NXP Semiconductors MIMXRT555SFAWCR

Overview

MIMXRT555SFAWCR from NXP Semiconductors is a dual-core low-power crossover processor featuring an Arm Cortex-M33 CPU (up to 275 MHz) and no integrated Cadence Xtensa Fusion F1 DSP core, with 5 MB shared SRAM, MIPI DSI interface supporting up to 895.1 Mbps, and hardware security including SRAM PUF, AES-256, and SHA-1/SHA-2 hash engines - deployed in voice-controlled edge devices requiring real-time audio processing and secure boot.

For engineers reviewing the MIMXRT555SFAWCR datasheet, MIMXRT555SFAWCR pinout, MIMXRT555SFAWCR application, or MIMXRT555SFAWCR equivalent, key selection criteria include its WLCSP141 package (4.525 mm × 4.525 mm), 9 FlexComm interfaces (with limited I²C/UART/SPI functionality), -20 °C to +85 °C industrial temperature range, and absence of DSP acceleration versus RT595-series variants.

Technical Context

The MIMXRT555SFAWCR implements a heterogeneous dual-CPU architecture where the Cortex-M33 handles control, security, and system management while the graphics subsystem (2.5D GPU, LCD controller, MIPI DSI PHY) operates independently at up to 275 MHz. Its memory subsystem includes 5 MB low-leakage SRAM accessible by both CPUs and DMA engines, two FlexSPI interfaces (one with on-the-fly AES decryption), and dedicated SRAM banks for USB (16 KB), crypto coprocessor (2 × 2 KB), and FlexSPI caches (32 KB each).

Security is enforced via Arm TrustZone for Armv8-M, immutable ROM-based secure boot, Physically Unclonable Function (PUF) key generation, and Casper cryptographic coprocessor supporting AES-256, SHA-256, SHA-1, and NIST SP 800-90b-compliant TRNG. Power management supports Deep_powerdown mode with selective SRAM retention and independent DSP domain power gating - though DSP is disabled in this variant.

Key Specifications

Pinout & Package

Package: WLCSP141 (141-pin wafer-level chip-scale package), 4.525 mm × 4.525 mm × 0.49 mm, 0.35 mm ball pitch, MSL Level 1 moisture sensitivity rating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Compared with MIMXRT555SFAWCR, MIMXRT555SFFOC offers superior thermal performance and I/O density but increases PCB area by 2.4×; MIMXRT533SFAWCR cuts SRAM and graphics to lower cost and power, sacrificing display capability entirely.

Availability

MIMXRT555SFAWCR is available at Aetrix Electronics and suitable for smart wearables, voice-controlled IoT hubs, industrial HMIs, and medical sensor gateways requiring stable component supply across long-life production cycles.

Supply support for MIMXRT555SFAWCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX RT500 series targets low-power, high-performance crossover processors bridging MCU simplicity with application-processor capability - designed specifically for battery-operated edge devices needing rich multimedia, robust security, and real-time responsiveness.

FAQ

What is the maximum operating temperature for the MIMXRT555SFAWCR?

The MIMXRT555SFAWCR is rated for ambient operating temperatures from -20 °C to +85 °C, with a maximum junction temperature of 105 °C. This industrial-grade thermal specification ensures reliable operation in enclosed or unventilated environments such as smart thermostats, portable medical devices, and factory-floor HMIs where passive cooling is used. Thermal design must maintain T_j ≤ 105 °C using R_θJA = 35.3 °C/W for the WLCSP141 package.

Does the MIMXRT555SFAWCR include a DSP core?

No, the MIMXRT555SFAWCR does not include the Cadence Xtensa Fusion F1 DSP core. It features only the Arm Cortex-M33 CPU running up to 275 MHz, paired with a 2.5D GPU and MIPI DSI interface. The "5" in the part number denotes inclusion of graphics capability but exclusion of the DSP - distinguishing it from MIMXRT595SFAWCR, which includes both cores. Audio preprocessing must be handled by the M33 core or external accelerators.

What security features are implemented in the MIMXRT555SFAWCR?

The MIMXRT555SFAWCR implements hardware-enforced security including Arm TrustZone for Armv8-M, ROM-based immutable secure boot, SRAM PUF for device-unique key generation, AES-256 on-the-fly decryption (OTFAD) for external flash, SHA-1/SHA-256 hash engine, and Casper cryptographic coprocessor. These features collectively support secure firmware updates, protected key storage, and runtime isolation - meeting foundational requirements for IEC 62443-3-3 SL2 and PSA Certified Level 2 certification paths.

Can the MIMXRT555SFAWCR boot directly from external Octal SPI flash?

Yes, the MIMXRT555SFAWCR supports boot from external Octal SPI flash via its FlexSPI interface, including Execute-in-Place (XiP) mode with optional on-the-fly AES decryption (OTFAD). This capability eliminates the need for internal flash or RAM-based bootloaders, reduces boot latency, and enhances security by keeping encrypted code in external memory. Boot configuration is set via BOOT_MODE pins and fuses programmed in OTP memory.

How many MIPI DSI lanes does the MIMXRT555SFAWCR support?

The MIMXRT555SFAWCR supports two MIPI DSI lanes (DP0/DM0 and DP1/DM1), enabling dual-lane operation at up to 895.1 Mbps aggregate bandwidth. This supports common display resolutions such as 800×480 at 60 Hz with 24 bpp or 480×272 at 120 Hz, directly driving panels without external timing controllers. Lane count and speed are configured in the MIPI DSI PHY registers during initialization.