers greater I/O routing flexibility and thermal headroom in FOWLP249, while MIMXRT555SFAWCR retains the same WLCSP141 footprint but adds GPU and 2 MB more SRAM - making it ideal for display-integrated edge nodes where memory bandwidth matters more than DSP compute.

Availability

MIMXRT533SFAWCR is available at Aetrix Electronics and suitable for secure IoT gateways, battery-powered industrial sensors, and medical edge devices requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MIMXRT533SFAWCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based microcontrollers and edge AI processors.

The i.MX RT500 series targets ultra-low-power, high-security embedded applications - designed to replace discrete MCU + security IC combinations with a single-chip solution integrating TrustZone, PUF, and OTFAD for end-to-end firmware and data protection.

FAQ

What is the maximum operating frequency of the Cortex-M33 core in the MIMXRT533SFAWCR?

The MIMXRT533SFAWCR supports a maximum Cortex-M33 clock frequency of 275 MHz. This speed is achievable across the full industrial temperature range (-20 °C to +85 °C) when VDDCORE is supplied within the 0.7–1.155 V active-mode range. The device maintains this performance while supporting high-speed USB host/device operation and real-time cryptographic acceleration without throttling.

Does the MIMXRT533SFAWCR include a DSP or GPU core?

No, the MIMXRT533SFAWCR does not include a Cadence Fusion F1 DSP or 2.5D GPU core. Per the i.MX RT500 family datasheet and orderable part number table, the "3" in the feature code denotes "no DSP, no Graphic". This distinguishes it from MIMXRT555SFAWCR (GPU only) and MIMXRT595SFAWCR (DSP + GPU), making MIMXRT533SFAWCR optimized for control-dominant, security-critical applications without multimedia processing overhead.

What package type and dimensions does the MIMXRT533SFAWCR use?

The MIMXRT533SFAWCR uses a 141-ball WLCSP (Wafer-Level Chip-Scale Package) measuring 4.525 mm × 4.525 mm × 0.49 mm with 0.35 mm ball pitch. It is rated MSL Level 1 (unlimited floor life), unlike the FOWLP249 variants which are MSL Level 3. This ultra-compact package enables miniaturized PCB designs for wearables, ingestibles, and space-constrained industrial modules.

How many FlexComm interfaces does the MIMXRT533SFAWCR support, and what configurations are available?

The MIMXRT533SFAWCR supports 9 FlexComm interfaces. Each can be configured as UART, I²C, SPI, or I²S with integrated FIFO and DMA support. However, FlexComm6 and FlexComm12 are restricted to I²C SDA/SCL functions only - meaning full UART or SPI functionality is available on only 7 of the 9 modules. This configuration balances serial flexibility with die size and power efficiency for cost-sensitive edge nodes.

What security features are implemented in hardware on the MIMXRT533SFAWCR?

The MIMXRT533SFAWCR integrates TrustZone for Armv8-M, SRAM-based PUF for unique key generation, AES-256/SHA-256 crypto acceleration via the CASPER coprocessor, on-the-fly AES decryption (OTFAD) for FlexSPI XIP, and an immutable ROM bootloader. These features collectively enable secure boot, encrypted firmware storage, tamper-resistant key management, and authenticated firmware updates - all without external security ICs.