NXP Semiconductors MIMXRT685SFVKBR
- Part No.:
- MIMXRT685SFVKBR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 176-VFBGA
- Datasheet:
-
MIMXRT685SFVKBR.pdf
- Description:
- IC MCU 32BIT EXT MEM 176VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:686
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Product details
Overview
MIMXRT685SFVKBR from NXP Semiconductors is a dual-core Arm Cortex-M33 + Cadence Xtensa HiFi4 audio DSP microcontroller in VFBGA176 package, operating at up to 300 MHz (M33) and 600 MHz (HiFi4), with 4.5 MB shared SRAM and 128 KB TCM, designed for real-time voice processing in smart speakers and always-on audio edge devices.
For engineers reviewing the MIMXRT685SFVKBR datasheet, MIMXRT685SFVKBR pinout, MIMXRT685SFVKBR application, or MIMXRT685SFVKBR equivalent, key selection factors include dual-core asymmetric execution, on-chip AES256/PUF security, FlexSPI with 32 KB cache and OTF decryption, 8-channel digital microphone interface with Voice Activation Detect, and triple I/O voltage domains supporting mixed-voltage peripheral interfacing.
Technical Context
The MIMXRT685SFVKBR implements tightly coupled inter-processor communication via hardware mailboxes and semaphores, with a shared 4.5 MB SRAM space partitioned into 30 configurable blocks-each independently assignable to Cortex-M33, HiFi4, or DMA engines, and controllable for retention or power-off. The HiFi4 accesses RAM through a dedicated 256-bit interface with single-cycle cache, while the M33 uses the 32-bit AHB bus.
Its clock architecture includes a main system PLL supporting CPU operation without external high-frequency crystals, an independent fractional-divider audio PLL, and a second PLL output dedicated to the HiFi4 core when frequency separation is required. Power management supports deep-sleep mode with synchronous serial interfaces clocked by the 32 kHz RTC oscillator and wake-up via GPIO, RTC, or OS Event Timer interrupts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M33 @ up to 300 MHz + Cadence Xtensa HiFi4 DSP @ up to 600 MHz - enables concurrent real-time control and audio signal processing. |
| On-chip Memory | 4.5 MB shared SRAM (30 partitions) + 128 KB TCM (64 KB code/64 KB data) - supports large audio buffers and low-latency DSP execution. |
| Security | AES256 engine, SHA1/SHA2 hash, Physical Unclonable Function (PUF), and TrustZone-enabled Cortex-M33 - provides secure boot, encrypted firmware updates, and isolated secure execution environments. |
| Audio Interfaces | Digital microphone interface supporting 8 channels with decimators and Voice Activation Detect (VAD); seven Flexcomm interfaces configurable as I2S (up to 4 channel-pairs) - enables multi-mic far-field voice capture and low-power wake-word detection. |
| Flash Interface | FlexSPI with two channels (A/B), 32 KB cache, and on-the-fly AES decryption - allows secure execute-in-place (XIP) from external Octal/Quad SPI flash with minimal latency. |
| Power Architecture | Triple VDDIO supplies (1.71–3.6 V), 1.8 V main supply, and deep-sleep mode with 32 kHz USART operation - supports heterogeneous peripheral interfacing and ultra-low-power always-listening operation. |
| Package | VFBGA176 (9 × 9 × 0.98 mm, thin fine-pitch) - delivers high I/O density (96 GPIOs) in compact footprint suitable for space-constrained audio modules. |
Pinout & Package
VFBGA176 package: 176-ball thin fine-pitch ball grid array, 9 mm × 9 mm × 0.98 mm body, 0.65 mm ball pitch, lead-free and RoHS compliant. Designed for automated SMT assembly and thermal performance in audio edge applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 – PIO0_31 PIO1_0 – PIO1_31 PIO2_0 – PIO2_26 | General-purpose I/O (GPIO) | 96 configurable GPIOs across three ports; each supports edge/level interrupt, pattern matching, and pull-up/down control - enables flexible peripheral expansion and low-power wake-source configuration. |
| FC0_SCK / FC0_TXD / FC0_RXD / FC0_CTS / FC0_RTS | Flexcomm Interface 0 | Configurable as USART, SPI, I2C, or I2S; includes fractional baud rate generator and 32 kHz deep-sleep clocking - supports UART debug, I2C sensor control, or I2S audio streaming with minimal power impact. |
| DMIC_CLK / DMIC_DATA[0:7] | Digital Microphone Interface | 8-channel PDM input with integrated decimation and Voice Activation Detect logic - eliminates need for external PDM-to-I2S converters and reduces BOM cost in voice-enabled endpoints. |
| FLEXSPI_A_SCLK / FLEXSPI_A_DATA[0:7] / FLEXSPI_B_SCLK / FLEXSPI_B_DATA[0:7] | FlexSPI Flash Interface | Dual-channel Octal/Quad SPI interface with 32 KB cache and on-the-fly AES decryption - enables secure, high-bandwidth XIP from external flash with deterministic timing for real-time audio code execution. |
| USB_DP / USB_DM / USB_VBUS | High-speed USB 2.0 PHY | Integrated HS USB device/host controller with on-chip PHY and dedicated DMA - supports firmware updates, audio streaming (UAC), and host-side peripheral enumeration without external transceivers. |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric Dual-Core Architecture | Separate M33 (control, security, system management) and HiFi4 (audio codec, beamforming, VAD) execution domains - eliminates software scheduling overhead and guarantees deterministic audio latency under system load. |
| Secure Boot & Runtime Isolation | TrustZone-enabled M33 core with MPU, AES256/SHA2 crypto engines, and PUF-based key generation - enforces hardware-rooted chain of trust and prevents unauthorized firmware modification or memory access. |
| Low-Power Audio Processing | HiFi4 DSP with 4×32×32-bit MACs, 4 SP-FP MACs/cycle, and 128 KB TCM - executes complex speech enhancement algorithms (e.g., noise suppression, acoustic echo cancellation) at sub-100 mW power. |
| Flexible Memory Partitioning | 30 independent SRAM partitions, each configurable as code/data, secure/non-secure, or retention/off - enables fine-grained power gating and memory protection between voice pipeline stages and application tasks. |
| Multi-Voltage I/O Support | Triple independent VDDIO supplies (1.71–3.6 V) per port group - allows direct connection to 1.8 V sensors, 3.3 V codecs, and 2.5 V PMICs without level shifters, reducing board complexity and signal integrity risk. |
Applications
| Smart Speaker Front-End | Always-On Voice Assistant Module |
|---|---|
Use Scenario: Far-field voice capture in consumer smart speakers using 4–8 PDM microphones with real-time beamforming and noise suppression. IC Role / Device Role / Timing Role: MIMXRT685SFVKBR serves as the primary audio pre-processing SoC, handling PDM-to-PCM conversion, VAD-triggered wake-up, and low-latency audio feature extraction before forwarding to cloud or local ASR engine. Use Value: On-chip HiFi4 DSP eliminates need for external audio DSP, while FlexSPI XIP and 4.5 MB SRAM enable seamless firmware updates and dynamic model loading without external RAM. | Use Scenario: Compact, battery-powered voice remote or wearable with continuous low-power listening and keyword spotting. IC Role / Device Role / Timing Role: MIMXRT685SFVKBR operates in deep-sleep mode with 32 kHz USART and DMIC VAD active, waking only upon confidence-triggered voice activity to execute full audio pipeline. Use Value: Triple I/O supplies and 1.8 V core allow <50 µA deep-sleep current; on-chip PUF and AES ensure secure over-the-air update delivery even on resource-constrained devices. |
| Industrial Voice-Controlled HMI | Automotive Cabin Voice Interface |
Use Scenario: Ruggedized human-machine interface in factory automation equipment requiring hands-free operation in noisy environments. IC Role / Device Role / Timing Role: MIMXRT685SFVKBR integrates analog comparator, 12-bit ADC, and GPIO pattern matching to fuse voice commands with physical button presses and environmental sensor inputs. Use Value: SCTimer/PWM and five 32-bit timers support precise motor control synchronization with voice feedback; -20 °C to +85 °C rating ensures reliability in industrial enclosures. | Use Scenario: In-cabin voice assistant with multi-mic array, echo cancellation, and car-specific command recognition (e.g., climate, navigation). IC Role / Device Role / Timing Role: MIMXRT685SFVKBR runs NXP Premium Voice Software stack, leveraging Casper crypto coprocessor for secure voice profile storage and PowerQuad accelerator for real-time acoustic echo cancellation. Use Value: eSPI interface enables direct communication with automotive PMICs; USB HS supports diagnostic logging and firmware reflash via service tools without disassembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMXRT685SFFOB | FOWLP249 package (249 balls, 7 × 7 × 0.76 mm); adds eSPI interface and full 147 GPIOs; supports USB ISP mode. | Better thermal dissipation and higher I/O count for complex audio systems with multiple peripherals; eSPI enables tighter integration with modern PMICs. | Select MIMXRT685SFFOB when board layout requires finer pitch, higher thermal performance, or eSPI-based power management. |
| MIMXRT685SVFVKB | VFBGA176 package with Premium Voice Software pre-enabled; identical pinout and electrical specs to MIMXRT685SFVKBR. | Includes licensed NXP voice stack (Conversa, Voicespot) for accelerated development of certified voice UIs. | Select MIMXRT685SVFVKB when production timeline demands out-of-box voice functionality without separate software licensing or integration effort. |
Compared with MIMXRT685SFVKBR, the MIMXRT685SFFOB offers superior thermal and I/O scalability in fan-out packaging, while MIMXRT685SVFVKB delivers identical hardware with pre-integrated voice software-making MIMXRT685SFVKBR the optimal choice for custom voice algorithm development and cost-sensitive volume deployments where software stack is developed in-house.
Availability
MIMXRT685SFVKBR is available at Aetrix Electronics and suitable for smart speaker front-ends, always-on voice assistant modules, and industrial voice-controlled HMIs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for MIMXRT685SFVKBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The RT600 family-including MIMXRT685SFVKBR-is engineered specifically for high-fidelity, low-power voice and audio edge processing, combining Arm and Xtensa architectures to deliver deterministic real-time performance in resource-constrained embedded systems.
FAQ
What is the maximum operating frequency of each core in the MIMXRT685SFVKBR?
The MIMXRT685SFVKBR features an Arm Cortex-M33 core rated for up to 300 MHz and a Cadence Xtensa HiFi4 DSP core rated for up to 600 MHz. These frequencies are achievable under specified voltage (1.8 V ±5%) and temperature (-20 °C to +85 °C) conditions. Both cores operate independently with dedicated clock domains, allowing asymmetric workload distribution without contention. The MIMXRT685SFVKBR datasheet confirms these values in Section 1 General Description and Table 2 Ordering Options.
Does the MIMXRT685SFVKBR support secure boot and runtime encryption?
Yes, the MIMXRT685SFVKBR supports secure boot via ROM-based bootloader with configurable boot sources (FlexSPI, SDIO, UART, USB), AES256 encryption engine with on-the-fly decryption for FlexSPI XIP, SHA1/SHA2 hash module for firmware integrity verification, and Physical Unclonable Function (PUF) for hardware-derived key generation. These features are documented in Sections 2 Features and Benefits and 1.1 Peripherals of the RT600 datasheet, and are fully implemented in the MIMXRT685SFVKBR silicon revision B.
How many GPIO pins are available on the MIMXRT685SFVKBR in its VFBGA176 package?
The MIMXRT685SFVKBR in VFBGA176 package provides 96 general-purpose I/O pins, distributed across PIO0, PIO1, and PIO2 port groups. This count is confirmed in Table 2 (Ordering Options) of the RT600 datasheet, which lists "GPIO: 96" for both MIMXRT685SFVKB and MIMXRT685SVFVKB variants-identical package and pinout to MIMXRT685SFVKBR. All 96 pins support interrupt generation, pattern matching, and configurable pull-up/down resistors.
Can the MIMXRT685SFVKBR directly interface with PDM microphones?
Yes, the MIMXRT685SFVKBR includes a dedicated digital microphone (DMIC) interface supporting up to eight PDM input channels with integrated decimation filters and Voice Activation Detect (VAD) logic. Pins DMIC_CLK and DMIC_DATA[0:7] are assigned in the VFBGA176 pinout (Table 4), and the interface supports DMA-driven streaming to SRAM. This capability eliminates external PDM-to-I2S converters and is explicitly listed in Section 1.1 Peripherals and Table 2 as a standard feature of all RT685 variants including MIMXRT685SFVKBR.
What is the purpose of the triple I/O power supply in the MIMXRT685SFVKBR?
The triple I/O power supply (VDDIO0/VDDIO1/VDDIO2) in the MIMXRT685SFVKBR allows independent voltage configuration (1.71–3.6 V) for different GPIO port groups. This enables direct interfacing with peripherals operating at mismatched logic levels-such as 1.8 V sensors, 3.3 V audio codecs, or 2.5 V PMICs-without external level shifters. The feature is detailed in Section 2 Features and Benefits ("Triple I/O power") and Section 4.1 Ordering Options, and applies identically to all RT685 packages including MIMXRT685SFVKBR.
MIMXRT685SFVKBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 176-VFBGA
- Series:
- RT-600
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 300MHz
- Connectivity:
- EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- -
- Program Memory Type:
- External Program Memory
- EEPROM Size:
- -
- RAM Size:
- 4.5M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 12x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MIMXRT685SFVKBR FAQ
1.How can I place an order for MIMXRT685SFVKBR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMXRT685SFVKBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMXRT685SFVKBR reliable?
The price and inventory of MIMXRT685SFVKBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMXRT685SFVKBR is usually 5 days.
3.What payment methods are accepted for MIMXRT685SFVKBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMXRT685SFVKBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMXRT685SFVKBR?
MIMXRT685SFVKBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMXRT685SFVKBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMXRT685SFVKBR?
For technical support, including MIMXRT685SFVKBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMXRT685SFVKBR requirements.
6.How does Aetrix verify that MIMXRT685SFVKBR is sourced from the original manufacturer or authorized distributors?
All MIMXRT685SFVKBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMXRT685SFVKBR meets industry standards.
7.What is the process for return or replacement of MIMXRT685SFVKBR?
All MIMXRT685SFVKBR units undergo pre-shipment inspection (PSI). If there is an issue with MIMXRT685SFVKBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMXRT685SFVKBR part is unused and in its original packaging.
Return procedure for MIMXRT685SFVKBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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