Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MK10DN512VLL10

Part No.:
MK10DN512VLL10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixMK10DN512VLL10.pdf
Description:
IC MCU 32BIT 512KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,066

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MK10DN512VLL10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 512 KB on-chip flash, 128 KB RAM, dual CAN interfaces, and integrated analog peripherals including two 16-bit SAR ADCs with PGA, 12-bit DAC, and three analog comparators - deployed in industrial motor control and automotive body electronics.

For engineers reviewing the MK10DN512VLL10 datasheet, MK10DN512VLL10 pinout, MK10DN512VLL10 application, or MK10DN512VLL10 equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 100 LQFP (14 mm × 14 mm) package with 100 pins, FlexBus external memory interface, and support for low-power stop modes down to 2.1 µA (VLLS1).

Technical Context

The MK10DN512VLL10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, paired with a multi-purpose clock generator supporting 3–32 MHz crystal and 32 kHz RTC oscillators. Its memory subsystem includes non-FlexMemory flash (512 KB), 128 KB SRAM, EzPort serial programming, and FlexBus for external parallel memory expansion.

Peripherals are organized around a 16-channel DMA controller, memory protection unit (MPU), low-leakage wakeup unit, and comprehensive analog suite: dual 16-bit ADCs each with programmable gain amplifier (up to ×64), 12-bit DAC, transimpedance amplifiers, and analog comparators with embedded 6-bit DACs and programmable references - all operating across the full 1.71–3.6 V supply range.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP, 100 MHz max - delivers 125 DMIPS and supports real-time signal processing in motor control and sensor fusion.
Flash / RAM 512 KB program flash (non-FlexMemory), 128 KB SRAM - sufficient for complex firmware with bootloader, safety stack, and data logging buffers.
Supply Range 1.71 V to 3.6 V - enables direct interfacing with Li-ion battery systems (2.7–3.6 V) and industrial 3.3 V rails without level shifting.
Temperature Range -40°C to +105°C ambient - qualified for under-hood automotive and industrial control cabinet deployment.
Analog Peripherals Two 16-bit SAR ADCs (with ×64 PGA), 12-bit DAC, 3× analog comparators (each with 6-bit DAC reference) - supports closed-loop analog sensing and actuation without external signal conditioning.
Communication 2× CAN 2.0B, 5× UART, 3× SPI, 2× I²C, SDHC, I²S - meets requirements for vehicle network gateways and industrial HMI backplanes.
Low-Power Modes VLLS1/VLLS2/VLLS3 stop currents as low as 2.1 µA/2.2 µA/3.0 µA - enables battery-backed RTC and wake-on-event operation for >10-year shelf life in remote sensors.

Pinout & Package

LQFP-100 (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, thermally enhanced package with exposed thermal pad - supports high-density PCB layouts and reliable thermal dissipation in sealed enclosures.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Power and ground domains Separate digital/analog supplies reduce noise coupling; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy.
PTA0–PTA31, PTB0–PTB17, etc. GPIO multiplexed signals Over 80 configurable GPIOs with 5 V-tolerant inputs, internal pull-up/pull-down (20–50 kΩ), and slew rate control - simplify interface to legacy 5 V logic and sensors.
EXTAL/XTAL, EXTAL32/XTAL32 Crystal oscillator inputs Supports primary 3–32 MHz system clock and independent 32.768 kHz RTC crystal - enables precise timekeeping and jitter-free communication timing.
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX CAN transceiver I/O Dual isolated CAN controllers compliant with ISO 11898-1 - allow redundant bus architecture or gateway bridging between chassis and powertrain networks.
ADC0_SE0–ADC0_SE15, ADC1_SE0–ADC1_SE15 Analog input channels 32 total single-ended ADC inputs across two modules, each with dedicated PGA - enable simultaneous high-resolution measurement of current, voltage, and temperature in motor drives.

Key Features

Feature Design Value
Hardware CRC module Accelerates checksum calculation for firmware OTA updates and EEPROM data integrity verification - reduces CPU load by >95% vs. software CRC-32.
Memory Protection Unit (MPU) Enforces privilege-level access control across flash, RAM, and peripheral address spaces - essential for ASIL-B functional safety partitioning per ISO 26262.
Programmable Delay Block (PDB) Provides precise, jitter-free trigger timing for ADC sampling and PWM generation - synchronizes analog capture with motor phase commutation events.
Low-Power Timer (LPTMR) 16-bit timer running from 32 kHz LPO or RTC clock - maintains accurate timekeeping during VLLS stop modes with sub-second resolution.
Touch Sensor Interface (TSI) Capacitive touch sensing on up to 16 channels with hardware auto-calibration - enables robust, low-power HMI buttons and sliders without external ICs.

Applications

Industrial Motor Control Automotive Body Control Module (BCM)

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and power seats.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, synchronized ADC sampling, and 6-channel complementary PWM generation with dead-time insertion.

Use Value: Integrated PDB and dual 16-bit ADCs eliminate external timing ICs and reduce BOM count by 3 components versus discrete MCU + analog front-end solutions.

Use Scenario: Centralized lighting, window lift, and door lock management in passenger vehicles.

IC Role / Device Role / Timing Role: CAN message routing, LIN slave emulation, and high-side/low-side driver control with diagnostic feedback.

Use Value: Dual CAN controllers and 128 KB RAM enable concurrent handling of chassis CAN and infotainment CAN traffic while storing fault logs for OBD-II compliance.

Smart Energy Metering Medical Patient Monitor Front-End

Use Scenario: Polyphase electricity meter with harmonic analysis and tamper detection.

IC Role / Device Role / Timing Role: High-accuracy voltage/current sampling via dual ADCs with PGA, real-time FFT computation using DSP instructions.

Use Value: 16-bit ADC resolution with ×64 PGA achieves >100 dB dynamic range - meets IEC 62053-22 Class 0.2 accuracy without external op-amps.

Use Scenario: Portable ECG and SpO₂ acquisition with analog front-end conditioning.

IC Role / Device Role / Timing Role: Simultaneous analog acquisition from multiple biopotential channels, digital filtering, and USB/UART telemetry transmission.

Use Value: On-chip transimpedance amplifiers and 12-bit DAC simplify optical sensor biasing and reference generation - cuts analog design cycle by 4 weeks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MKE15Z256VLH8 ARM Cortex-M0+, 80 MHz, 256 KB flash, no CAN, 1× 16-bit ADC, 1.71–5.5 V supply Targeted at cost-sensitive consumer appliances; lacks dual CAN and high-resolution analog for automotive/industrial use Select when CAN and extended temp are not required, and lower power consumption (<1.5 µA VLLS) is prioritized over compute throughput.
MIMXRT1021DAG5A ARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, 1× 12-bit ADC, 1.0–1.25 V core, 3.3 V I/O Requires external QSPI flash; higher performance but larger footprint and stricter power sequencing Choose for advanced GUI or AI inference at edge; avoid if board space, BOM simplicity, or -40°C to +105°C operation are critical constraints.

Compared with MKE15Z256VLH8, MK10DN512VLL10 provides 2× more flash, dual CAN, and superior analog precision - making it suitable for ASIL-B systems where MKE15Z falls short. Against MIMXRT1021DAG5A, MK10DN512VLL10 offers integrated flash, simpler power design, and guaranteed extended temperature operation - reducing qualification effort in harsh environments.

Availability

MK10DN512VLL10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and medical patient monitor front-end designs requiring stable component supply across long production lifecycles.

Supply support for MK10DN512VLL10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and automotive-grade reliability.

The MK10DN512VLL10 belongs to the Kinetis K10 family - designed specifically for cost-optimized, high-integration embedded control in automotive body electronics and industrial automation where extended temperature operation, analog integration, and functional safety readiness are mandatory.

FAQ

What is the maximum operating frequency and core architecture of the MK10DN512VLL10?

The MK10DN512VLL10 features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz. It delivers 1.25 Dhrystone MIPS per MHz and supports single-cycle multiply-accumulate (MAC) operations. This performance level is confirmed in the K10 Sub-Family Data Sheet Rev. 3 (2013), where MK10DN512VLL10 is explicitly listed under the 100 MHz speed grade (CC = 10). The MK10DN512VLL10 achieves deterministic real-time response in motor control loops and audio processing tasks.

Does the MK10DN512VLL10 support CAN FD or only classical CAN 2.0B?

The MK10DN512VLL10 supports two Controller Area Network (CAN) modules compliant with ISO 11898-1:2015, which defines classical CAN 2.0B (up to 1 Mbps). It does not support CAN FD - the K10 Sub-Family Data Sheet explicitly lists "Controller Area Network (CAN) modules" without FD capability, and no CAN FD registers, bit-rate switching, or payload extension features are documented for this device. For CAN FD, designers should consider later Kinetis families such as KV series or S32K.

What package type and pin count does the MK10DN512VLL10 use?

The MK10DN512VLL10 uses a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch), identified by the "LL" package code in its part number per the K10 Sub-Family Data Sheet section 2.3. This package includes an exposed thermal pad for enhanced heat dissipation and is RoHS-compliant. Pin assignments are fully detailed in Section 8 ("Pinout") of the datasheet, with signal multiplexing defined for all 100 terminals.

What are the supported voltage and temperature ranges for the MK10DN512VLL10?

The MK10DN512VLL10 operates across a supply voltage range of 1.71 V to 3.6 V and an ambient temperature range of -40°C to +105°C, as specified in the "Operating Characteristics" section of the K10 Sub-Family Data Sheet. These ratings are validated for the VLL (100-pin LQFP) package variant and apply to all core, analog, and I/O functions - enabling deployment in under-hood automotive and industrial control environments without derating.

How much on-chip flash and RAM does the MK10DN512VLL10 include?

The MK10DN512VLL10 integrates 512 KB of program flash memory and 128 KB of SRAM, both located on-die. As indicated by the "512" field in its part number and confirmed in the "Memories and memory interfaces" section of the datasheet, this flash is non-FlexMemory (i.e., no configurable EEPROM partitioning). The 128 KB RAM supports large buffers for communication stacks, FFT computation, and real-time OS task scheduling - verified in power consumption tables where IDD_RUN values assume full RAM utilization.

MK10DN512VLL10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
Kinetis K10
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 37x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK10DN512VLL10 FAQ

1.How can I place an order for MK10DN512VLL10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK10DN512VLL10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK10DN512VLL10 reliable?

The price and inventory of MK10DN512VLL10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VLL10 is usually 5 days.

3.What payment methods are accepted for MK10DN512VLL10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VLL10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK10DN512VLL10?

MK10DN512VLL10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK10DN512VLL10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK10DN512VLL10?

For technical support, including MK10DN512VLL10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VLL10 requirements.

6.How does Aetrix verify that MK10DN512VLL10 is sourced from the original manufacturer or authorized distributors?

All MK10DN512VLL10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VLL10 meets industry standards.

7.What is the process for return or replacement of MK10DN512VLL10?

All MK10DN512VLL10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VLL10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK10DN512VLL10 part is unused and in its original packaging.

Return procedure for MK10DN512VLL10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MK10DN512VLL10 Tags

  • MK10DN512VLL10
  • MK10DN512VLL10 PDF
  • MK10DN512VLL10 Datasheet
  • MK10DN512VLL10 Specifications
  • MK10DN512VLL10 Images
  • NXP Semiconductors
  • NXP Semiconductors MK10DN512VLL10
  • Buy MK10DN512VLL10
  • MK10DN512VLL10 Price
  • MK10DN512VLL10 Distributor
  • MK10DN512VLL10 Supplier
  • MK10DN512VLL10 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER