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NXP Semiconductors MK10DN512VLQ10
- Part No.:
- MK10DN512VLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK10DN512VLQ10.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MK10DN512VLQ10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 512 KB on-chip program flash memory, 128 KB RAM, and integrated analog peripherals including dual 16-bit SAR ADCs and two 12-bit DACs - deployed in industrial motor control systems requiring deterministic real-time response and mixed-signal integration.
For engineers reviewing the MK10DN512VLQ10 datasheet, MK10DN512VLQ10 pinout, MK10DN512VLQ10 application, or MK10DN512VLQ10 equivalent, key selection considerations include its -40°C to +105°C extended temperature rating, dual CAN 2.0B interfaces, FlexBus external memory interface, low-power stop modes down to 2.1 µA, and LQFP-144 package compatibility with industrial PCB layouts.
Technical Context
The MK10DN512VLQ10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, supported by a multi-purpose clock generator with 3–32 MHz crystal oscillator input and 32 kHz RTC oscillator. Its memory subsystem includes non-volatile 512 KB flash (no FlexMemory), 128 KB SRAM, and EzPort serial programming interface.
System-level features include a 16-channel DMA controller servicing 63 request sources, memory protection unit (MPU) with multi-master arbitration, and low-leakage wakeup unit enabling sub-µA stop modes. Analog integration comprises two independent 16-bit ADCs each with programmable gain amplifier (up to ×64), two 12-bit DACs, three analog comparators with embedded 6-bit DACs, and transimpedance amplifiers for sensor signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-M4 with DSP extensions, no FPU - enables real-time signal processing without floating-point overhead |
| Max Operating Frequency | 100 MHz - delivers 125 DMIPS performance for deterministic control loop execution |
| Flash Memory | 512 KB program flash only (M = N in part number) - supports large firmware images and bootloader separation |
| RAM | 128 KB SRAM - sufficient for real-time buffers, communication stacks, and control algorithm state storage |
| Operating Voltage | 1.71 V to 3.6 V - compatible with single Li-ion battery or regulated 3.3 V industrial rails |
| Temperature Range | -40°C to +105°C (T = V) - qualified for under-hood automotive and industrial ambient environments |
| Package | 144-pin LQFP (20 mm × 20 mm, PP = LQ) - surface-mount compatible with standard reflow profiles and manual inspection |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pins ensure low-impedance power delivery and noise isolation for core and I/O domains |
| VDDA, VSSA | Analog power supply and ground | Separate analog rail minimizes digital switching noise coupling into ADC/DAC reference paths |
| EXTAL/XTAL | Main system crystal oscillator inputs | Supports 3–32 MHz fundamental-mode crystals for precise clock generation and jitter-sensitive timing |
| RTC_CLKIN | 32 kHz real-time clock input | Enables battery-backed timekeeping with external 32.768 kHz crystal or oscillator |
| CAN0_TX / CAN0_RX | Controller Area Network channel 0 differential signals | Direct connection to ISO 11898-compliant transceiver for robust automotive/industrial bus communication |
| ADC0_SE0–ADC0_SE15 | Analog input channels for first 16-bit SAR ADC | Configurable as single-ended or differential inputs with PGA gain up to ×64 for low-level sensor signals |
| PTE0–PTE31 | General-purpose I/O port E pins | 32-bit port supporting GPIO, UART, SPI, I²C, and timer capture/compare functions with configurable slew rate and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16-bit SAR ADCs with PGA | Each ADC supports up to 16-bit resolution at 1 MSPS with integrated programmable gain amplifier (×1 to ×64) - eliminates external signal conditioning for current/voltage sensing |
| Two 12-bit DAC outputs | Provides precision analog waveform generation or reference voltage synthesis for closed-loop control actuation |
| Eight-channel PWM timer with motor control extensions | Includes dead-time insertion, fault protection inputs, and complementary output pairs - directly drives 3-phase inverter gate drivers |
| FlexBus external bus interface | 8/16-bit parallel interface supporting SRAM, NOR flash, and FPGA glueless interfacing - extends memory and peripheral capability beyond on-chip limits |
| Low-power stop modes down to 2.1 µA | VLLS1 mode retains RAM and selected wake-up sources while disabling CPU, flash, and most peripherals - ideal for battery-powered remote sensors |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, synchronized PWM generation, and high-speed ADC sampling of phase currents and back-EMF. Use Value: Integrated dual ADCs with PGA enable direct current sensing without external op-amps; 100 MHz core ensures <1 µs interrupt latency for fast overcurrent protection. | Use Scenario: Central body controller managing door locks, window lifts, lighting, and mirror positioning. IC Role / Device Role / Timing Role: CAN 2.0B node coordinating with other ECUs; analog inputs monitor potentiometer positions; PWM outputs drive small DC motors and LED dimming. Use Value: Dual CAN modules allow redundant or multi-bus architecture; -40°C to +105°C rating ensures operation in engine bay proximity; 128 KB RAM supports AUTOSAR-compliant software partitions. |
| Smart Grid Sensor Node | Medical Diagnostic Equipment |
Use Scenario: Transformer monitoring unit measuring voltage, current, and temperature with wireless telemetry upload. IC Role / Device Role / Timing Role: High-accuracy analog acquisition front-end with 16-bit ADCs, real-time clock for timestamping, and UART/SDHC for local data logging. Use Value: 512 KB flash stores firmware plus historical waveform buffers; low-power VLLS3 mode (<23 µA) extends battery life in unattended deployments. | Use Scenario: Portable ultrasound front-end requiring analog beamforming and time-of-flight measurement. IC Role / Device Role / Timing Role: Precision timing source for echo delay measurement; transimpedance amplifiers condition photodiode signals; DACs generate excitation waveforms. Use Value: On-chip transimpedance amplifiers reduce component count and board space; 16-bit ADC resolution supports >70 dB dynamic range required for weak acoustic return signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K22FN512VLQ12 | ARM Cortex-M4F with FPU, 120 MHz max, same 144-LQFP package, 512 KB flash, but adds floating-point unit and higher-speed USB OTG | Better suited for applications requiring intensive floating-point math (e.g., FFT-based spectral analysis), not needed for fixed-point motor control | Select MK10DN512VLQ10 when deterministic fixed-point performance, lower cost, and proven qualification in harsh environments are prioritized over FPU capability |
| STM32F407VGT6 | ARM Cortex-M4F @ 168 MHz, 1 MB flash, 192 KB RAM, different pinout (100-LQFP), no FlexBus, single 12-bit ADC (2.4 MSPS) | Lacks FlexBus and dual high-resolution ADCs; requires external memory for large buffers; higher clock speed increases EMI risk in sensitive analog designs | Choose MK10DN512VLQ10 where dual 16-bit ADCs, FlexBus expansion, and industrial temperature grade are mandatory design requirements |
Compared with K22FN512VLQ12 and STM32F407VGT6, the MK10DN512VLQ10 offers superior analog integration density, deterministic low-latency interrupt response due to absence of FPU pipeline complexity, and native support for legacy industrial protocols via FlexBus - making it optimal for cost-sensitive, mixed-signal embedded control where floating-point computation is unnecessary.
Availability
MK10DN512VLQ10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart grid sensor nodes, and medical diagnostic equipment requiring stable component supply across long product lifecycles.
Supply support for MK10DN512VLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MK10DN512VLQ10 belongs to the Kinetis K10 microcontroller family, designed specifically for cost-optimized, mixed-signal industrial control applications demanding high analog integration, deterministic real-time performance, and extended temperature reliability.
FAQ
What is the maximum operating frequency of the MK10DN512VLQ10?
The MK10DN512VLQ10 operates at a maximum frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This frequency is achievable across the full -40°C to +105°C temperature range when supplied within the 1.71 V to 3.6 V voltage specification. The MK10DN512VLQ10 achieves 125 DMIPS at this speed, supporting tight real-time control loops without requiring external clock multiplication.
Does the MK10DN512VLQ10 include FlexMemory?
No, the MK10DN512VLQ10 does not include FlexMemory. Its part number encoding (M = N) explicitly indicates "program flash only" configuration. It contains 512 KB of main program flash memory and 128 KB of SRAM, but lacks FlexNVM and FlexRAM blocks found in X-series variants like MK10DX256VLQ10. This makes the MK10DN512VLQ10 suitable for applications requiring large code storage without runtime reconfigurable non-volatile data storage.
What analog peripherals are integrated into the MK10DN512VLQ10?
The MK10DN512VLQ10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) supporting gains up to ×64; two 12-bit DACs; three analog comparators (each with an embedded 6-bit DAC and programmable reference); two transimpedance amplifiers; and a precision voltage reference module. These peripherals are fully accessible via the MK10DN512VLQ10's dedicated analog I/O pins and support simultaneous sampling and hardware-triggered conversions.
Which communication interfaces does the MK10DN512VLQ10 support?
The MK10DN512VLQ10 supports two Controller Area Network (CAN) 2.0B modules, three SPI modules, two I²C modules, six UART modules, one Secure Digital Host Controller (SDHC), and one I²S audio interface. All interfaces are independently clocked and configurable via the device's crossbar switch. The presence of dual CAN controllers and FlexBus makes the MK10DN512VLQ10 especially well-suited for industrial networking and external memory expansion.
What low-power modes are available on the MK10DN512VLQ10?
The MK10DN512VLQ10 offers seven low-power modes: RUN, WAIT, VLPR, STOP, VLPS, LLS, and VLLSx (VLLS0–VLLS3). In VLLS1 mode, current consumption drops to 2.1 µA at 3.0 V and 25°C while retaining RAM and select wake-up sources. VLLS3 mode consumes 3.0 µA under the same conditions and supports RTC alarm wake-up. These modes are controlled via the System Mode Controller (SMC) and are validated across the full -40°C to +105°C operating range for the MK10DN512VLQ10.
MK10DN512VLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K10
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 46x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512VLQ10 FAQ
1.How can I place an order for MK10DN512VLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512VLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512VLQ10 reliable?
The price and inventory of MK10DN512VLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VLQ10 is usually 5 days.
3.What payment methods are accepted for MK10DN512VLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512VLQ10?
MK10DN512VLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512VLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512VLQ10?
For technical support, including MK10DN512VLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VLQ10 requirements.
6.How does Aetrix verify that MK10DN512VLQ10 is sourced from the original manufacturer or authorized distributors?
All MK10DN512VLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VLQ10 meets industry standards.
7.What is the process for return or replacement of MK10DN512VLQ10?
All MK10DN512VLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512VLQ10 part is unused and in its original packaging.
Return procedure for MK10DN512VLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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