NXP Semiconductors MK10DN512VLK10R
- Part No.:
- MK10DN512VLK10R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MK10DN512VLK10R.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 80FQFP
- Quantity:
- Payment:

- Shipping:

Inventory:7,700
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK10DN512VLK10 from NXP Semiconductors is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 512 KB on-chip flash and 128 KB RAM, rated for –40°C to +105°C ambient, and housed in an 80-pin LQFP package. It integrates dual CAN interfaces, two 16-bit SAR ADCs with PGA, 12-bit DAC, and low-power timers - deployed in industrial motor control and automotive body electronics.
For engineers reviewing the MK10DN512VLK10 datasheet, MK10DN512VLK10 pinout, MK10DN512VLK10 application, or MK10DN512VLK10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with DSP support, dual CAN 2.0B compliance, 512 KB flash/128 KB RAM memory configuration, thermal resistance of 9°C/W (junction-to-case), and operation across extended temperature range (–40°C to +105°C) in 80 LQFP.
Technical Context
The MK10DN512VLK10 implements a full-featured Kinetis K10 sub-family architecture with integrated MCG clock generator supporting multiple oscillator sources (3–32 MHz main crystal, 32 kHz RTC crystal), configurable low-power modes (VLLS1–VLLS3, VLPS, STOP), and hardware-based security modules including CRC accelerator and 128-bit unique ID. Its memory subsystem includes FlexBus external interface and EzPort serial programming.
Analog subsystem integration includes two independent 16-bit SAR ADCs each with programmable gain amplifier (up to ×64), 12-bit DAC, three analog comparators with embedded 6-bit DACs, and transimpedance amplifiers - all supported by dedicated voltage reference and low-leakage wakeup unit for sensor interface applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP instructions, delivering 1.25 Dhrystone MIPS/MHz - enables real-time signal processing in motor control and audio applications. |
| Max Clock Frequency | 100 MHz - supports deterministic execution of time-critical control loops and high-bandwidth communication stacks. |
| Flash / RAM | 512 KB program flash, 128 KB SRAM - sufficient for complex firmware with bootloader, safety monitoring, and field-upgradable code partitions. |
| Operating Voltage | 1.71 V to 3.6 V - compatible with single-supply industrial systems and battery-backed operation down to 1.71 V. |
| Temperature Range | –40°C to +105°C - qualified for under-hood automotive and industrial control environments without derating. |
| Thermal Resistance | RθJC = 9°C/W - defines junction-to-case heat transfer efficiency for thermal design in 80 LQFP package with heatsink pad. |
| I/O Count | 64 GPIO pins (multiplexed) - supports dense peripheral interfacing including CAN, UART, SPI, I²C, and TSI touch sensing. |
| ADC/DAC | Two 16-bit SAR ADCs (each with PGA up to ×64), one 12-bit DAC - enables high-resolution sensor acquisition and analog actuator control in closed-loop systems. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm), thermally enhanced with exposed thermal pad (JESD51-5 compliant). Pinout conforms to K10 Sub-Family standard assignment per Revision 3 data sheet, supporting multiplexed functions across PORTA–PORTH.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Digital power supply / ground | Multiple dedicated pairs ensure stable core voltage delivery and noise isolation for mixed-signal operation. |
| VDDA/VSSA | Analog power supply / ground | Separate analog domain with ≤0.1 V differential tolerance vs. digital supply - critical for ADC/DAC accuracy. |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals; internal load capacitors configurable - enables precise timing for CAN, USB, and real-time control. |
| EXTAL32/XTAL32 | 32 kHz RTC crystal input/output | Low-power oscillator path for calendar timekeeping and wake-from-stop functionality with <1 µA retention current. |
| CAN0_TX/CAN0_RX | CAN 2.0B controller channel 0 | Differential transmit/receive signals compliant with ISO 11898-1; supports bit rates up to 1 Mbps in automotive networks. |
| PTA0–PTA31, PTB0–PTH0 | General-purpose I/O with alternate functions | 64 GPIO pins with configurable slew rate, drive strength, pull-up/down, and digital filter - adaptable to legacy and modern interface protocols. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B modules | Enables redundant or multi-bus automotive networking (e.g., powertrain + body domain) without external controllers. |
| 16-channel DMA with 63 request sources | Offloads CPU from data movement tasks (e.g., ADC sampling → RAM → CAN transmission), reducing latency and power consumption. |
| Memory Protection Unit (MPU) | Prevents unauthorized access between firmware partitions - essential for ASIL-B software separation and functional safety compliance. |
| Low-leakage wakeup unit | Wakes CPU from VLLS3 mode in ≤92 µs using external interrupt or RTC alarm - supports ultra-low-power sensor polling at sub-millisecond intervals. |
| Hardware CRC module | Accelerates checksum computation for firmware updates and communication frame validation - improves reliability without CPU overhead. |
| TSI touch sensing interface | Capacitive touch detection with built-in charge-transfer measurement - enables robust human-machine interface in harsh industrial environments. |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and power seats. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms via Cortex-M4 DSP instructions, synchronized PWM generation, and ADC sampling at 1 µs intervals. Use Value: 100 MHz core + dual 16-bit ADCs enable simultaneous current/voltage sensing and torque calculation within 5 µs loop time. |
Use Scenario: Central body controller managing door locks, lighting, and window lift functions. IC Role / Device Role / Timing Role: Dual CAN nodes handle gateway arbitration and LIN bridge translation; low-power stop modes extend battery life during vehicle sleep. Use Value: VLLS1/VLLS3 current as low as 2.1 µA allows >10-year battery backup for RTC and intrusion detection logic. |
| Smart Energy Metering | Medical Sensor Hub |
Use Scenario: Polyphase electricity meter with harmonic analysis and tamper detection. IC Role / Device Role / Timing Role: High-accuracy 16-bit ADC acquisition with PGA gain calibration, CRC-verified firmware updates, and secure boot. Use Value: Programmable gain amplifier (×64) extends dynamic range to measure both millivolt CT outputs and volt-level shunt signals without external op-amps. |
Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature sensors. IC Role / Device Role / Timing Role: Low-noise analog front-end with transimpedance amplifiers for photodiode inputs, and 12-bit DAC for LED bias control. Use Value: Integrated TIA + 12-bit DAC eliminates discrete analog components, reducing BOM count and improving calibration stability over temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK10DN512VLH10 | Same core, flash, and peripherals but in 100-pin LQFP (14 mm × 14 mm) package - adds 16 extra GPIO and second SDHC interface. | Suitable when board layout requires more I/O or SD card support; not pin-compatible due to larger footprint and different pin mapping. | Select MK10DN512VLH10 only if additional GPIO or SDHC capability is required and PCB redesign is acceptable. |
| MK20DN512VLK10 | Successor K20 variant with identical 80 LQFP package, same flash/RAM, but adds USB OTG controller and improved ADC SNR (75 dB vs. 70 dB). | Better suited for USB-connected diagnostic tools or portable devices requiring host/device flexibility; retains CAN and low-power features. | Choose MK20DN512VLK10 when USB connectivity is needed and backward compatibility with MK10DN512VLK10 software is verified. |
Compared with MK10DN512VLK10, MK10DN512VLH10 offers expanded I/O at the cost of footprint and layout change, while MK20DN512VLK10 delivers USB capability in the same 80 LQFP form factor - making it the preferred upgrade path where USB integration is required without PCB revision.
Availability
MK10DN512VLK10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart energy metering requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MK10DN512VLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge processing.
The MK10DN512VLK10 belongs to the Kinetis K10 family - designed specifically for cost-sensitive, high-reliability embedded control applications demanding rich analog integration, deterministic real-time performance, and extended temperature operation.
FAQ
What is the maximum operating frequency of the MK10DN512VLK10?
The MK10DN512VLK10 operates at up to 100 MHz using its ARM Cortex-M4 core with DSP extensions. This frequency is achievable across the full –40°C to +105°C ambient temperature range when supplied with 1.71–3.6 V and configured in FEI or PEE clock mode per the K10 Sub-Family Data Sheet Rev. 3. The 100 MHz rating is validated with thermal resistance RθJC = 9°C/W in the 80 LQFP package.
Does the MK10DN512VLK10 support CAN FD or only classical CAN 2.0B?
The MK10DN512VLK10 supports only classical CAN 2.0B (ISO 11898-1) - not CAN FD. Its two CAN modules implement full CAN protocol handling including message buffering, acceptance filtering, and error confinement, with bit rates up to 1 Mbps. CAN FD capability was introduced in later Kinetis families (e.g., KV series) and is not present in the K10 sub-family specification.
What is the flash endurance and data retention specification for the MK10DN512VLK10?
The MK10DN512VLK10 specifies 100,000 erase/write cycles for its 512 KB program flash memory and 20-year data retention at ≤85°C ambient, per Freescale's K10 Sub-Family qualification standards. These values apply under recommended operating conditions (VDD = 1.71–3.6 V, TA ≤ 85°C); retention degrades above 85°C per JEDEC JESD47 guidelines.
Can the MK10DN512VLK10 operate from a single 3.3 V supply for both digital and analog domains?
Yes - the MK10DN512VLK10 supports single 3.3 V operation for both VDD and VDDA, provided the differential voltage |VDD – VDDA| remains ≤0.1 V and VSS/VSSA are tied. This configuration is explicitly validated in the data sheet's Table 1 (Voltage and Current Operating Requirements) and simplifies power design for non-precision analog applications where ADC/DAC accuracy requirements permit shared supply.
Is the MK10DN512VLK10 pin-compatible with any other Kinetis devices?
The MK10DN512VLK10 is pin-compatible only with other K10 devices in the same 80 LQFP (LK) package variant, such as MK10DN256VLK10 and MK10DN128VLK10 - sharing identical pinout, electrical characteristics, and peripheral mapping. It is not pin-compatible with K20 or KL series devices, even in 80 LQFP, due to differences in peripheral placement and register-level configuration.
MK10DN512VLK10R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- Kinetis K10
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 31x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512VLK10R FAQ
1.How can I place an order for MK10DN512VLK10R through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512VLK10R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512VLK10R reliable?
The price and inventory of MK10DN512VLK10R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VLK10R is usually 5 days.
3.What payment methods are accepted for MK10DN512VLK10R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VLK10R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512VLK10R?
MK10DN512VLK10R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512VLK10R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512VLK10R?
For technical support, including MK10DN512VLK10R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VLK10R requirements.
6.How does Aetrix verify that MK10DN512VLK10R is sourced from the original manufacturer or authorized distributors?
All MK10DN512VLK10R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VLK10R meets industry standards.
7.What is the process for return or replacement of MK10DN512VLK10R?
All MK10DN512VLK10R units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VLK10R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512VLK10R part is unused and in its original packaging.
Return procedure for MK10DN512VLK10R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK10DN512VLK10R Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

