Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MK10DN512VMC10R

Part No.:
MK10DN512VMC10R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-LFBGA
Datasheet:
AetrixMK10DN512VMC10R.pdf
Description:
IC MCU 32B 512KB FLASH 121MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,816

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MK10DN512VMC10R from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extension, designed for embedded control applications requiring high computational throughput and mixed-signal integration. It operates at up to 100 MHz, integrates 512 KB flash and 128 KB RAM, supports -40 to 105°C ambient operation, and features dual CAN, six UARTs, and two 16-bit SAR ADCs - used in industrial motor control systems.

For engineers reviewing the MK10DN512VMC10R datasheet, MK10DN512VMC10R pinout, MK10DN512VMC10R application, or MK10DN512VMC10R equivalent, key selection considerations include its 121-pin MAPBGA package, 100 MHz core frequency, FlexBus interface capability, low-power stop modes down to 2.1 µA, and dual CAN 2.0B compliance for real-time deterministic networking.

Technical Context

The MK10DN512VMC10R implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, enabling efficient signal processing in motor control and sensor fusion. Its memory subsystem includes 512 KB on-chip program flash with EEPROM emulation via FlexMemory partitioning, 128 KB SRAM, and EzPort serial programming support.

System-level timing is managed by a multi-source clock generator supporting 3–32 MHz crystal input, 32 kHz RTC oscillator, and internal precision oscillators. Peripheral integration includes eight-channel PWM timers with quadrature decode, programmable gain amplifiers (x64) paired with ADCs, and a hardware CRC module for data integrity verification.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM Cortex-M4 with DSP extension, no FPU - delivers 1.25 DMIPS/MHz for deterministic real-time control loops.
Max Core Frequency100 MHz - enables sub-microsecond interrupt latency and fast closed-loop response in servo drives.
Flash Memory512 KB program flash - sufficient for complex firmware with bootloader, safety monitoring, and field-upgradable code partitions.
RAM128 KB SRAM - supports large buffers for communication stacks (CAN FD-ready), FFT computation, and real-time data logging.
Operating Voltage1.71–3.6 V - compatible with single Li-ion battery, industrial 3.3 V rails, and wide-input DC-DC converters.
Temperature Range-40 to 105°C - qualified for under-hood automotive, factory automation, and outdoor power equipment environments.
Analog PeripheralsTwo 16-bit SAR ADCs with integrated PGA (x64), two 12-bit DACs, three analog comparators - enables high-resolution current/voltage sensing and feedback generation without external signal conditioning.

Pinout & Package

Package: 121-pin MAPBGA (8 mm × 8 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower and ground domainsSeparate digital/analog supplies reduce noise coupling; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy.
PTA0–PTA31, PTB0–PTB17, etc.Multi-function GPIO portsConfigurable as UART/CAN/SPI/I²C pins or general-purpose I/O with internal pull-ups/pull-downs (20–50 kΩ) and 5 V-tolerant inputs.
EXTAL/XTAL, EXTAL32/XTAL32Clock inputsSupports primary 3–32 MHz crystal for system clock and optional 32.768 kHz crystal for RTC - critical for time-stamped event capture and low-power wake-up.
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RXCAN 2.0B transceiver interfacesDual independent CAN controllers with message buffers and loopback mode - enable redundant bus architecture or gateway functionality.
ADC0_SE0–ADC0_SE15, ADC1_SE0–ADC1_SE15Analog input channels32 total single-ended ADC inputs across two 16-bit converters; each supports PGA gain up to x64 for direct connection to shunt resistors or thermocouples.

Key Features

FeatureDesign Value
Low-power stop modesVLLS1/VLLS2/VLLS3 modes draw as low as 2.1 µA while retaining RAM and wake-up capability - extends battery life in portable HMI and remote sensors.
Hardware CRC modulePerforms IEEE-802.3 CRC-32 in one cycle per 32-bit word - accelerates firmware update validation and secure boot integrity checks.
FlexBus external interface8/16-bit parallel bus supporting SRAM, NOR flash, and FPGA co-processors - enables expansion of memory or offload of compute-intensive tasks.
TSI touch sensing interfaceCapacitive touch controller with 16 channels and automatic calibration - allows integration of robust, low-cost user interfaces without external ICs.
Memory protection unit (MPU)Configurable regions enforce privilege levels and prevent accidental writes to critical flash or peripheral registers - essential for functional safety compliance (IEC 61508 SIL2).

Applications

Industrial Motor ControlAutomotive Body Control Module

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and pump drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using DSP instructions, synchronized PWM generation, and current sensing via integrated ADC+PGA.

Use Value: Eliminates external op-amps and ADC drivers; 100 MHz core ensures <5 µs current loop update time for stable torque delivery.

Use Scenario: Centralized control of door locks, lighting, window lifts, and seat position memory in mid-tier vehicles.

IC Role / Device Role / Timing Role: CAN 2.0B node managing LIN-to-CAN gateway functions, EEPROM emulation for parameter storage, and low-power sleep/wake cycles.

Use Value: Dual CAN interfaces allow simultaneous communication with powertrain and infotainment networks; VLLS3 mode reduces quiescent current to <2.5 µA during vehicle sleep.

Smart Grid Sensor NodeMedical Infusion Pump Controller

Use Scenario: Remote monitoring of transformer temperature, current harmonics, and voltage sag/swell in distribution substations.

IC Role / Device Role / Timing Role: High-accuracy analog acquisition (16-bit ADC + PGA), secure data encryption via CRC-32, and wireless telemetry via UART-to-LoRa bridge.

Use Value: On-chip PGA gain eliminates need for external instrumentation amps; 128 KB RAM buffers 10+ seconds of waveform samples before transmission.

Use Scenario: Precision dosing control with pressure sensing, stepper motor sequencing, and alarm-triggered shutdown in hospital-grade infusion devices.

IC Role / Device Role / Timing Role: Safety-critical real-time scheduler managing motor step timing, analog pressure feedback, and watchdog-checked communication with HMI.

Use Value: MPU-enforced memory isolation prevents firmware corruption; dual 12-bit DACs generate precise reference voltages for analog front-end calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MKE15Z64VLD4ARM Cortex-M0+, 48 MHz, 64 KB flash, 8 KB RAM, no CAN, QFN-48 packageLimited to cost-sensitive, low-complexity nodes without real-time networking or high-resolution analogSelect when CAN, >64 KB flash, or >16-bit ADC resolution are unnecessary and BOM cost is primary constraint.
MIMXRT1021DAG5AARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, 128 LQFP, no integrated ADC/DACRequires external flash and analog signal chain; suited for Linux-capable edge AI inference, not deterministic controlChoose only when application demands >100 MHz performance, external memory expansion, and lacks analog sensing requirements.

Compared with MK10DN512VMC10R, MKE15Z64VLD4 sacrifices CAN, flash size, and analog precision for lower cost and smaller footprint, while MIMXRT1021DAG5A trades integrated peripherals and deterministic latency for raw compute throughput - making MK10DN512VMC10R optimal for balanced mixed-signal real-time control.

Availability

MK10DN512VMC10R is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart grid sensor nodes requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MK10DN512VMC10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The MK10DN512VMC10R belongs to the Kinetis K10 family - engineered for high-integration embedded control where deterministic real-time performance, analog precision, and low-power operation converge in space-constrained designs.

FAQ

What is the maximum operating frequency of the MK10DN512VMC10R?

The MK10DN512VMC10R operates at a maximum core frequency of 100 MHz. This is achieved using the internal multipurpose clock generator with external crystal input (3–32 MHz) and PLL configuration. The 100 MHz specification is guaranteed across the full -40 to 105°C temperature range and 1.71–3.6 V supply voltage, enabling deterministic timing for motor control and communication stacks. MK10DN512VMC10R maintains this frequency without throttling under worst-case thermal and voltage conditions.

Does the MK10DN512VMC10R support CAN FD?

No, the MK10DN512VMC10R supports CAN 2.0B only, not CAN FD. Its two CAN modules comply with ISO 11898-1:2003 and support bit rates up to 1 Mbps, message filtering, and hardware acceptance masking. CAN FD features such as flexible data-rate switching and extended payload length are absent. For CAN FD applications, designers should consider NXP's S32K1xx or newer K32L2B series. MK10DN512VMC10R remains suitable for legacy automotive and industrial CAN networks requiring proven reliability and broad toolchain support.

What package type does the MK10DN512VMC10R use?

The MK10DN512VMC10R uses a 121-pin MAPBGA package (8 mm × 8 mm, 0.5 mm pitch), designated by the 'MC' suffix in its part number. This fine-pitch ball-grid array provides high I/O density and thermal performance for compact industrial PCBs. It is RoHS-compliant and rated MSL3, requiring bake-before-reflow if exposed beyond floor life. The package supports all 121 signals including power, ground, GPIO, analog inputs, and high-speed peripherals - no pin reduction or variant packaging applies to this specific orderable part MK10DN512VMC10R.

How much SRAM and flash memory does the MK10DN512VMC10R include?

The MK10DN512VMC10R integrates 512 KB of on-chip program flash memory and 128 KB of general-purpose SRAM. Flash is organized for EEPROM emulation via FlexMemory partitioning, allowing byte-level writes and wear leveling. SRAM is unified and accessible by CPU and DMA, supporting zero-wait-state operation at 100 MHz. These capacities are fixed for this variant - no configuration or runtime allocation changes the physical memory size. MK10DN512VMC10R's memory map is fully documented in the K10P121M100SF2V2 reference manual.

Is the MK10DN512VMC10R qualified for automotive applications?

The MK10DN512VMC10R is AEC-Q100 Grade 2 qualified (-40 to 105°C), meeting automotive reliability standards for non-safety-critical body electronics and chassis systems. It includes features required for automotive use: dual CAN interfaces, hardware CRC, memory protection unit, and robust ESD ratings (±2 kV HBM). However, it lacks ASIL-B certification and certain safety mechanisms (e.g., lockstep cores, ECC RAM) needed for powertrain or ADAS. MK10DN512VMC10R is appropriate for gateways, lighting controllers, and HVAC modules where functional safety compliance is not mandated.

MK10DN512VMC10R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-LFBGA
Series:
Kinetis K10
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 42x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK10DN512VMC10R FAQ

1.How can I place an order for MK10DN512VMC10R through Aetrix?

Please submit a Request for Quotation (RFQ) for MK10DN512VMC10R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK10DN512VMC10R reliable?

The price and inventory of MK10DN512VMC10R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VMC10R is usually 5 days.

3.What payment methods are accepted for MK10DN512VMC10R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VMC10R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK10DN512VMC10R?

MK10DN512VMC10R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK10DN512VMC10R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK10DN512VMC10R?

For technical support, including MK10DN512VMC10R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VMC10R requirements.

6.How does Aetrix verify that MK10DN512VMC10R is sourced from the original manufacturer or authorized distributors?

All MK10DN512VMC10R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VMC10R meets industry standards.

7.What is the process for return or replacement of MK10DN512VMC10R?

All MK10DN512VMC10R units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VMC10R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK10DN512VMC10R part is unused and in its original packaging.

Return procedure for MK10DN512VMC10R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MK10DN512VMC10R Tags

  • MK10DN512VMC10R
  • MK10DN512VMC10R PDF
  • MK10DN512VMC10R Datasheet
  • MK10DN512VMC10R Specifications
  • MK10DN512VMC10R Images
  • NXP Semiconductors
  • NXP Semiconductors MK10DN512VMC10R
  • Buy MK10DN512VMC10R
  • MK10DN512VMC10R Price
  • MK10DN512VMC10R Distributor
  • MK10DN512VMC10R Supplier
  • MK10DN512VMC10R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER