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onsemi MJD32T4G

Part No.:
MJD32T4G
Manufacturer:
onsemi
Category:
Single Bipolar Transistors
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixMJD32T4G.pdf
Description:
TRANS PNP 40V 3A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,074

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Product details

Overview

MJD32T4G from onsemi is a PNP silicon power transistor in DPAK (TO-252) package, rated for 40 V VCEO, 3.0 A continuous collector current, and 15 W total power dissipation at TC = 25 °C. It delivers hFE ≥ 10 at IC = 3 A, VCE = 4 V, and VCE(sat) ≤ 1.2 V under IC = 3 A / IB = 375 mA - suitable for low-speed switching and linear amplifier stages in automotive body control modules.

For engineers reviewing the MJD32T4G datasheet, pinout, applications, or equivalent options, this part serves as an AEC-Q101 qualified, Pb-free, surface-mount PNP complement to the MJD31 series - with verified thermal resistance RJC = 8.3 °C/W and junction temperature range of −65 °C to +150 °C for under-hood automotive use.

Technical Context

The MJD32T4G operates as a medium-power PNP bipolar junction transistor optimized for linear amplification and low-frequency switching up to ~3 MHz fT. Its DC current gain (hFE) is specified at two operating points: ≥25 at IC = 1 A and ≥10 at IC = 3 A, both at VCE = 4 V and TC = 25 °C. The device features electrically similar characteristics to legacy TIP32 devices but with enhanced thermal performance and AEC-Q101 qualification.

It supports safe operation across −65 °C to +150 °C junction temperature, with ESD ratings of HBM Class 3B (≥8 kV) and MM Class M3 (≥200 V). Thermal derating is defined at 0.12 W/°C above 25 °C when mounted on minimum recommended FR-4 pad (165 mm², 1 oz Cu), enabling stable performance in thermally constrained PCB layouts.

Key Specifications

Parameter Value and Actual Design Meaning
VCEO 40 V - Maximum collector-emitter voltage before breakdown under open-base conditions; defines safe DC blocking capability in switching circuits.
IC (continuous) 3.0 A - Continuous collector current rating at TC = 25 °C; determines maximum steady-state load drive capacity.
PD (TC = 25 °C) 15 W - Total power dissipation limit with heatsink contact; requires thermal interface design to maintain TJ ≤ 150 °C.
hFE @ IC = 3 A 10–50 - DC current gain range at full-rated current; enables predictable base drive sizing for saturation switching.
VCE(sat) ≤1.2 V @ IC = 3 A, IB = 375 mA - Low saturation voltage minimizes conduction loss in high-current PNP switch applications.
fT 3 MHz - Current-gain-bandwidth product; confirms suitability for audio-frequency amplification and <100 kHz PWM switching.
RJC 8.3 °C/W - Junction-to-case thermal resistance; establishes minimum heatsink requirement when case is directly thermally coupled.

Pinout & Package

DPAK (TO-252) surface-mount package with 4-pin outline (pins 1–4), 6.10 × 6.54 × 2.28 mm footprint, and exposed collector tab (pins 2 and 4) for thermal and electrical connection.

Pin/Terminal Circuit Role Design Meaning
1 Base Control terminal; accepts base current to enable conduction between emitter and collector; requires current-limiting resistor in most driver circuits.
2 Collector Main high-side current path; electrically and thermally connected to exposed metal tab; must be routed to ground or low-impedance return in PNP configurations.
3 Emiter High-side power input node; connects to positive rail in common-emitter switching; carries full load current and sets reference for base bias.
4 Collector Second collector terminal tied internally to pin 2; provides redundant thermal and electrical connection to heatsink or ground plane.

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive under-hood applications including BCMs and motor drivers with PPAP capability and NJV prefix traceability.
DPAK tape-and-reel packaging 2,500 units per reel (T4 suffix); compatible with automated SMT placement systems and supports high-volume production throughput.
Electrically similar to TIP32 Drop-in functional replacement for legacy through-hole TIP32 in upgraded surface-mount designs without circuit redesign.
Pb-free and RoHS compliant Meets global environmental regulations; UL 94 V−0 epoxy housing ensures flame resistance in enclosed automotive enclosures.
Low VCE(sat) at high IC ≤1.2 V at 3 A enables <3.6 W conduction loss per device - critical for thermally limited PCB areas in multi-channel drivers.

Applications

Automotive Body Control Module Industrial DC Motor Driver

Use Scenario: Driving 12 V solenoids and relays in door lock, window lift, and mirror adjustment circuits.

IC Role / Device Role / Timing Role: PNP high-side switch controlling current flow from battery rail to inductive loads.

Use Value: 40 V VCEO withstands automotive load-dump transients; AEC-Q101 qualification ensures reliability over 15-year vehicle lifetime.

Use Scenario: H-bridge half-bridge stage for bidirectional 24 V brushed DC motors in factory automation actuators.

IC Role / Device Role / Timing Role: Complementary PNP switch paired with NPN MJD31T4G in totem-pole output stage.

Use Value: Matched hFE and VCE(sat) with MJD31 series simplifies gate drive design and improves current balance across bridge legs.

Linear Audio Amplifier Stage Power Supply Pass Transistor

Use Scenario: Output stage in Class-A/B audio amplifiers delivering up to 5 W into 8 Ω speakers.

IC Role / Device Role / Timing Role: Linear-mode PNP emitter-follower providing current gain and low-output-impedance drive.

Use Value: fT = 3 MHz and hFE stability across −55 °C to +150 °C ensure consistent frequency response and thermal bias tracking.

Use Scenario: Series pass element in adjustable 3 A linear regulators for test equipment and lab power supplies.

IC Role / Device Role / Timing Role: High-current PNP pass transistor regulating output by modulating emitter-collector voltage drop.

Use Value: 15 W power rating and RJC = 8.3 °C/W allow >2 W dissipation with minimal heatsink - reducing system size and cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MJD32CT4G Higher VCEO = 100 V; same package, pinout, and thermal specs; hFE min 10 at IC = 3 A. Suitable for 48 V industrial systems or higher-voltage transient environments where 40 V margin is insufficient. Select MJD32CT4G only if system-level transients exceed 40 V - otherwise MJD32T4G offers better cost/performance fit for 12–24 V automotive use.
TIP32C Through-hole TO-220 package; VCEO = 100 V; hFE min 10 at IC = 3 A; no AEC-Q101 qualification. Limited to non-automotive, prototyping, or legacy repair contexts due to package and qualification mismatch. Use TIP32C only for bench testing or non-automotive replacements - not for new AEC-compliant designs requiring surface-mount assembly.

Compared with MJD32CT4G and TIP32C, the MJD32T4G provides optimal balance of automotive qualification, surface-mount compatibility, and 40 V system-level robustness - making it the preferred choice for volume production of 12 V/24 V automotive and industrial control modules.

Availability

MJD32T4G is available at Aetrix Electronics and suitable for automotive body control modules, industrial DC motor drivers, linear audio amplifiers, and adjustable linear power supplies requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MJD32T4G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensor, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.

The MJD32T4G belongs to onsemi's complementary power transistor family designed specifically for ruggedized, surface-mount, AEC-Q101 qualified switching and amplification in automotive and industrial environments.

FAQ

What is the maximum junction temperature rating for the MJD32T4G?

The MJD32T4G has a specified operating junction temperature range of −65 °C to +150 °C. This wide range supports deployment in under-hood automotive locations and industrial enclosures with elevated ambient temperatures. Derating curves in the datasheet define safe power limits above 25 °C case temperature, and the device must be mounted on the recommended 165 mm² copper pad to achieve the published RJA = 80 °C/W. The MJD32T4G maintains parameter integrity across this full range when operated within its absolute maximum ratings.

Is the MJD32T4G pin-compatible with the MJD31T4G?

Yes, the MJD32T4G is complementary and pin-compatible with the NPN MJD31T4G - both use identical DPAK (Case 369C) packaging with matching pin 1 (Base), pin 2 (Collector), pin 3 (Emitter), and pin 4 (Collector) assignments. This allows direct pairing in push-pull or H-bridge configurations without layout changes. However, polarity reversal must be observed in schematic capture and PCB routing, as MJD32T4G is PNP while MJD31T4G is NPN.

Does the MJD32T4G meet AEC-Q101 requirements?

Yes, the MJD32T4G is AEC-Q101 qualified and PPAP capable, as confirmed by its NJV prefix variant (NJVMJD32T4G*) and explicit statement in the datasheet. It undergoes stress testing for temperature cycling, humidity bias, mechanical shock, and ESD (HBM Class 3B, MM Class M3) per AEC-Q101 Rev D. This qualification validates its suitability for automotive electronic control units where long-term reliability under vibration, thermal cycling, and electrical stress is mandatory.

What is the typical DC current gain (hFE) of the MJD32T4G at 1 A collector current?

The MJD32T4G exhibits a minimum hFE of 25 at IC = 1 A, VCE = 4 V, and TC = 25 °C, with typical values reaching up to 50. This gain remains usable down to −55 °C and up to +150 °C, though reduced at temperature extremes. The datasheet Figure 15 confirms hFE ≥ 25 across the full industrial temperature range at this bias point, enabling predictable base drive design for linear and switching applications using the MJD32T4G.

Can the MJD32T4G replace a TIP32 in an existing design?

The MJD32T4G is electrically similar to the TIP32 series and serves as a surface-mount functional replacement - but it is not a direct drop-in due to package differences (DPAK vs. TO-220) and pinout variation. While electrical parameters like VCEO, IC, and hFE align closely, the MJD32T4G requires PCB layout revision to accommodate its smaller, leadless DPAK footprint and thermal pad. For new designs targeting automated assembly and AEC-Q101 compliance, the MJD32T4G is strongly preferred over TIP32.

MJD32T4G Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
Transistor Type:
PNP
Current - Collector (Ic) (Max):
3 A
Voltage - Collector Emitter Breakdown (Max):
40 V
Vce Saturation (Max) @ Ib, Ic:
1.2V @ 375mA, 3A
Current - Collector Cutoff (Max):
50µA
DC Current Gain (hFE) (Min) @ Ic, Vce:
10 @ 3A, 4V
Power - Max:
1.56 W
Frequency - Transition:
3MHz
Operating Temperature:
-65°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

MJD32T4G FAQ

1.How can I place an order for MJD32T4G through Aetrix?

Please submit a Request for Quotation (RFQ) for MJD32T4G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MJD32T4G reliable?

The price and inventory of MJD32T4G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MJD32T4G is usually 5 days.

3.What payment methods are accepted for MJD32T4G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MJD32T4G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MJD32T4G?

MJD32T4G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MJD32T4G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MJD32T4G?

For technical support, including MJD32T4G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MJD32T4G requirements.

6.How does Aetrix verify that MJD32T4G is sourced from the original manufacturer or authorized distributors?

All MJD32T4G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MJD32T4G meets industry standards.

7.What is the process for return or replacement of MJD32T4G?

All MJD32T4G units undergo pre-shipment inspection (PSI). If there is an issue with MJD32T4G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MJD32T4G part is unused and in its original packaging.

Return procedure for MJD32T4G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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