NXP Semiconductors MIMXRT555SFFOC

Overview

MIMXRT555SFFOC from NXP Semiconductors is a dual-core low-power crossover processor featuring an Arm Cortex-M33 CPU (up to 275 MHz) and no integrated Cadence Xtensa Fusion F1 DSP core, with 5 MB shared SRAM, MIPI DSI interface (2-lane, up to 895.1 Mbps), and hardware security including SRAM PUF, AES-256, and SHA-1/SHA-256 accelerators. It targets secure, graphics-enabled edge devices such as smart displays and industrial HMIs.

For engineers reviewing the MIMXRT555SFFOC datasheet, MIMXRT555SFFOC pinout, MIMXRT555SFFOC application, or MIMXRT555SFFOC equivalent, key selection criteria include its 249-pin FOWLP package, absence of DSP core versus RT595 variants, support for high-speed USB host/device with PHY, 12 FlexComm interfaces configurable as UART/I²C/SPI/I²S, and operation across –20 °C to +85 °C ambient temperature.

Technical Context

The MIMXRT555SFFOC implements a heterogeneous dual-domain architecture: the Cortex-M33 control domain handles real-time OS execution, secure boot, and peripheral management, while the dedicated 2.5D GPU (up to 275 MHz) and MIPI DSI PHY offload display rendering. Its five independent I/O power rails (VDDIO_0–4) enable mixed-voltage interfacing without level shifters.

Security is enforced via Arm TrustZone for Armv8-M, hardware-isolated cryptographic accelerators (AES-256, SHA-256, TRNG), and Physically Unclonable Function (PUF)-derived key storage. Boot sources include FlexSPI flash with on-the-fly decryption (OTFAD), eMMC 5.0 (HS400/DDR), and USB, all managed by immutable ROM bootloader.

Key Specifications

Pinout & Package

FOWLP249 package: 249-ball fan-out wafer-level package, 7.0 mm × 7.0 mm footprint, 0.4 mm ball pitch, moisture sensitivity level (MSL) 3, lead-free reflow profile (peak 260 °C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Compared with MIMXRT595SFFOC, MIMXRT555SFFOC removes DSP silicon area to lower dynamic power and bill-of-materials cost while retaining full graphics and security capabilities; compared with MIMXRT533SFFOC, it doubles SRAM and adds GPU/DSI for display-centric designs without changing footprint or thermal profile.

Availability

MIMXRT555SFFOC is available at Aetrix Electronics and suitable for smart industrial HMI, secure edge gateways, and medical display terminals requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MIMXRT555SFFOC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX RT500 series is designed as a low-power crossover processor family bridging MCU simplicity with application-processor performance, targeting secure, graphics-rich edge devices where real-time responsiveness and energy efficiency are critical.

FAQ

What is the maximum operating frequency of the Cortex-M33 core in the MIMXRT555SFFOC?

The Cortex-M33 core in the MIMXRT555SFFOC operates at up to 275 MHz under standard conditions. This frequency is maintained during USB high-speed host/device operation and supports full utilization of the 2.5D GPU and MIPI DSI interface bandwidth. The MIMXRT555SFFOC achieves this speed with VDDCORE regulated between 0.7 V and 1.155 V, as specified in the electrical characteristics table.

Does the MIMXRT555SFFOC include a DSP core like the MIMXRT595SFFOC?

No, the MIMXRT555SFFOC does not include the Cadence Xtensa Fusion F1 DSP core. Per Table 1 of the i.MX RT500 data sheet, the "5" in the feature code indicates "no DSP, w Graphic", distinguishing it from the "9" variant (MIMXRT595SFFOC) which includes both DSP and graphics. The MIMXRT555SFFOC retains the Cortex-M33, GPU, MIPI DSI, and full security suite but omits the DSP silicon to reduce power and cost.

What display interfaces does the MIMXRT555SFFOC support?

The MIMXRT555SFFOC supports MIPI DSI (2-lane, up to 895.1 Mbps), an integrated LCD controller, and FlexIO-configurable parallel RGB/8080 interfaces. These allow direct connection to embedded TFT panels without external display bridge ICs. The MIPI DSI PHY is fully compliant with JEDEC standards and includes built-in termination and skew calibration, simplifying high-speed layout for the MIMXRT555SFFOC design.

How is secure boot implemented on the MIMXRT555SFFOC?

Secure boot on the MIMXRT555SFFOC is enforced by an immutable ROM bootloader that validates digital signatures (RSA-2048/3072) of the first-stage firmware before execution. Keys are derived from SRAM PUF, and code integrity is verified using SHA-256 hashes. The MIMXRT555SFFOC leverages Arm TrustZone to isolate the secure boot process from subsequent software layers, ensuring no runtime tampering can bypass signature verification.

What is the package type and thermal rating of the MIMXRT555SFFOC?

The MIMXRT555SFFOC uses the FOWLP249 package: a 249-ball fan-out wafer-level package measuring 7.0 mm × 7.0 mm × 0.725 mm with 0.4 mm pitch. Its junction-to-ambient thermal resistance (RθJA) is 29.6 °C/W under JESD51-9 natural convection conditions. The MIMXRT555SFFOC is rated for operation from –20 °C to +85 °C ambient temperature, with maximum die junction temperature of 105 °C.