NXP Semiconductors MK10DX256VMD10
- Part No.:
- MK10DX256VMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK10DX256VMD10.pdf
- Description:
- IC MCU 32B 256KB FLASH 144MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:805
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Product details
Overview
MK10DX256VMD10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 256 KB on-chip flash memory and 128 KB RAM. It integrates dual 16-bit SAR ADCs with programmable gain amplifiers, two 12-bit DACs, two CAN interfaces, six UARTs, and supports industrial temperature range (–40°C to +105°C). It is used in motor control, industrial automation, and smart sensor nodes requiring real-time signal processing and mixed-signal integration.
For engineers reviewing the MK10DX256VMD10 datasheet, MK10DX256VMD10 pinout, MK10DX256VMD10 application, or MK10DX256VMD10 equivalent, key selection considerations include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), dual CAN support for robust fieldbus communication, low-power stop modes down to 2.1 µA, and integrated TSI for capacitive touch sensing in space-constrained embedded designs.
Technical Context
The MK10DX256VMD10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, enabling efficient execution of filter algorithms and motor control loops. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and multi-purpose clock generator supporting dynamic frequency scaling across power modes.
It features a FlexBus external bus interface for parallel memory expansion, EzPort for serial programming, and a memory protection unit (MPU) with multi-master protection. The analog subsystem integrates transimpedance amplifiers and comparators with embedded 6-bit DACs-enabling closed-loop sensor conditioning without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP, 100 MHz max - delivers 125 DMIPS for real-time control and audio/sensor signal processing |
| Flash Memory | 256 KB program flash + 4 KB FlexRAM - enables data logging in RAM while preserving flash endurance |
| ADC | Dual 16-bit SAR ADCs with PGA (x1–x64) - supports high-resolution current/voltage sensing with programmable gain calibration |
| CAN Interfaces | Two independent CAN 2.0B modules - allows redundant fieldbus communication or multi-network gateway operation |
| Temperature Range | –40°C to +105°C ambient - qualified for under-hood automotive and industrial control cabinet deployment |
| Low-Power Modes | VLLS1/VLLS2/VLLS3 stop modes down to 2.1 µA - extends battery life in always-on sensor edge nodes |
| Supply Voltage | 1.71 V to 3.6 V - compatible with single-cell Li-ion, 3.3 V rail, and wide-input industrial power supplies |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Decoupling required per datasheet layout guidelines; supports 1.71–3.6 V operation |
| VDDA, VSSA | Analog power supply and ground | Must be isolated from digital planes; differential voltage vs. VDD limited to ±0.1 V |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals; critical for system clock accuracy and USB timing |
| EXTAL32/XTAL32 | 32 kHz RTC crystal terminals | Enables autonomous real-time clock operation during deep sleep with <2.2 µA VBAT current |
| PTA0–PTA31, PTB0–PTB17, etc. | Multi-function GPIO pins | Configurable as UART/CAN/SPI/I²C peripherals; many support 5 V tolerant inputs |
| CAN0_TX/CAN0_RX | Channel 0 CAN transceiver interface | Direct connection to ISO 11898-compliant physical layer; no external level-shifting needed |
| CAN1_TX/CAN1_RX | Channel 1 CAN transceiver interface | Independent from CAN0; enables dual-bus diagnostics or gateway bridging |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB flash + 4 KB FlexRAM allows EEPROM-like wear-leveling for data tables without external memory |
| Hardware CRC module | Accelerates firmware integrity checks and communication frame validation in CAN/UART protocols |
| TSI (Touch Sensing Interface) | 16-channel capacitive touch controller with low-power wake-up - eliminates mechanical buttons in HMI designs |
| Programmable delay block (PDB) | Enables precise, jitter-free PWM dead-time insertion for 3-phase motor gate drivers |
| 128-bit unique chip ID | Provides immutable device identity for secure boot, licensing, and over-the-air firmware authentication |
Applications
| Industrial Motor Control | Smart Building Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators with position feedback and thermal monitoring. IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithm using DSP instructions; synchronized ADC sampling and PWM generation via PDB. Use Value: Eliminates need for external DSP or FPGA; 100 MHz core + dual ADCs enable sub-µs current loop response with integrated safety timers. |
Use Scenario: Battery-powered CO₂, temperature, and occupancy sensor node transmitting data via LoRaWAN gateway. IC Role / Device Role / Timing Role: System controller managing sensor acquisition, low-power scheduling, CAN/UART bridging, and secure OTA updates. Use Value: VLLS3 mode (2.1 µA) extends 10-year battery life; integrated TSI enables touch-based commissioning without extra ICs. |
| Automotive Body Control Module | Medical Infusion Pump Controller |
Use Scenario: Central body controller managing door locks, lighting, and window lift with CAN diagnostics. IC Role / Device Role / Timing Role: Dual-CAN interface handles powertrain diagnostics (CAN0) and comfort network (CAN1); MPU enforces memory isolation between safety-critical and non-critical tasks. Use Value: ASIL-B capable design via lockstep peripherals and CRC-protected flash; –40°C to +105°C rating meets AEC-Q100 Grade 2 requirements. |
Use Scenario: Precision fluid delivery system requiring accurate pressure sensing, stepper motor control, and alarm-triggered shutdown. IC Role / Device Role / Timing Role: Simultaneous 16-bit ADC sampling of load cell and pressure transducer; real-time DAC output for valve actuation; watchdog supervision of pump runtime. Use Value: Integrated PGA eliminates external instrumentation amps; hardware CRC ensures infusion log integrity per IEC 62304 Class C software requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK10DN512VLQ10 | 512 KB flash, 128 KB RAM, same package (144-LQFP), no FlexMemory | Better suited for complex protocol stacks (e.g., Ethernet + CAN + USB) requiring larger code footprint | Select when >256 KB flash is required and FlexRAM is unnecessary |
| STM32F407VGT6 | ARM Cortex-M4F (with FPU), 1024 KB flash, 192 KB RAM, 100-pin LQFP, no integrated TSI or FlexMemory | Stronger floating-point performance for FFT/audio; lacks native capacitive touch and FlexNVM data storage | Choose for math-intensive applications where FPU and larger RAM outweigh TSI/FlexRAM benefits |
Compared with MK10DX256VMD10, MK10DN512VLQ10 trades FlexMemory for higher flash density in larger package, while STM32F407VGT6 offers FPU and larger memory but requires external touch controller and EEPROM emulation-increasing BOM cost and layout complexity.
Availability
MK10DX256VMD10 is available at Aetrix Electronics and suitable for industrial motor control, smart building sensor nodes, and automotive body electronics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MK10DX256VMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MK10DX256VMD10 belongs to the Kinetis K10 family, designed specifically for cost-sensitive, high-integration embedded systems demanding real-time performance, mixed-signal capability, and ultra-low-power operation in harsh environments.
FAQ
What is the maximum operating frequency and core type of the MK10DX256VMD10?
The MK10DX256VMD10 features an ARM Cortex-M4 core with DSP extensions, rated for up to 100 MHz operation. This delivers 1.25 Dhrystone MIPS per MHz (125 DMIPS), enabling deterministic execution of motor control algorithms and sensor fusion routines. The MK10DX256VMD10 achieves this performance within its 1.71–3.6 V supply range and –40°C to +105°C industrial temperature grade.
Does the MK10DX256VMD10 support CAN FD or only classical CAN 2.0B?
The MK10DX256VMD10 integrates two classical CAN 2.0B controllers compliant with ISO 11898-1, supporting bit rates up to 1 Mbps. It does not support CAN FD features such as flexible data-rate or extended payload length. For CAN FD applications, designers should consider later-generation NXP S32K or K32L series MCUs. The MK10DX256VMD10 remains ideal for legacy CAN networks in industrial automation and automotive body control.
How much FlexRAM does the MK10DX256VMD10 include, and what is its purpose?
The MK10DX256VMD10 includes 4 KB of FlexRAM, part of its FlexMemory architecture. This memory operates as true SRAM but can be reconfigured as EEPROM-emulated storage with hardware wear leveling-eliminating the need for external EEPROM in data-logging or configuration storage applications. Unlike standard RAM, FlexRAM retains data across resets and supports byte-level writes, making it ideal for parameter storage in the MK10DX256VMD10's industrial control implementations.
What are the lowest-power stop modes supported by the MK10DX256VMD10, and their typical current draw?
The MK10DX256VMD10 supports VLLS1, VLLS2, and VLLS3 very-low-leakage stop modes. At 3.0 V and –40°C to +25°C, typical current consumption is 2.1 µA (VLLS1), 2.2 µA (VLLS2), and 3.0 µA (VLLS3). These modes retain RAM content and allow wake-up from select peripherals including RTC, LPUART, and TSI. This ultra-low quiescent current makes the MK10DX256VMD10 suitable for battery-backed applications where multi-year operation is required.
Is the MK10DX256VMD10 pin-compatible with other K10 family members like MK10DX128VMD10?
No, the MK10DX256VMD10 is not pin-compatible with MK10DX128VMD10. Both use the 100-pin LQFP package (VMD10 suffix), but differences in peripheral mapping, pin multiplexing, and internal routing prevent direct substitution. While they share the same footprint and basic power/ground assignments, signal functions on shared pins (e.g., UART vs. SPI alternate functions) differ between flash variants. Board redesign is required when migrating from MK10DX128VMD10 to MK10DX256VMD10.
MK10DX256VMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K10
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 46x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK10DX256VMD10 FAQ
1.How can I place an order for MK10DX256VMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK10DX256VMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK10DX256VMD10 reliable?
The price and inventory of MK10DX256VMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK10DX256VMD10 is usually 5 days.
3.What payment methods are accepted for MK10DX256VMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK10DX256VMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK10DX256VMD10?
MK10DX256VMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK10DX256VMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK10DX256VMD10?
For technical support, including MK10DX256VMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK10DX256VMD10 requirements.
6.How does Aetrix verify that MK10DX256VMD10 is sourced from the original manufacturer or authorized distributors?
All MK10DX256VMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK10DX256VMD10 meets industry standards.
7.What is the process for return or replacement of MK10DX256VMD10?
All MK10DX256VMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK10DX256VMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK10DX256VMD10 part is unused and in its original packaging.
Return procedure for MK10DX256VMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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