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NXP Semiconductors MK10DN512VMD10

Part No.:
MK10DN512VMD10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LBGA
Datasheet:
AetrixMK10DN512VMD10.pdf
Description:
IC MCU 32B 512KB FLASH 144MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:562

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Product details

Overview

MK10DN512VMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 512 KB on-chip program flash memory, 128 KB RAM, and integrated analog peripherals including dual 16-bit SAR ADCs and two 12-bit DACs. It targets industrial control, motor drive, and sensor fusion applications requiring deterministic real-time performance and low-power operation across –40°C to 105°C.

For engineers reviewing the MK10DN512VMD10 datasheet, MK10DN512VMD10 pinout, MK10DN512VMD10 application, or MK10DN512VMD10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with DSP, dual CAN interfaces, FlexBus external memory interface, 144-pin LQFP package, and support for multiple low-power modes including VLLS1/VLLS3 sub-10 µA stop modes.

Technical Context

The MK10DN512VMD10 implements an ARM Cortex-M4 core with hardware floating-point unit disabled (D-series), delivering 1.25 DMIPS/MHz. Its clock system integrates a multi-purpose clock generator (MCG) supporting crystal oscillators at 3–32 MHz and 32 kHz, enabling precise timing for RTC and low-power wake-up.

System-level integration includes a 16-channel DMA controller supporting 63 request sources, memory protection unit (MPU) with multi-master protection, and security modules such as hardware CRC and 128-bit unique chip ID. Analog subsystems feature programmable gain amplifiers (up to ×64) embedded in each ADC, transimpedance amplifiers, and three analog comparators with integrated 6-bit DACs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M4 with DSP instructions, no FPU - enables efficient signal processing without floating-point overhead
Max Clock Frequency100 MHz - supports real-time control loops with ≤10 ns instruction cycle time
Flash Memory512 KB program flash only (N-suffix) - sufficient for complex firmware with bootloader and OTA update space
RAM128 KB SRAM - accommodates large buffers for communication stacks and sensor data aggregation
Operating Voltage1.71–3.6 V - compatible with single Li-ion, 3.3 V, or regulated 1.8 V supply rails
Temperature Range–40°C to +105°C - qualified for under-hood automotive and industrial ambient environments
Analog PeripheralsDual 16-bit SAR ADCs with PGA (×64), two 12-bit DACs, three CMPs with 6-bit DACs - enables high-resolution closed-loop analog control without external signal conditioning
Communication InterfacesTwo CAN 2.0B controllers, six UARTs, three SPIs, two I²Cs, SDHC, I²S - supports multi-bus industrial networking and multimedia peripheral interfacing

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSDigital power supply and groundMultiple dedicated pairs ensure stable core voltage delivery and low-noise reference for digital logic
VDDA, VSSAAnalog power supply and groundIsolated analog domain with ≤0.1 V differential tolerance - critical for ADC/DAC accuracy and noise immunity
EXTAL/XTALMain crystal oscillator input/outputSupports 3–32 MHz crystals - enables precise system clock generation and USB timing compliance
EXTAL32/XTAL3232 kHz RTC crystal terminalsEnables autonomous real-time clock operation during VLLS stop modes with battery backup
PTA0–PTA31, PTB0–PTB17, etc.GPIO with multiplexed peripheral functionsOver 100 configurable pins with 5 V-tolerant inputs, internal pull-up/pull-down (20–50 kΩ), and slew rate control
CAN0_TX/CAN0_RXController Area Network channel 0 differential pairDirect connection to ISO 11898-compliant transceiver - supports automotive and industrial fieldbus communication
ADC0_SE0–ADC0_SE15Analog input channels for ADC016 single-ended or 8 differential inputs with programmable gain - simplifies sensor front-end design

Key Features

FeatureDesign Value
FlexBus external bus interfaceEnables direct connection to NOR/NAND flash, SRAM, or FPGA peripherals with configurable wait states and burst support
Low-leakage wakeup unitAllows selective peripheral wake-up from VLLS1/VLLS3 modes using GPIO, RTC, or comparator events - reduces system standby current to <10 µA
Hardware CRC moduleAccelerates checksum computation for firmware integrity verification and communication frame validation - offloads CPU and ensures deterministic latency
TSI (Touch Sensing Interface)Capacitive touch sensing on up to 16 channels with built-in noise rejection - eliminates need for external touch controller in HMI designs
Memory Protection Unit (MPU)Configurable region-based access control for flash, RAM, and peripherals - enforces software partitioning for functional safety and secure boot

Applications

Industrial Motor ControlAutomotive Body Electronics

Use Scenario: Closed-loop control of BLDC/PMSM motors in HVAC blowers, pumps, and power tools using field-oriented control (FOC).

IC Role / Device Role / Timing Role: Primary real-time controller executing FOC algorithm, PWM generation via TPM modules, and analog current/voltage sensing via dual ADCs with PGA.

Use Value: 100 MHz deterministic execution and hardware-accelerated math enable sub-10 µs current loop updates; dual CAN interfaces support diagnostic and actuator command buses.

Use Scenario: Central body controller managing door locks, window lifts, lighting, and mirror positioning in passenger vehicles.

IC Role / Device Role / Timing Role: System-on-chip host managing LIN/CAN gateway functions, EEPROM emulation in flash, and capacitive touch buttons via TSI.

Use Value: –40°C to 105°C rating and VLLS3 stop mode (<10 µA) ensure reliable operation in cabin and under-hood locations; 128 KB RAM supports multi-threaded AUTOSAR OS tasks.

Smart Energy MeteringMedical Sensor Hub

Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure communication via HPLC or RF modules.

IC Role / Device Role / Timing Role: High-precision metrology engine performing RMS, THD, and power factor calculations using DSP instructions on ADC samples.

Use Value: Dual 16-bit ADCs with PGA provide >90 dB SNR for Class 0.2 accuracy; hardware CRC ensures firmware and metering data integrity against corruption.

Use Scenario: Portable patient monitor aggregating ECG, SpO₂, temperature, and motion data for wireless transmission to cloud platform.

IC Role / Device Role / Timing Role: Low-power sensor fusion hub with simultaneous analog acquisition (ECG via PGA, SpO₂ via transimpedance amps), real-time filtering, and Bluetooth LE interface.

Use Value: VLPR mode (1.12 mA @ 3.0 V) extends battery life; integrated comparators with 6-bit DACs enable adaptive thresholding for arrhythmia detection without external components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MKE15Z256VLH7ARM Cortex-M0+, 72 MHz, 256 KB flash, 48 KB RAM, no FlexBus, single CANLimited peripheral count and lower compute throughput - suitable for cost-sensitive, non-motor-control applicationsSelect when BOM cost reduction outweighs need for dual CAN, FlexBus, or 100 MHz performance
MIMXRT1021DAG5AARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, external QSPI requiredHigher performance but requires external memory and lacks integrated analog - better for Linux-capable edge nodes than embedded controlChoose for AI inference or GUI rendering where raw speed matters more than analog integration or code footprint

Compared with MK10DN512VMD10, MKE15Z256VLH7 trades performance and interface richness for lower cost and power, while MIMXRT1021DAG5A delivers higher compute density at the expense of analog integration and self-contained flash execution - making MK10DN512VMD10 optimal for integrated real-time control with mixed-signal requirements.

Availability

MK10DN512VMD10 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, and smart energy metering systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MK10DN512VMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based microcontrollers and radar technology.

The Kinetis K10 family, including MK10DN512VMD10, was designed for cost-sensitive, high-integration embedded control applications demanding robust analog capability, real-time responsiveness, and extended temperature reliability - particularly in motor control, building automation, and portable medical devices.

FAQ

What is the maximum operating frequency of the MK10DN512VMD10?

The MK10DN512VMD10 operates at a maximum CPU frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This frequency is supported across the full –40°C to +105°C ambient temperature range when supplied within the 1.71–3.6 V voltage window. The device achieves 1.25 Dhrystone MIPS per MHz, delivering deterministic real-time performance for control-critical applications without requiring external clock multiplication.

Does the MK10DN512VMD10 include on-chip flash memory, and what is its size?

Yes, the MK10DN512VMD10 includes 512 KB of on-chip program flash memory. The "N" in the part number denotes "program flash only" (non-FlexMemory configuration), meaning this flash is dedicated to code and constant storage - not reconfigurable as EEPROM or NVM. It supports read-while-write operation and has error correction circuitry for enhanced reliability in industrial deployments.

What analog peripherals are integrated into the MK10DN512VMD10?

The MK10DN512VMD10 integrates dual 16-bit SAR ADCs with programmable gain amplifiers (up to ×64), two 12-bit DACs, three analog comparators each with an integrated 6-bit DAC and programmable reference, two transimpedance amplifiers, and a precision voltage reference. These peripherals enable high-fidelity sensor signal conditioning, closed-loop analog control, and battery monitoring without external op-amps or DACs - reducing BOM count and PCB area.

Which communication interfaces does the MK10DN512VMD10 support?

The MK10DN512VMD10 supports two Controller Area Network (CAN) 2.0B modules, six UARTs, three SPI modules, two I²C modules, a Secure Digital Host Controller (SDHC), and an I²S audio interface. It also includes a FlexBus external bus interface for connecting parallel memories or FPGAs. This breadth supports multi-protocol industrial gateways, automotive diagnostics, and audio-enabled HMI systems - all from a single chip.

What package type and pin count does the MK10DN512VMD10 use?

The MK10DN512VMD10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), identified by the "LQ" suffix in the part numbering scheme. This package provides full signal accessibility for all integrated peripherals, including dedicated CAN, USB (via external PHY), and FlexBus signals, while maintaining compatibility with standard surface-mount assembly processes and thermal management in industrial enclosures.

MK10DN512VMD10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LBGA
Series:
Kinetis K10
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 46x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK10DN512VMD10 FAQ

1.How can I place an order for MK10DN512VMD10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK10DN512VMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK10DN512VMD10 reliable?

The price and inventory of MK10DN512VMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512VMD10 is usually 5 days.

3.What payment methods are accepted for MK10DN512VMD10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512VMD10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK10DN512VMD10?

MK10DN512VMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK10DN512VMD10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK10DN512VMD10?

For technical support, including MK10DN512VMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512VMD10 requirements.

6.How does Aetrix verify that MK10DN512VMD10 is sourced from the original manufacturer or authorized distributors?

All MK10DN512VMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512VMD10 meets industry standards.

7.What is the process for return or replacement of MK10DN512VMD10?

All MK10DN512VMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512VMD10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK10DN512VMD10 part is unused and in its original packaging.

Return procedure for MK10DN512VMD10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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