NXP Semiconductors MK10DN512ZVLK10R
- Part No.:
- MK10DN512ZVLK10R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MK10DN512ZVLK10R.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 80FQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK10DN512ZVLK10R from NXP (formerly Freescale) is a 32-bit ARM® Cortex®-M4 microcontroller with DSP extension and single-precision FPU, operating at 100 MHz. It integrates 512 KB flash, 128 KB FlexNVM (emulating EEPROM), 128 KB SRAM, 16-bit ADC, 12-bit DAC, and dual CAN interfaces. It targets low-power industrial sensing and control applications such as flow meters and remote sensors.
For engineers reviewing the MK10DN512ZVLK10R datasheet, MK10DN512ZVLK10R pinout, MK10DN512ZVLK10R application, or MK10DN512ZVLK10R equivalent, key selection criteria include its 100 MHz Cortex-M4 core with FPU, 128 KB FlexNVM for field-upgradable data storage, dual CAN 2.0B support, ultra-low-power stop mode (<500 nA), and 100-pin LQFP package with 5 V-tolerant I/O.
Technical Context
This MCU implements an ARM Cortex-M4 core with hardware floating-point unit and DSP instruction set, enabling real-time signal processing in resource-constrained environments. It features a crossbar switch architecture supporting concurrent multi-master bus accesses, 32-channel DMA, and 16 KB cache to reduce CPU loading during peripheral servicing.
The device includes two independent CAN 2.0B controllers with flexible message buffers and FIFOs, a 16-bit ADC with programmable gain amplifier (PGA), and a low-leakage wake-up unit supporting 10 ultra-low-power modes - including Stop mode with RTC and CAN activity retention at 1.71 V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP extension and single-precision FPU |
| Max Clock Frequency | 100 MHz - enables deterministic real-time control with <4 µs wake-up from Stop mode |
| Flash Memory | 512 KB - supports dual-bank operation for concurrent execution and firmware updates |
| FlexNVM | 128 KB - configurable as EEPROM (up to 16 KB byte-erasable) or extra program/data space |
| SRAM | 128 KB - includes parity protection for safety-critical data buffers |
| Analog Peripherals | 16-bit ADC (up to 2x), 12-bit DAC, PGA, voltage reference - supports high-accuracy sensor signal conditioning |
| Communication | Dual CAN 2.0B, up to 6 UARTs (1 with ISO 7816), 3 SPI, 2 I2C, I2S - suitable for industrial fieldbus bridging |
| Low-Power Modes | 10 modes including Stop with <500 nA current - enables battery-powered operation for years |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, with 5 V-tolerant digital I/O pins and dedicated analog supply domains (VDDA/VSSA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog Power / Ground | Isolated analog domain for ADC/DAC reference stability; requires separate filtering from digital supply |
| PTA0–PTA31 | GPIO / Peripheral Multiplexed | Configurable as GPIO or function-specific signals (e.g., CAN0_TX/RX, UART0_RX/TX, ADC0_SE0–SE15) |
| CAN0_TX / CAN0_RX | CAN Controller Interface | Differential transceiver interface compliant with ISO 11898-1; supports bit rates up to 1 Mbps |
| CAN1_TX / CAN1_RX | Second CAN Controller Interface | Independent CAN node for redundant communication or multi-bus topology without software arbitration |
| RTC_CLKIN | Real-Time Clock Input | Accepts external 32.768 kHz crystal for autonomous timekeeping during Stop mode |
| RESET_b | Active-Low Reset Input | Asynchronous reset with internal pull-up; compatible with external reset supervisors and power-on reset circuits |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory Architecture | 128 KB FlexNVM enables field-upgradable EEPROM emulation with byte-level write/erase - eliminates need for external serial EEPROM |
| Dual CAN 2.0B Controllers | Two independent CAN modules with message RAM, FIFOs, and loopback self-test - supports fail-safe diagnostics and gateway routing |
| Ultra-Low-Power Stop Mode | <500 nA current draw with RTC running and CAN wake-up enabled - extends battery life in remote sensor nodes |
| 16-bit ADC with PGA | Programmable gain (1×–64×) and differential input support - achieves >12-bit ENOB for low-amplitude sensor signals |
| Cryptographic Acceleration Unit (CAU) | Hardware AES-128/256, SHA-1/256, MD5 - reduces encryption latency by >10× vs. software-only implementation |
| Memory Protection Unit (MPU) | Configurable regions with privilege/access control - enforces separation between RTOS kernel, application tasks, and bootloader |
Applications
| Flow Metering | Remote Industrial Sensor Node |
|---|---|
Use Scenario: High-accuracy liquid/gas flow measurement using ultrasonic time-of-flight or magnetic induction principles. IC Role / Device Role / Timing Role: Primary controller executing sensor excitation, ADC sampling, digital filtering, and CAN-based telemetry transmission. Use Value: 16-bit ADC with PGA captures microvolt-level transducer signals; dual CAN enables primary data channel + diagnostic bus; FlexNVM stores calibration coefficients across power cycles. | Use Scenario: Battery-powered environmental monitoring (temperature, humidity, pressure) deployed in inaccessible locations for >5 years. IC Role / Device Role / Timing Role: Low-power system manager handling sensor polling, data aggregation, and scheduled CAN/UART uploads. Use Value: Stop mode current <500 nA extends battery life; RTC maintains precise wake intervals; 128 KB SRAM buffers burst measurements before transmission. |
| HVAC Zone Controller | Gaming Peripheral Interface |
Use Scenario: Distributed HVAC control unit regulating damper position, fan speed, and temperature feedback via local sensors and BMS network. IC Role / Device Role / Timing Role: Real-time actuator coordinator with PID loop execution, CAN bus communication to central BMS, and touch-sensing HMI interface. Use Value: Cortex-M4 FPU accelerates floating-point PID calculations; Xtrinsic touch interface supports capacitive buttons/sliders in all low-power states; dual CAN links to zone actuators and upstream controller. | Use Scenario: High-speed USB-to-CAN/I2C bridge in gaming controllers requiring sub-millisecond latency for motion sensor fusion and haptic feedback. IC Role / Device Role / Timing Role: Deterministic peripheral aggregator translating HID reports into CAN messages for motorized feedback units. Use Value: 100 MHz core ensures <100 µs interrupt latency; 32-channel DMA offloads sensor data movement; 12-bit DAC generates precise analog haptic waveforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKE15Z64VLD4 | ARM Cortex-M0+, 48 MHz, 64 KB flash, no CAN, 32 KB SRAM, no FlexNVM | Lacks CAN and FlexNVM; suited for cost-sensitive, non-networked control only | Select when CAN and field-upgradable EEPROM are unnecessary and BOM cost is critical |
| MIMXRT1021DAG4A | ARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, external QSPI required, no FlexNVM | Higher performance but requires external memory; lacks integrated EEPROM emulation and CAN redundancy | Select for high-throughput edge AI inference where external flash and Ethernet are preferred over CAN and embedded NVM |
Compared with MKE15Z64VLD4 and MIMXRT1021DAG4A, the MK10DN512ZVLK10R uniquely balances 100 MHz real-time control, dual CAN, and 128 KB FlexNVM in a single-chip solution - making it optimal for battery-operated industrial gateways requiring firmware resilience and field diagnostics without external memory or transceivers.
Availability
MK10DN512ZVLK10R is available at Aetrix Electronics and suitable for flow metering, remote sensor networks, and HVAC zone controllers requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for MK10DN512ZVLK10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based microcontrollers and edge processing.
The MK10DN512ZVLK10R belongs to the Kinetis K1x family - designed specifically for cost-sensitive, low-power industrial control systems requiring robust analog integration, CAN networking, and field-upgradable nonvolatile storage without external components.
FAQ
What is the maximum operating frequency of the MK10DN512ZVLK10R?
The MK10DN512ZVLK10R operates at a maximum core frequency of 100 MHz using its ARM Cortex-M4 processor. This frequency is achievable with the internal PLL locked to an external crystal or internal reference clock. The device maintains full peripheral functionality-including ADC sampling, CAN message transmission, and DMA transfers-at this speed, and supports dynamic clock gating to reduce power during idle periods. MK10DN512ZVLK10R's timing specifications are validated across industrial temperature ranges (–40°C to +105°C) and supply voltages (1.71 V to 3.6 V).
Does the MK10DN512ZVLK10R support CAN FD or only classical CAN 2.0B?
The MK10DN512ZVLK10R supports only classical CAN 2.0B protocol - not CAN FD. It includes two independent CAN controllers compliant with ISO 11898-1, each supporting bit rates up to 1 Mbps and message objects with maskable identifiers. CAN FD features such as variable data length (up to 64 bytes) and higher bit rates are absent. For CAN FD capability, designers should consider later-generation NXP S32K or i.MX RT series devices. MK10DN512ZVLK10R remains fully interoperable with legacy CAN networks in industrial automation and vehicle subsystems.
How is FlexMemory configured on the MK10DN512ZVLK10R?
On the MK10DN512ZVLK10R, FlexMemory consists of 128 KB of FlexNVM that can be partitioned at runtime into program flash and EEPROM-emulated space. Up to 16 KB may be allocated as byte-erasable EEPROM with 100,000 write/erase cycles, while the remainder serves as additional code or data storage. Configuration is performed via the Flash Configuration Field (FCFG) and Flash Security Register (FSEC), and requires unlocking the flash module before reprogramming. MK10DN512ZVLK10R supports atomic EEPROM writes and wear leveling via software libraries provided in the MCUXpresso SDK.
What debug interfaces does the MK10DN512ZVLK10R support?
The MK10DN512ZVLK10R supports SWD (Serial Wire Debug) as its primary debug interface, compatible with standard ARM Cortex-M debug probes (e.g., J-Link, LPC-Link2, CMSIS-DAP). It does not support JTAG. SWD provides full run-control, memory access, and real-time trace via the SWO pin when used with compatible debuggers. The device also includes an EZPort serial programming interface for factory or field firmware updates via SPI. MK10DN512ZVLK10R's debug features are accessible through MCUXpresso IDE, IAR Embedded Workbench, and Keil MDK toolchains.
Is the MK10DN512ZVLK10R qualified for automotive applications?
No, the MK10DN512ZVLK10R is not AEC-Q100 qualified and is intended for industrial and commercial applications only. Its qualification covers industrial temperature range (–40°C to +105°C) and meets IEC 61000-4-2 ESD immunity (±8 kV contact, ±15 kV air), but it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and extended temperature validation. For automotive use cases, NXP recommends the S32K1xx family. MK10DN512ZVLK10R remains appropriate for industrial equipment, building automation, and consumer-grade instrumentation where AEC-Q100 is not mandated.
MK10DN512ZVLK10R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- Kinetis K10
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 31x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512ZVLK10R FAQ
1.How can I place an order for MK10DN512ZVLK10R through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512ZVLK10R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512ZVLK10R reliable?
The price and inventory of MK10DN512ZVLK10R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512ZVLK10R is usually 5 days.
3.What payment methods are accepted for MK10DN512ZVLK10R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512ZVLK10R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512ZVLK10R?
MK10DN512ZVLK10R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512ZVLK10R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512ZVLK10R?
For technical support, including MK10DN512ZVLK10R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512ZVLK10R requirements.
6.How does Aetrix verify that MK10DN512ZVLK10R is sourced from the original manufacturer or authorized distributors?
All MK10DN512ZVLK10R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512ZVLK10R meets industry standards.
7.What is the process for return or replacement of MK10DN512ZVLK10R?
All MK10DN512ZVLK10R units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512ZVLK10R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512ZVLK10R part is unused and in its original packaging.
Return procedure for MK10DN512ZVLK10R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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