Renesas MK2069-04GILF

Overview

MK2069-04GILF from IDT is a VCXO-based universal clock translator IC featuring dual cascaded PLLs - a low-jitter VCXO PLL (with external crystal) and a high-frequency Translator PLL - enabling precise frequency translation between telecom standards including T1/E1, T3/E3, OC-3, CCIR-601, and SMPTE 274M. It supports input frequencies from <1 kHz to 170 MHz and delivers VCLK (500 kHz–27 MHz) and TCLK (500 kHz–160 MHz) outputs with jitter attenuation, pin-selectable dividers, and lock detection.

For engineers reviewing the MK2069-04GILF datasheet, MK2069-04GILF pinout, MK2069-04GILF application, or MK2069-04GILF equivalent, key selection considerations include its VCXO-based jitter attenuation architecture, 56-pin TSSOP package with 3.3 V supply and 5 V-tolerant ICLK, dual-PLL configurability via 24 dedicated divider control pins, and support for holdover and seamless phase switching via CLR.

Technical Context

The MK2069-04GILF implements two functionally distinct PLL stages: the first is a VCXO PLL using an external pullable crystal (8–27 MHz) and user-configurable RPV/RV/FV/SV dividers to generate VCLK up to 27 MHz with sub-100 fs integrated jitter; the second is a Translator PLL with on-chip VCO (40–320 MHz) and FT/ST dividers to produce TCLK up to 160 MHz at high loop bandwidth (>1 MHz) for stability.

Its analog-digital hybrid design requires external loop filter components (RS, CS, CP, RSET) to set VCXO PLL bandwidth (as low as 20 Hz) and damping factor (≥0.7), enabling compliance with Bellcore GR-1244-CORE wander transfer limits (<0.2 dB passband ripple); lock status is monitored via LD output qualified over 8 consecutive phase detector cycles.

Key Specifications

Pinout & Package

Package: 56-pin TSSOP (7.0 mm × 12.5 mm, 0.5 mm pitch), Pb-free, RoHS-compliant, with thermal pad exposed on underside for enhanced heat dissipation in telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock translation applications.

Compared with Si5338A-D-GM and ICS8430I-01LG, the MK2069-04GILF uniquely combines external VCXO jitter attenuation, pin-strapped dual-PLL flexibility, and hitless switching via CLR - making it the only option supporting both Bellcore-compliant wander transfer and multi-standard video/telecom translation in a single device.

Availability

MK2069-04GILF is available at Aetrix Electronics and suitable for telecom line cards, network synchronizers, broadcast video infrastructure, and wireless baseband processing requiring stable component supply across extended product lifecycles.

Supply support for MK2069-04GILF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a leader in timing, memory interface, and RF power solutions for communications, computing, and industrial markets.

The MK2069-04GILF belongs to IDT's VCXO-based universal clock translator product line, engineered specifically for carrier-grade telecom and broadcast applications demanding ultra-low jitter, hitless clock switching, and Bellcore-compliant wander attenuation.

FAQ

What is the primary function of the MK2069-04GILF in a telecom timing system?

The MK2069-04GILF serves as a universal clock translator that converts between disparate telecom clock standards - such as T1 (1.544 MHz) and E1 (2.048 MHz), or OC-3 (155.52 MHz) and DS3 (44.736 MHz) - while simultaneously attenuating input jitter using its VCXO-based PLL architecture. Its dual-PLL structure enables both low-bandwidth jitter cleanup and high-frequency multiplication, making MK2069-04GILF essential for Stratum 3-compliant network elements requiring stable, low-phase-noise outputs.

How does the CLR pin enable hitless clock switching in the MK2069-04GILF?

The CLR (Clear) input on the MK2069-04GILF disables the VCXO PLL charge pump and resets the FV feedback divider upon assertion, allowing the device to hold frequency briefly during external clock multiplexer reselection. When CLR is deasserted, the FV divider restarts counting on the first positive edge of the new input clock, eliminating accumulated phase error and limiting VCLK cycle slips to ≤2 - a critical capability for MK2069-04GILF in SONET/SDH hitless protection switching applications.

Can the MK2069-04GILF generate both VCLK and TCLK simultaneously, and what are their respective frequency ranges?

Yes, the MK2069-04GILF generates VCLK and TCLK concurrently: VCLK is the output of the VCXO PLL (500 kHz–27 MHz), derived from an external 8–27 MHz crystal scaled by the SV divider; TCLK is the output of the Translator PLL (500 kHz–160 MHz), produced by multiplying VCLK via the on-chip VCO (40–320 MHz) and dividing by the ST divider. This dual-output capability allows MK2069-04GILF to serve multiple clock domains - e.g., VCLK for local logic and TCLK for high-speed SerDes - from a single timing source.

What external components are required to configure the VCXO PLL loop response of the MK2069-04GILF?

The MK2069-04GILF requires four external passive components to configure its VCXO PLL loop: RS (series resistor), CS (main loop capacitor), CP (damping capacitor), and RSET (charge pump current setting resistor). These components determine loop bandwidth (as low as 22 Hz), damping factor (0.7–4), and phase margin - enabling optimization for jitter attenuation or phase noise performance. The recommended values are calculated using IDT's online loop filter software, and component selection must follow strict layout rules to meet GR-1244-CORE compliance for MK2069-04GILF deployments.

Is the MK2069-04GILF compatible with standard 56-pin TSSOP footprints, and what are its thermal considerations?

Yes, the MK2069-04GILF uses a standard 56-pin TSSOP package (7.0 mm × 12.5 mm, 0.5 mm pitch) with an exposed thermal pad on the underside, fully compatible with industry-standard PCB assembly processes. Thermal design requires soldering the thermal pad to a dedicated copper pour connected to internal ground planes; typical power dissipation is 250 mW, and junction-to-ambient thermal resistance is 45°C/W with proper layout - ensuring reliable operation in telecom line cards operating at 70°C ambient when MK2069-04GILF is mounted per IDT's recommended footprint.