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NXP Semiconductors MK10DN512VLK10
- Part No.:
- MK10DN512VLK10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MK10DN512VLK10.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 80FQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,815
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Product details
Overview
MK10DN512VLK10 from NXP Semiconductors is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 512 KB flash, 128 KB RAM, and dual CAN interfaces. It supports industrial temperature range (–40 to 105°C), operates from 1.71–3.6 V, and integrates two 16-bit SAR ADCs with PGA, 12-bit DAC, and low-power timers - deployed in motor control and industrial automation systems.
For engineers reviewing the MK10DN512VLK10 datasheet, MK10DN512VLK10 pinout, MK10DN512VLK10 application, or MK10DN512VLK10 equivalent, key selection criteria include its 80-pin LQFP package, dual CAN 2.0B compliance, FlexBus external interface, real-time clock with battery backup, and support for multiple low-power stop modes down to 2.1 µA in VLLS1.
Technical Context
The MK10DN512VLK10 implements an ARM Cortex-M4 core with hardware DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system includes dual oscillators (3–32 MHz main + 32 kHz RTC), a Multi-Purpose Clock Generator (MCG), and programmable delay blocks for precise timing control.
Peripherals include eight-channel PWM/motor control timer, two quadrature decoder timers, four UARTs, two I²C, two SPI, SDHC, I²S, and a hardware CRC module. Analog subsystem comprises two independent 16-bit ADCs each with integrated PGA (up to ×64 gain), three analog comparators with embedded 6-bit DACs, and transimpedance amplifiers - all sharing a common voltage reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP extensions, no FPU - enables deterministic real-time signal processing in motor control and sensor fusion without floating-point overhead. |
| Max Clock Frequency | 100 MHz - delivers 125 DMIPS performance, sufficient for closed-loop servo control with <10 µs interrupt latency. |
| Flash / RAM | 512 KB program flash, 128 KB SRAM - supports complex firmware with bootloader, OTA update partitioning, and real-time data buffering. |
| Operating Voltage | 1.71–3.6 V - compatible with single Li-ion, 3.3 V industrial rails, and wide-input DC-DC converters without level-shifting. |
| Temperature Range | –40 to 105°C ambient - qualified for under-hood automotive subsystems and industrial PLC edge nodes. |
| Thermal Resistance | RθJC = 9°C/W (80 LQFP) - enables thermal design margin for sustained 100 MHz operation at 105°C ambient with standard PCB copper pour. |
| Low-Power Modes | VLLS1/VLLS2/VLLS3 stop currents as low as 2.1/2.2/3.0 µA - allows battery-backed RTC + wakeup logic to operate >10 years on CR2032. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pairs reduce IR drop and noise coupling; decoupling required per datasheet layout guidelines (e.g., 100 nF near each VDD). |
| VDDA, VSSA | Analog power supply and ground | Isolated analog domain enables clean 16-bit ADC conversion; requires separate low-noise LDO and star grounding. |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz fundamental-mode crystals; internal load capacitors configurable via registers - eliminates external caps for many designs. |
| EXTAL32/XTAL32 | 32 kHz RTC crystal input/output | Enables autonomous calendar/timekeeping during VLLS modes; supports low-power watch crystals (12.5 pF load). |
| CAN0_TX / CAN0_RX | Controller Area Network channel 0 differential signals | Direct connection to ISO 11898-2 transceiver; supports bit rates up to 1 Mbps with built-in loopback for self-test. |
| PTA0–PTA31, PTB0–PTB17, etc. | Multi-function GPIO pins | Each pin supports up to 8 alternate functions (e.g., UART0_TX, ADC0_SE0, TPM0_CH0); configurable slew rate, drive strength, pull-up/down. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B modules | Independent message buffers, flexible filtering, and time-triggered communication support - enables redundant bus architecture in safety-critical motion controllers. |
| Two 16-bit SAR ADCs with PGA | Each ADC integrates programmable gain amplifier (×1 to ×64), enabling direct connection of mV-range sensors (e.g., strain gauges, thermopiles) without external op-amps. |
| Hardware CRC-32 engine | Offloads checksum calculation from CPU for firmware image verification, OTA packet integrity, and EEPROM data validation - reduces CPU load by ~15% vs. software CRC. |
| FlexBus external interface | 8/16-bit parallel bus with wait-state control and burst mode - supports NOR flash, SRAM, and FPGA co-processors with sub-100 ns access times. |
| Low-leakage wakeup unit | Detects asynchronous events (GPIO, RTC alarm, comparator output) while in VLLS modes - wakes CPU in ≤92 µs from VLLS2, preserving energy budget. |
Applications
| Industrial Motor Control | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Closed-loop PMSM/BLDC motor drive with field-oriented control (FOC) and current sensing. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm, managing PWM generation, ADC sampling synchronization, and CAN diagnostics. Use Value: 100 MHz Cortex-M4 + dual 16-bit ADCs with PGA enable simultaneous current/voltage sampling at 100 kSPS with <1 µs inter-channel skew - critical for torque ripple reduction. |
Use Scenario: Centralized lighting, door lock, and window lift control with LIN/CAN gateway functionality. IC Role / Device Role / Timing Role: System-on-chip managing multiple CAN nodes, driving high-side/low-side loads, and monitoring battery voltage/temperature. Use Value: Dual CAN interfaces allow separation of powertrain and body networks; VLLS3 mode (3.0 µA) extends battery life during vehicle sleep cycles without compromising wakeup responsiveness. |
| Smart Grid Sensor Node | Medical Infusion Pump Controller |
Use Scenario: Transformer temperature and partial discharge monitoring with wireless backhaul. IC Role / Device Role / Timing Role: Data acquisition hub collecting analog inputs (RTD, CT), performing FFT analysis, and packaging data for RF transmission. Use Value: Hardware CRC and 128 KB RAM support secure firmware updates and local buffering of 10+ seconds of 16-bit sensor data - ensures data continuity during RF outages. |
Use Scenario: Precision fluid delivery with pressure sensing, stepper motor control, and alarm management. IC Role / Device Role / Timing Role: Safety-certified controller running dual-core lockstep (via SW-based redundancy), managing ADC-driven pressure feedback and stepper phase sequencing. Use Value: Two independent 16-bit ADCs with PGA allow ratiometric measurement of bridge sensors and absolute pressure transducers simultaneously - improves dose accuracy to ±0.5% full scale. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK10DN512VLH10 | Same core/peripherals but in 100-pin LQFP (14 mm × 14 mm); adds 12 more GPIOs and extra UART/I²C channels. | Suitable when board layout requires additional I/O or routing flexibility; not pin-compatible due to larger footprint and different pin mapping. | Select MK10DN512VLH10 only if I/O expansion or peripheral count exceeds MK10DN512VLK10's 80-pin constraints - no PCB reuse possible. |
| MKE15Z64VLH4 | ARM Cortex-M0+ core, 64 KB flash, 8 KB RAM, single CAN, no FlexBus; operates up to 48 MHz. | Targeted at cost-sensitive, lower-complexity applications where 100 MHz performance and dual CAN are unnecessary. | Choose MKE15Z64VLH4 for simpler BCM or sensor nodes where BOM cost reduction outweighs loss of DSP capability and memory headroom. |
Compared with MK10DN512VLK10, MK10DN512VLH10 offers expanded I/O at the cost of board area and layout redesign, while MKE15Z64VLH4 trades performance and feature depth for lower unit cost and power - making MK10DN512VLK10 optimal for mid-tier industrial control where balanced compute, analog integration, and CAN redundancy are essential.
Availability
MK10DN512VLK10 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body electronics, smart grid monitoring, and medical infusion systems requiring stable component supply across extended product lifecycles.
Supply support for MK10DN512VLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K10 family - including MK10DN512VLK10 - was designed for cost-sensitive, high-integration industrial control applications requiring robust analog peripherals, real-time responsiveness, and long-term supply assurance.
FAQ
What is the maximum operating frequency and core type of the MK10DN512VLK10?
The MK10DN512VLK10 features an ARM Cortex-M4 core with DSP extensions and operates at up to 100 MHz. It does not include a floating-point unit (FPU), distinguishing it from the 'F' variant (e.g., MK10FN). This configuration balances deterministic real-time performance with power efficiency for motor control and sensor processing tasks where fixed-point arithmetic suffices.
Does the MK10DN512VLK10 support CAN FD or only classical CAN 2.0B?
The MK10DN512VLK10 supports only classical CAN 2.0B (ISO 11898-1), not CAN FD. Its two CAN modules provide full 2.0B functionality including identifier masking, message buffering, and bit rates up to 1 Mbps. CAN FD support requires later Kinetis families (e.g., KV series) or S32K devices.
What are the supported low-power modes and their typical current consumption for MK10DN512VLK10?
The MK10DN512VLK10 supports multiple low-power modes: VLPR (1.12 mA), STOP (0.74 mA @ –40 to 25°C), VLLS1 (2.1 µA), VLLS2 (2.2 µA), and VLLS3 (3.0 µA) - all measured at 3.0 V. These modes retain RAM, select peripherals, and RTC functionality, enabling ultra-low-energy operation in battery-backed applications like smart meters and portable medical devices.
How much flash and RAM memory does the MK10DN512VLK10 include?
The MK10DN512VLK10 integrates 512 KB of on-chip program flash memory and 128 KB of SRAM. Flash is organized for wear-leveling and secure boot; RAM includes error detection capability. This memory capacity supports complex real-time OS deployments, cryptographic stacks, and large sensor data buffers without external memory.
What package type and pin count does the MK10DN512VLK10 use?
The MK10DN512VLK10 uses an 80-pin LQFP package (12 mm × 12 mm, 0.5 mm pitch), designated by the 'LK' suffix in its part number. This package provides a balance of I/O count, thermal performance (RθJC = 9°C/W), and manufacturability for industrial PCB assembly - distinct from the 100-pin 'LH' or 64-pin 'LH' variants in the same family.
MK10DN512VLK10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- Kinetis K10
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 31x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512VLK10 FAQ
1.How can I place an order for MK10DN512VLK10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512VLK10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512VLK10 reliable?
The price and inventory of MK10DN512VLK10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VLK10 is usually 5 days.
3.What payment methods are accepted for MK10DN512VLK10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VLK10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512VLK10?
MK10DN512VLK10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512VLK10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512VLK10?
For technical support, including MK10DN512VLK10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VLK10 requirements.
6.How does Aetrix verify that MK10DN512VLK10 is sourced from the original manufacturer or authorized distributors?
All MK10DN512VLK10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VLK10 meets industry standards.
7.What is the process for return or replacement of MK10DN512VLK10?
All MK10DN512VLK10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VLK10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512VLK10 part is unused and in its original packaging.
Return procedure for MK10DN512VLK10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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