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NXP Semiconductors MK10DX256VLQ10

Part No.:
MK10DX256VLQ10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMK10DX256VLQ10.pdf
Description:
IC MCU 32BIT 256KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:294

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Product details

Overview

MK10DX256VLQ10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring real-time signal processing, mixed-signal integration, and low-power operation. It features 256 KB on-chip flash memory, 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, two CAN interfaces, and operates across –40°C to 105°C at up to 100 MHz.

For engineers reviewing the MK10DX256VLQ10 datasheet, MK10DX256VLQ10 pinout, MK10DX256VLQ10 application, or MK10DX256VLQ10 equivalent, key selection considerations include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), 144-pin LQFP package, dual CAN support, TSI touch interface, and verified operation in industrial motor control, medical sensor hubs, and automotive body electronics.

Technical Context

The MK10DX256VLQ10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, enabling deterministic execution of filter algorithms and motor control loops. Its clock system integrates a multi-purpose clock generator (MCG) supporting internal/external oscillators (3–32 MHz and 32 kHz), PLL-based frequency multiplication, and dynamic low-power mode transitions.

Peripherals are organized around a high-bandwidth crossbar switch, enabling concurrent access to flash, RAM, and peripherals without bus contention. The device uses FlexBus for external memory expansion and supports EzPort for serial programming, while security is enforced via a memory protection unit (MPU), hardware CRC engine, and 128-bit unique chip ID.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M4 with DSP, 100 MHz max - delivers 125 DMIPS for real-time control and audio/sensor signal processing
Flash / FlexNVM256 KB program flash + 4 KB FlexRAM - enables EEPROM-like data logging without external memory
RAM128 KB SRAM - sufficient for complex RTOS stacks, communication protocol buffers, and waveform buffering
Analog PeripheralsDual 16-bit SAR ADCs (each with PGA up to ×64), two 12-bit DACs, three analog comparators - supports precision sensor conditioning and closed-loop actuator control
Communication2× CAN, 6× UART, 3× SPI, 2× I²C, SDHC, I²S - meets requirements for automotive diagnostics, industrial fieldbus gateways, and audio subsystems
Operating Range1.71–3.6 V supply, –40°C to 105°C ambient - qualified for under-hood automotive and industrial edge nodes
Low-Power ModesVLLS1/VLLS2/VLLS3 stop modes drawing as low as 2.1 µA - enables battery-powered wake-on-event sensing

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSDigital power supply and groundDecoupling required per datasheet layout guidelines; separate VDDA/VSSA pins isolate analog domain
VDDA, VSSAAnalog power supply and groundMust be filtered independently to maintain ADC/DAC accuracy and comparator reference stability
EXTAL/XTALMain crystal oscillator input/outputSupports 3–32 MHz crystals; critical for USB timing, CAN bit rate accuracy, and high-precision RTC
EXTAL32/XTAL3232 kHz crystal oscillator input/outputEnables low-power RTC operation and wake-from-stop timing independent of main clock
PTA0–PTA31, PTB0–PTB17, etc.GPIO with multiplexed peripheral functionsEach port supports configurable slew rate, drive strength, pull-up/down, and digital filtering - essential for noise immunity in industrial environments
CAN0_TX/CAN0_RXCAN controller channel 0 differential interfaceDirect connection to external CAN transceiver; supports ISO 11898-1 compliant 1 Mbps operation
TSI0_CH0–TSI0_CH15Touch sensing input channelsHardware-accelerated capacitive touch detection with low-power scanning - eliminates need for external touch controller

Key Features

FeatureDesign Value
FlexMemory architecture256 KB flash + 4 KB FlexRAM allows byte-erasable, wear-levelled data storage without external EEPROM or FRAM
Dual 16-bit ADC with PGAEach ADC includes programmable gain amplifier (up to ×64) enabling direct connection of low-output sensors (e.g., strain gauges, thermopiles) without external op-amps
Hardware CRC moduleAccelerates checksum computation for firmware updates, secure boot, and communication packet integrity verification in real time
Low-leakage wakeup unitEnables selective wake from VLLS modes using GPIO, RTC alarm, or analog comparator events - reduces average system power in duty-cycled applications
Memory Protection Unit (MPU)Configurable region-based access control prevents unauthorized code/data access - required for functional safety compliance (IEC 61508 SIL2)

Applications

Industrial Motor ControlMedical Sensor Hub

Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using field-oriented control (FOC).

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm, managing PWM generation, sampling current/voltage feedback via dual ADCs, and communicating status over CAN.

Use Value: Integrated 100 MHz Cortex-M4 with DSP instructions and dual 16-bit ADCs eliminates need for external math coprocessor and precision ADC ICs, reducing BOM count and PCB area.

Use Scenario: Aggregation and preprocessing of signals from ECG, SpO₂, and temperature sensors in portable patient monitors.

IC Role / Device Role / Timing Role: Signal acquisition hub performing analog front-end conditioning, oversampled ADC conversion, digital filtering, and encrypted wireless transmission via UART + external BLE module.

Use Value: On-chip PGAs and 12-bit DACs enable calibrated sensor excitation and reference generation; 128 KB RAM buffers multi-channel waveforms for offline analysis.

Automotive Body ElectronicsSmart Home Gateway

Use Scenario: Central body controller managing door locks, lighting, window lifts, and diagnostics in entry-level vehicles.

IC Role / Device Role / Timing Role: CAN node interfacing with LIN sub-nodes and vehicle network, executing ASAM-compliant diagnostic services (UDS), and driving discrete loads via GPIO.

Use Value: Dual CAN controllers support simultaneous communication on powertrain and body networks; -40°C to 105°C rating ensures reliability in under-dash mounting locations.

Use Scenario: Multi-protocol home automation hub connecting Zigbee, Z-Wave, and Bluetooth LE devices to cloud infrastructure.

IC Role / Device Role / Timing Role: Protocol translation engine running multiple concurrent stacks, managing secure OTA updates, and providing local UI via TSI-based touch buttons and LED drivers.

Use Value: Hardware touch interface (TSI) reduces component count for physical controls; FlexRAM enables secure key storage and firmware rollback without external secure element.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MKE15Z256VLH7ARM Cortex-M0+, 256 KB flash, 64 KB RAM, no CAN, 48 MHz max - lower performance, no DSP, no FlexMemorySuitable for cost-sensitive, non-real-time applications like basic lighting control or simple sensor nodesSelect when CAN, DSP, or >48 MHz operation is unnecessary and BOM cost is primary constraint
MIMXRT1021DAG5AARM Cortex-M7, 528 MHz, 256 KB SRAM, no on-chip flash, external QSPI support - higher performance, no integrated flash, different power profileTargeted at advanced HMI, voice processing, and Linux-capable edge devices where external memory is acceptableSelect when >100 MHz deterministic processing, large framebuffer, or multimedia acceleration is required

Compared with MK10DX256VLQ10, MKE15Z256VLH7 trades CAN and DSP capability for lower cost and power, while MIMXRT1021DAG5A replaces integrated flash with external memory flexibility and significantly higher compute throughput - making MK10DX256VLQ10 optimal for balanced real-time control with mixed-signal integration and self-contained firmware execution.

Availability

MK10DX256VLQ10 is available at Aetrix Electronics and suitable for industrial motor control, medical sensor hubs, and automotive body electronics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MK10DX256VLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based microcontrollers and radar technology.

The Kinetis K10 family, including MK10DX256VLQ10, was engineered for cost-effective, low-power embedded control in safety-critical and mixed-signal environments - emphasizing analog integration, real-time responsiveness, and qualification for harsh operating conditions.

FAQ

What is the maximum operating frequency and core type of the MK10DX256VLQ10?

The MK10DX256VLQ10 features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz. This delivers 1.25 Dhrystone MIPS per MHz (125 DMIPS), enabling efficient execution of digital signal processing tasks such as motor control algorithms, audio filtering, and sensor fusion. The core includes single-cycle MAC and SIMD instructions, and the MK10DX256VLQ10 achieves this performance within its specified voltage (1.71–3.6 V) and temperature (–40°C to 105°C) ranges.

Does the MK10DX256VLQ10 support CAN communication, and how many interfaces are available?

Yes, the MK10DX256VLQ10 integrates two Controller Area Network (CAN) modules compliant with ISO 11898-1, supporting bit rates up to 1 Mbps. Each CAN controller includes dedicated TX/RX pins and full message buffering with acceptance filtering. These interfaces are used in automotive body control units and industrial fieldbus gateways, and the MK10DX256VLQ10's dual-CAN capability enables simultaneous communication on separate networks without software arbitration overhead.

What analog peripherals are included in the MK10DX256VLQ10, and what are their key specifications?

The MK10DX256VLQ10 includes two 16-bit SAR ADCs (each with integrated programmable gain amplifier up to ×64), two 12-bit DACs, three analog comparators (each with 6-bit DAC and programmable reference), and a voltage reference module. These peripherals support simultaneous sampling, hardware-triggered conversions, and low-noise operation down to 1.71 V supply. Their design enables direct interfacing with precision sensors and actuators - a capability confirmed in the K10 Sub-Family Data Sheet Rev. 3 for the MK10DX256VLQ10 variant.

What package type and pin count does the MK10DX256VLQ10 use?

The MK10DX256VLQ10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), designated by the "LQ" suffix in its part number. This package provides full access to all GPIO, analog, and communication peripherals, supports standard reflow profiles (MSL3), and is compatible with automated optical inspection and in-circuit test fixtures. Pin assignments are documented in Section 8 of the K10 Sub-Family Data Sheet, and the MK10DX256VLQ10 shares this footprint with other K10 family members including MK10DN512VLQ10.

How does the FlexMemory architecture of the MK10DX256VLQ10 differ from standard flash-only MCUs?

The MK10DX256VLQ10 implements FlexMemory, combining 256 KB program flash with 4 KB FlexRAM and optional FlexNVM partitioning. Unlike standard flash-only MCUs, FlexRAM behaves as true EEPROM - supporting byte-level writes, 100k+ endurance cycles, and zero-latency read/write - enabling reliable data logging, parameter storage, and firmware update staging without external memory. This architecture is explicitly defined for the MK10DX256VLQ10 in the K10 Sub-Family Data Sheet and distinguishes it from non-Flex variants like MK10DN512.

MK10DX256VLQ10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
Kinetis K10
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 46x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK10DX256VLQ10 FAQ

1.How can I place an order for MK10DX256VLQ10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK10DX256VLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK10DX256VLQ10 reliable?

The price and inventory of MK10DX256VLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DX256VLQ10 is usually 5 days.

3.What payment methods are accepted for MK10DX256VLQ10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DX256VLQ10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK10DX256VLQ10?

MK10DX256VLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK10DX256VLQ10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK10DX256VLQ10?

For technical support, including MK10DX256VLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DX256VLQ10 requirements.

6.How does Aetrix verify that MK10DX256VLQ10 is sourced from the original manufacturer or authorized distributors?

All MK10DX256VLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DX256VLQ10 meets industry standards.

7.What is the process for return or replacement of MK10DX256VLQ10?

All MK10DX256VLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DX256VLQ10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK10DX256VLQ10 part is unused and in its original packaging.

Return procedure for MK10DX256VLQ10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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