NXP Semiconductors MK10DN512ZVLQ10
- Part No.:
- MK10DN512ZVLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK10DN512ZVLQ10.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:600
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Product details
Overview
MK10DN512ZVLQ10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 512 KB on-chip flash memory and 128 KB RAM. It integrates dual 16-bit SAR ADCs with programmable gain amplifiers, two 12-bit DACs, three analog comparators, dual CAN interfaces, six UARTs, and supports industrial temperature range (–40°C to +105°C). It is used in motor control systems requiring real-time signal processing and mixed-signal I/O.
For engineers reviewing the MK10DN512ZVLQ10 datasheet, MK10DN512ZVLQ10 pinout, MK10DN512ZVLQ10 application, or MK10DN512ZVLQ10 equivalent, key selection considerations include its 144-pin LQFP package, 100 MHz core frequency, dual CAN capability, low-power stop modes down to 2.1 µA, and integrated TSI for touch sensing - all critical for embedded industrial and automotive subsystem design.
Technical Context
The MK10DN512ZVLQ10 implements an ARM Cortex-M4 core with hardware DSP instructions and a Memory Protection Unit (MPU), supporting deterministic real-time execution. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and a multi-purpose clock generator enabling flexible PLL-based frequency synthesis.
Peripheral integration centers on mixed-signal precision and communication robustness: two independent 16-bit ADCs each with PGA (up to ×64 gain), dual 12-bit DACs, three comparators with internal 6-bit DAC references, and dual CAN 2.0B controllers with message buffers and FIFO support - all operating across the full –40°C to +105°C ambient range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-M4 with DSP instruction set, enabling efficient filtering, FFT, and motor control algorithms |
| Max Core Frequency | 100 MHz - delivers 125 DMIPS, sufficient for real-time closed-loop control with <1 µs interrupt latency |
| Flash Memory | 512 KB program flash - supports in-application programming (IAP) and secure boot via flash protection |
| RAM | 128 KB SRAM - split into multiple blocks with configurable MPU regions for task isolation |
| ADC Resolution & Count | Dual 16-bit SAR ADCs - each with dedicated PGA (×1 to ×64), enabling high-precision current/voltage sensing without external op-amps |
| CAN Interfaces | Two independent CAN 2.0B modules - each with 16 message buffers and hardware ID filtering, suitable for distributed vehicle networks |
| Operating Temperature | –40°C to +105°C - qualified for under-hood automotive and industrial drive environments |
| Supply Voltage Range | 1.71 V to 3.6 V - enables direct interface with Li-ion battery stacks and wide-input DC-DC regulators |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pairs reduce IR drop and noise coupling in high-speed operation |
| VDDA, VSSA | Analog power supply and ground | Isolated analog domain with ≤0.1 V differential tolerance vs. digital rail - critical for ADC/DAC accuracy |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals; internal load caps eliminate need for external capacitors in most designs |
| EXTAL32/XTAL32 | 32 kHz RTC crystal terminals | Enables autonomous real-time clock operation during VLPS/VLLS modes with <1 µA typical current draw |
| CAN0_TX / CAN0_RX | Channel 0 CAN transceiver interface | 5 V tolerant inputs with internal termination resistors - simplifies connection to standard CAN bus transceivers |
| CAN1_TX / CAN1_RX | Channel 1 CAN transceiver interface | Independent timing and filtering logic allows concurrent dual-network operation (e.g., powertrain + body) |
| TSI_CH0–TSI_CH15 | Touch sensing input channels | Hardware-accelerated charge-transfer measurement - supports up to 16 self-capacitive electrodes with <5 µA active current |
| ADC0_SE0–ADC0_SE15 | ADC0 single-ended input channels | Configurable as differential pairs or single-ended; PGA gain selectable per channel in software |
Key Features
| Feature | Design Value |
|---|---|
| Low-leakage wakeup unit | Enables sub-µA wake-from-VLLS3 response to GPIO, RTC, or comparator events - essential for battery-powered remote sensors |
| FlexBus external bus interface | 8/16-bit parallel interface supporting NOR flash, SRAM, and peripherals with programmable timing - extends memory and peripheral reach beyond on-chip limits |
| Hardware CRC module | Accelerates checksum calculation over memory blocks or communication payloads in one CPU cycle - improves firmware update integrity verification speed by >20× vs. software CRC |
| Programmable delay block (PDB) | High-resolution (≤10 ns) timing engine synchronized to ADC conversions - enables precise trigger alignment for motor phase current sampling |
| Memory protection unit (MPU) | Configurable region-based access control across flash, RAM, and peripherals - enforces separation between safety-critical and non-critical tasks in ASIL-B designs |
| 128-bit unique chip ID | Factory-programmed immutable identifier - used for secure device authentication, license binding, and anti-cloning in connected industrial equipment |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm, sampling phase currents via dual ADCs with PDB-triggered synchronization, and generating PWM via TPM modules. Use Value: Integrated PGA eliminates external signal conditioning; dual CAN enables coordination with master ECU and diagnostics via UDS protocol. | Use Scenario: Central body controller managing door locks, lighting, window lifts, and mirror adjustment. IC Role / Device Role / Timing Role: System-on-chip host managing LIN/CAN gateway functions, touch-sensitive HMI via TSI, and power sequencing for local actuators. Use Value: 128 KB RAM supports AUTOSAR OS partitioning; –40°C to +105°C rating ensures reliability in trunk-mounted modules. |
| Smart Energy Metering | Medical Infusion Pump |
Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure data logging. IC Role / Device Role / Timing Role: High-accuracy metrology processor interfacing isolated ADCs, performing IEEE 1459 calculations, and storing encrypted logs in flash. Use Value: Dual 16-bit ADCs with PGA support simultaneous voltage/current sampling at 10 kSPS; hardware CRC ensures log integrity. | Use Scenario: Precision drug delivery system requiring flow rate control, occlusion detection, and battery-backed runtime logging. IC Role / Device Role / Timing Role: Safety-monitored controller running IEC 62304-compliant firmware, using DACs for pressure reference generation and comparators for fault detection. Use Value: VLLS3 mode draws only 3.1 µA at 25°C - extends battery life during standby; unique ID enables traceability per device serial number. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKE15Z64VLD4 | ARM Cortex-M0+, 48 MHz, 64 KB flash, no CAN, 12-bit ADC only | Limited to cost-sensitive, low-complexity control without networking or high-precision analog | Select when CAN, DSP, or >12-bit ADC resolution is unnecessary and BOM cost is primary constraint |
| MIMXRT1021DAG5A | ARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, requires external QSPI | Targeted at UI-rich, Linux-capable edge devices - not pin-compatible or software-compatible | Choose for high-throughput applications needing GUI, audio, or Ethernet where external memory is acceptable |
Compared with MK10DN512ZVLQ10, MKE15Z64VLD4 lacks CAN and DSP capability but reduces cost and power; MIMXRT1021DAG5A offers higher performance but demands external memory and lacks integrated flash - making MK10DN512ZVLQ10 optimal for self-contained, real-time industrial control with mixed-signal and networking requirements.
Availability
MK10DN512ZVLQ10 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, smart energy meters, and medical infusion pumps requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MK10DN512ZVLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K10 family, including MK10DN512ZVLQ10, was designed for cost-sensitive, high-integration embedded control applications demanding real-time performance, analog precision, and functional safety readiness in harsh environments.
FAQ
What is the maximum operating frequency of the MK10DN512ZVLQ10?
The MK10DN512ZVLQ10 operates at a maximum core frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This frequency is achievable across the full industrial temperature range (–40°C to +105°C) when supplied within the 1.71 V to 3.6 V voltage range and using the internal PLL with a supported crystal source. The MK10DN512ZVLQ10 achieves 125 DMIPS at this speed, validated per ARM's Dhrystone benchmark.
Does the MK10DN512ZVLQ10 support CAN FD or only classical CAN?
The MK10DN512ZVLQ10 supports only Classical CAN (CAN 2.0B), not CAN FD. Its two CAN modules implement full CAN 2.0B compliance with 29-bit identifiers, message buffering, and hardware acceptance filtering. CAN FD features such as variable bit rates and extended data length are absent in the MK10DN512ZVLQ10's controller IP - confirmed by the K10 Sub-Family Data Sheet Rev. 7 and register-level documentation for the FlexCAN module.
What analog peripherals are integrated into the MK10DN512ZVLQ10?
The MK10DN512ZVLQ10 integrates two 16-bit SAR ADCs (each with programmable gain amplifier up to ×64), two 12-bit DACs, three analog comparators (each with integrated 6-bit DAC and programmable reference), and a precision voltage reference module. These are fully operational across the –40°C to +105°C range and share dedicated VDDA/VSSA rails to ensure noise immunity - all documented in Sections 6.6.1–6.6.4 of the K10P144M100SF2 datasheet.
Is the MK10DN512ZVLQ10 pin-compatible with other K10 family members?
No, the MK10DN512ZVLQ10 is not universally pin-compatible across the K10 family. While it shares the 144-pin LQFP (LQ) package variant with MK10DX256ZVLQ10 and MK10DX128ZVLQ10, pin assignments differ due to varying peripheral sets - e.g., FlexBus signals present on MK10DN512ZVLQ10 may map to GPIO on smaller-flash variants. Pin compatibility must be verified per device using the "K10 Signal Multiplexing and Pin Assignments" table in Section 8.1 of the datasheet.
What low-power modes does the MK10DN512ZVLQ10 support, and what is the lowest current draw?
The MK10DN512ZVLQ10 supports seven low-power modes, including VLLS1, VLLS2, and VLLS3. In VLLS3 mode with RTC and 32 kHz oscillator disabled, it draws as little as 3.1 µA at –40°C to +25°C (typical 8.9 µA max), retaining RAM and selected registers. This value is measured at 3.0 V supply and is specified in Table 6 of the K10P144M100SF2 datasheet - making MK10DN512ZVLQ10 suitable for battery-backed applications requiring months of standby operation.
MK10DN512ZVLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K10
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 46x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512ZVLQ10 FAQ
1.How can I place an order for MK10DN512ZVLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512ZVLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512ZVLQ10 reliable?
The price and inventory of MK10DN512ZVLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512ZVLQ10 is usually 5 days.
3.What payment methods are accepted for MK10DN512ZVLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512ZVLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512ZVLQ10?
MK10DN512ZVLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512ZVLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512ZVLQ10?
For technical support, including MK10DN512ZVLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512ZVLQ10 requirements.
6.How does Aetrix verify that MK10DN512ZVLQ10 is sourced from the original manufacturer or authorized distributors?
All MK10DN512ZVLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512ZVLQ10 meets industry standards.
7.What is the process for return or replacement of MK10DN512ZVLQ10?
All MK10DN512ZVLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512ZVLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512ZVLQ10 part is unused and in its original packaging.
Return procedure for MK10DN512ZVLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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