NXP Semiconductors MIMXRT555SFFOCR

Overview

MIMXRT555SFFOCR from NXP Semiconductors is a dual-core Arm Cortex-M33 + Cadence Xtensa Fusion F1 DSP crossover processor for low-power embedded applications, featuring 5 MB shared SRAM, AES-256/SHA-256 crypto acceleration with SRAM PUF key generation, and MIPI DSI 2-lane display interface - deployed in voice-controlled edge devices, industrial HMIs, and secure IoT gateways.

For engineers reviewing the MIMXRT555SFFOCR datasheet, MIMXRT555SFFOCR pinout, MIMXRT555SFFOCR application, or MIMXRT555SFFOCR equivalent, key selection criteria include its 275 MHz Cortex-M33 core frequency, absence of integrated DSP (unlike RT595), presence of 2.5D GPU and MIPI DSI PHY, FOWLP249 package constraints, and TrustZone-enabled secure boot with OTFAD decryption support.

Technical Context

The MIMXRT555SFFOCR implements a heterogeneous dual-core architecture: the Arm Cortex-M33 runs at up to 275 MHz with TrustZone, MPU, FPU, and two hardware coprocessors (PowerQuad DSP accelerator and Casper crypto/FFT engine), while the Cadence Xtensa Fusion F1 DSP core is omitted per Table 1 - distinguishing it from the RT595 variant. Memory subsystem includes 5 MB low-leakage SRAM accessible by both domains, two 32 KB FlexSPI caches (one with on-the-fly AES decryption), and dedicated RAM banks for USB (16 KB), PUF (2 KB), and SmartDMA (32 KB).

Digital peripherals comprise 12 FlexComm interfaces (configurable as UART/I²C/SPI/I²S), two high-speed SPIs, two SDIO/eMMC controllers (one supporting eMMC 5.0 HS400), 136 GPIOs with secure mirroring and pattern-matching capability, and a 32-bit SCTimer/PWM module with fractional match resolution. Security is enforced via ROM-based immutable boot, SRAM PUF key storage, AES-256/SHA-256 hardware accelerators, and certificate-based secure debug authentication.

Key Specifications

Pinout & Package

FOWLP249 (Fan-out Wafer-Level Package): 249-ball array, 0.4 mm pitch, 7.0 mm × 7.0 mm footprint, moisture sensitivity level (MSL) 3, lead-free reflow compatible (260 °C peak).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Compared with MIMXRT595SFFOCR, MIMXRT555SFFOCR trades DSP compute for lower power and cost while retaining identical security, display, and peripheral capabilities; versus MIMXRT533SFFOCR, it delivers 67% more SRAM and full MIPI DSI support - making it optimal for display-rich, memory-intensive edge nodes without audio DSP demands.

Availability

MIMXRT555SFFOCR is available at Aetrix Electronics and suitable for industrial HMIs, secure IoT gateways, and voice-controlled edge devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for MIMXRT555SFFOCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

The i.MX RT500 series targets low-power crossover processors bridging MCU simplicity with application-processor capability - designed specifically for battery-operated, display-enabled, and security-critical edge devices demanding real-time responsiveness and hardware-enforced trust.

FAQ

What is the maximum operating frequency of the Cortex-M33 core in the MIMXRT555SFFOCR?

The Cortex-M33 core in the MIMXRT555SFFOCR operates at up to 275 MHz under standard conditions, with frequency scaling supported down to lower rates for power optimization. This maximum frequency is maintained during USB high-speed host/device operation and is validated across the –20 °C to +85 °C ambient temperature range specified for the MIMXRT555SFFOCR.

Does the MIMXRT555SFFOCR include an integrated DSP core like the RT595 family?

No, the MIMXRT555SFFOCR does not include the Cadence Xtensa Fusion F1 DSP core. As confirmed in Table 1 of the IMXRT500EC datasheet, the "DSP" column for MIMXRT555SFFOCR is marked "No", distinguishing it from the MIMXRT595SFFOCR variant. Audio and signal processing tasks must be executed on the Cortex-M33 core or offloaded externally.

What display interfaces are supported by the MIMXRT555SFFOCR?

The MIMXRT555SFFOCR supports MIPI DSI with a 2-lane interface capable of 895.1 Mbps per lane, plus an integrated LCD controller and 2.5D GPU. It also supports parallel LCD via FlexIO configuration. The device does not include HDMI or LVDS interfaces - MIPI DSI is the primary high-speed display interface for this part.

How is secure boot implemented on the MIMXRT555SFFOCR?

Secure boot on the MIMXRT555SFFOCR is implemented via a ROM-resident bootloader that validates cryptographic signatures (RSA-2048/3072) of the first-stage firmware image before execution. This immutable root of trust leverages SRAM PUF-derived keys and hardware AES/SHA accelerators to ensure authenticity and confidentiality - a verified feature of the MIMXRT555SFFOCR's security architecture.

What package type and dimensions does the MIMXRT555SFFOCR use?

The MIMXRT555SFFOCR uses the FOWLP249 package: a 249-ball fan-out wafer-level package measuring 7.0 mm × 7.0 mm × 0.725 mm with 0.4 mm ball pitch. It has moisture sensitivity level (MSL) 3 and is qualified for lead-free reflow up to 260 °C peak temperature - consistent across all FOWLP249 variants in the i.MX RT500 family.