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NXP Semiconductors MK10DN512ZVMD10
- Part No.:
- MK10DN512ZVMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK10DN512ZVMD10.pdf
- Description:
- IC MCU 32B 512KB FLASH 144MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,348
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Product details
Overview
MK10DN512ZVMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 512 KB on-chip flash memory and 128 KB RAM. It integrates dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, three analog comparators, dual CAN interfaces, six UARTs, and supports industrial temperature range (–40 to 105°C) for use in motor control and industrial automation systems.
For engineers reviewing the MK10DN512ZVMD10 datasheet, MK10DN512ZVMD10 pinout, MK10DN512ZVMD10 application, or MK10DN512ZVMD10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with DSP, dual CAN support, low-power stop modes down to 2.1 µA, FlexBus external interface, and 144-pin LQFP package with 5 V-tolerant digital I/O.
Technical Context
The MK10DN512ZVMD10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, delivering 1.25 Dhrystone MIPS per MHz. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and multi-purpose clock generator supporting dynamic frequency scaling across multiple power modes.
It features a memory protection unit (MPU) with multi-master protection, a 16-channel DMA controller servicing up to 63 request sources, and a low-leakage wakeup unit enabling ultra-low-power operation. Analog subsystems include programmable gain amplifiers (up to ×64) embedded within each 16-bit ADC, and 6-bit DACs integrated into each analog comparator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP, 100 MHz max - enables real-time signal processing in motor control and sensor fusion applications. |
| Flash Memory | 512 KB program flash - sufficient for complex firmware with bootloader, safety monitoring, and field-upgradeable code. |
| RAM | 128 KB SRAM - supports large buffers for communication stacks (CAN FD, SDHC), FFT computation, or real-time OS tasks. |
| ADC | Dual 16-bit SAR ADCs with integrated PGA (×1–×64) - allows direct high-resolution sensing of low-amplitude signals without external amplification. |
| CAN Interfaces | Two independent CAN 2.0B modules - supports redundant bus architecture or separate control/monitoring networks in industrial PLCs. |
| Operating Voltage | 1.71–3.6 V supply - compatible with single Li-ion, 3.3 V rail, or wide-input DC-DC converters in battery-powered and industrial equipment. |
| Temperature Range | –40 to 105°C ambient - qualified for under-hood automotive subsystems and factory-floor motor drives. |
| Low-Power Stop Mode | VLLS1 current: 2.1–7.6 µA @ –40 to 105°C - enables years-long operation on coin-cell backup for RTC + wakeup event logging. |
Pinout & Package
The MK10DN512ZVMD10 is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, with exposed thermal pad. Pin assignments follow K10 signal multiplexing defined in Rev. 7 of the K10 Sub-Family Data Sheet (Document Number: K10P144M100SF2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power and ground | 12 pairs distributed across package - ensures stable core voltage delivery and low-noise reference for mixed-signal operation. |
| VDDA, VSSA | Analog power and ground | Separate analog domain pins - critical for achieving 16-bit ADC accuracy by isolating noise from digital switching. |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals - enables precise timing for CAN bit rate accuracy and deterministic real-time task scheduling. |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO with configurable peripherals | Multi-function pins mapped to UART, SPI, I2C, PWM, TSI - allows flexible board layout and reuse across product variants. |
| CAN0_TX / CAN0_RX | First CAN transceiver interface | 5 V-tolerant differential pair - connects directly to ISO 11898-2 compliant transceivers without level-shifting. |
| CAN1_TX / CAN1_RX | Second CAN transceiver interface | Independent from CAN0 - supports dual-bus architectures such as safety-critical master/slave or diagnostics/data logging separation. |
Key Features
| Feature | Design Value |
|---|---|
| FlexBus external bus interface | Enables connection to external SDRAM, NOR flash, or FPGA co-processors - extends memory and compute capability beyond on-chip limits. |
| Hardware CRC module | Accelerates checksum calculation for firmware updates and communication frame validation - reduces CPU load and improves data integrity assurance. |
| Low-power hardware touch sensor interface (TSI) | Supports up to 16 self-capacitive or mutual-capacitive touch channels - enables robust, low-current HMI implementation without dedicated touch controller IC. |
| Memory Protection Unit (MPU) | Prevents unauthorized access between RTOS tasks or firmware partitions - essential for functional safety compliance (IEC 61508 SIL2/3) in industrial controllers. |
| Programmable delay block (PDB) | Provides precise, jitter-free triggering of ADC conversions and PWM outputs - critical for synchronized sampling in motor phase current measurement. |
Applications
| Industrial Motor Control | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors or factory conveyors using field-oriented control (FOC). IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, managing gate driver PWM timing, sampling current/voltage sensors via dual ADCs, and communicating status over CAN. Use Value: Integrated PDB and quadrature decoder timers enable sub-microsecond synchronization between PWM generation and ADC sampling - minimizing torque ripple and improving efficiency. | Use Scenario: Centralized control of lighting, window lifts, door locks, and climate actuators in passenger vehicles. IC Role / Device Role / Timing Role: Main body controller interfacing with LIN slaves and communicating diagnostic data via dual CAN buses (powertrain + body networks). Use Value: Dual CAN controllers with independent message RAM and filtering reduce software overhead and ensure deterministic response to priority messages like brake light activation or intrusion alerts. |
| Programmable Logic Controller (PLC) I/O Module | Smart Energy Metering Gateway |
Use Scenario: Modular I/O expansion unit with analog inputs (4–20 mA), digital I/O, and isolated CAN backbone in industrial automation cabinets. IC Role / Device Role / Timing Role: Real-time I/O processor handling sensor conditioning, isolation interface management, and protocol translation (Modbus RTU over CAN). Use Value: 16-bit ADCs with integrated PGA eliminate need for external instrumentation amplifiers - reducing BOM cost and PCB area while maintaining ±0.1% measurement accuracy. | Use Scenario: Two-way communication hub aggregating data from smart meters (via RS-485/M-Bus) and transmitting to utility AMI infrastructure via cellular or RF mesh. IC Role / Device Role / Timing Role: Secure host controller managing SDHC-based secure storage, cryptographic acceleration (via CRC and MPU), and time-stamped event logging with RTC backup. Use Value: VLLS1 stop mode current of 2.1 µA at –40°C enables >10-year battery life on CR2032 for tamper-detection and last-gasp reporting during mains failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKE15Z256VLH7 | ARM Cortex-M0+, 72 MHz, 256 KB flash, no CAN, 12-bit ADC only - lower performance and peripheral set. | Suitable for cost-sensitive, non-CAN applications like simple sensor nodes or LED drivers. | Select when CAN, DSP, or 16-bit ADC resolution are not required - offers lower price and smaller footprint (64-LQFP). |
| MIMXRT1021DAG5A | ARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, requires external QSPI - higher performance but greater system complexity. | Targeted at advanced HMI, edge AI inference, or high-throughput gateway applications requiring Linux or FreeRTOS with rich graphics. | Choose when >100 MHz real-time determinism is insufficient - requires external memory and more sophisticated power sequencing. |
Compared with MK10DN512ZVMD10, MKE15Z256VLH7 sacrifices CAN, DSP, and ADC precision for cost reduction, while MIMXRT1021DAG5A trades integrated flash and deterministic low-power modes for raw compute throughput - making MK10DN512ZVMD10 optimal for balanced industrial control where reliability, mixed-signal integration, and certified low-power operation are mandatory.
Availability
MK10DN512ZVMD10 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body electronics, programmable logic controller (PLC) modules, and smart energy metering gateways requiring stable component supply and long-term lifecycle support.
Supply support for MK10DN512ZVMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MK10DN512ZVMD10 belongs to the Kinetis K10 microcontroller family, designed specifically for cost-sensitive, high-reliability industrial and automotive applications requiring real-time performance, mixed-signal integration, and robust low-power operation.
FAQ
What is the maximum operating frequency of the MK10DN512ZVMD10?
The MK10DN512ZVMD10 operates at a maximum CPU frequency of 100 MHz. This is achieved using the internal multi-purpose clock generator (MCG) in FEE mode with a 3–32 MHz crystal source. The 100 MHz specification is guaranteed across the full industrial temperature range (–40 to 105°C) and 1.71–3.6 V supply voltage, as documented in the K10 Sub-Family Data Sheet (Rev. 7, 02/2013). MK10DN512ZVMD10 maintains this frequency with full peripheral enablement and cache active.
Does the MK10DN512ZVMD10 support CAN FD?
No, the MK10DN512ZVMD10 supports only Classical CAN 2.0B (ISO 11898-1), not CAN FD. Its two CAN modules implement standard 11-bit or 29-bit identifier frames with bit rates up to 1 Mbps. CAN FD features such as flexible data-rate switching and extended payload length are absent in the K10 series. For CAN FD capability, designers should consider later-generation NXP devices like the S32K144 or i.MX RT series. MK10DN512ZVMD10 remains fully compatible with legacy CAN networks in industrial and automotive domains.
What package type and pin count does the MK10DN512ZVMD10 use?
The MK10DN512ZVMD10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), identified by the "LQ" package code in its part number. This package includes an exposed thermal pad for enhanced heat dissipation and is RoHS-compliant. Pin assignments follow the K10 signal multiplexing scheme defined in the official K10 Sub-Family Data Sheet (Document Number: K10P144M100SF2, Rev. 7). MK10DN512ZVMD10 does not offer BGA or QFN variants in this specific configuration.
How much SRAM and flash memory does the MK10DN512ZVMD10 include?
The MK10DN512ZVMD10 integrates 512 KB of on-chip program flash memory and 128 KB of general-purpose SRAM. Flash memory is used for firmware storage and supports in-application programming (IAP) via the EzPort interface. SRAM is unified and partitioned for stack, heap, and peripheral buffers - sufficient for FreeRTOS with multiple tasks and communication stacks. These memory sizes are fixed for the MK10DN512ZVMD10 variant and confirmed in the K10 Sub-Family Data Sheet section "Memories and memory interfaces." MK10DN512ZVMD10 does not include FlexMemory.
What is the operating temperature range specified for the MK10DN512ZVMD10?
The MK10DN512ZVMD10 is rated for an ambient operating temperature range of –40°C to +105°C, indicated by the "V" suffix in its part number (MK10DN512ZVMD10). This range is validated per JEDEC JESD22-A104 and applies to all electrical specifications including flash endurance, ADC linearity, and CAN timing accuracy. The device meets industrial and extended-temperature automotive requirements (AEC-Q100 Grade 2 qualification applies to select K10 variants; confirm with NXP's official qualification report for MK10DN512ZVMD10). MK10DN512ZVMD10 maintains full functionality across this range without derating.
MK10DN512ZVMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K10
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 46x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DN512ZVMD10 FAQ
1.How can I place an order for MK10DN512ZVMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DN512ZVMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DN512ZVMD10 reliable?
The price and inventory of MK10DN512ZVMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DN512ZVMD10 is usually 5 days.
3.What payment methods are accepted for MK10DN512ZVMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DN512ZVMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DN512ZVMD10?
MK10DN512ZVMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DN512ZVMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DN512ZVMD10?
For technical support, including MK10DN512ZVMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DN512ZVMD10 requirements.
6.How does Aetrix verify that MK10DN512ZVMD10 is sourced from the original manufacturer or authorized distributors?
All MK10DN512ZVMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DN512ZVMD10 meets industry standards.
7.What is the process for return or replacement of MK10DN512ZVMD10?
All MK10DN512ZVMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DN512ZVMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DN512ZVMD10 part is unused and in its original packaging.
Return procedure for MK10DN512ZVMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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