NXP Semiconductors MK20DN512VLK10

Overview

MK20DN512VLK10 from NXP Semiconductors is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 512 KB flash, 128 KB RAM, and dual CAN interfaces. It operates from 1.71–3.6 V across –40 to 105°C ambient, supporting industrial motor control, automotive body electronics, and secure IoT edge nodes requiring deterministic real-time response and low-power operation.

For engineers reviewing the MK20DN512VLK10 datasheet, MK20DN512VLK10 pinout, MK20DN512VLK10 application, or MK20DN512VLK10 equivalent, this page delivers verified technical context, thermal attributes (R_θJC = 9°C/W), peripheral timing constraints, and validated alternative options for migration or second-sourcing in production-grade embedded designs.

Technical Context

The MK20DN512VLK10 integrates an ARM Cortex-M4 core with hardware DSP instructions, delivering 1.25 Dhrystone MIPS/MHz. Its memory subsystem includes 512 KB on-chip flash (non-FlexMemory), 128 KB SRAM, and EzPort serial programming interface. Clocking supports dual oscillators: 3–32 MHz main and 32 kHz RTC crystal inputs, plus a multi-purpose clock generator with MCG module.

Peripherals include two 16-bit SAR ADCs (each with integrated PGA up to ×64), 12-bit DAC, three analog comparators with 6-bit DAC references, USB On-The-Go controller, two CAN 2.0B modules, four UARTs, two I²C, two SPI, SDHC, I²S, and TSI touch sensing. Power management features eight low-power modes, including VLLS1–VLLS3 with sub-μA stop currents.

Key Specifications

Pinout & Package

Package: 80-pin LQFP (12 mm × 12 mm), RoHS-compliant, lead-free, moisture sensitivity level 3 per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK20DN512VLK10, MK20DX256VLK10 offers identical peripherals and timing but halves flash capacity, while KEA128M64xxx reduces core performance, peripheral count, and package size - making both viable alternatives only when those specific resources are unused in the target design.

Availability

MK20DN512VLK10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and secure IoT edge nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MK20DN512VLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and safety-certified platforms.

The K20 sub-family, including MK20DN512VLK10, was designed for real-time embedded applications demanding high computational throughput, mixed-signal integration, and robust functional safety features - particularly in automotive body electronics and industrial automation.

FAQ

What is the maximum operating frequency and core type of the MK20DN512VLK10?

The MK20DN512VLK10 features an ARM Cortex-M4 core with DSP extensions, rated for up to 100 MHz operation. It does not include a floating-point unit (FPU). This configuration delivers 1.25 Dhrystone MIPS per MHz and supports deterministic real-time execution for motor control and signal processing tasks. The MK20DN512VLK10 achieves this performance within its specified voltage (1.71–3.6 V) and temperature (–40 to 105°C) ranges.

Does the MK20DN512VLK10 support CAN communication, and how many interfaces are available?

Yes, the MK20DN512VLK10 integrates two independent Controller Area Network (CAN) 2.0B modules. Each interface has dedicated TX/RX pins (PTA0/PTA1 for CAN0, PTB16/PTB17 for CAN1) and supports bit rates up to 1 Mbps. These modules operate concurrently, enabling dual-bus architectures such as gateway functionality or redundancy in automotive and industrial networks. The MK20DN512VLK10 requires external CAN transceivers for physical layer compliance.

What are the flash and RAM capacities of the MK20DN512VLK10, and is FlexMemory included?

The MK20DN512VLK10 contains 512 KB of on-chip program flash memory and 128 KB of SRAM. Per its part number decoding ('N' in position 5), it uses program flash only - no FlexMemory (i.e., no configurable EEPROM emulation). Flash is organized for reliable wear leveling and secure boot; RAM supports DMA-accelerated data buffering for high-throughput peripherals like USB and SDHC. This memory configuration is validated for AUTOSAR and FreeRTOS deployments in the MK20DN512VLK10.

What package type and thermal specification apply to the MK20DN512VLK10?

The MK20DN512VLK10 is packaged in an 80-pin LQFP (12 mm × 12 mm), identified by 'LK' in the part number. Its thermal resistance from junction to case (R_θJC) is 9°C/W, updated in Revision 4 of the K20P81M100SF2V2 datasheet addendum. This value governs thermal pad layout and heatsink selection for sustained 100 MHz operation at 105°C ambient. The device is RoHS-compliant and rated MSL-3 per J-STD-020.

Which low-power modes are supported by the MK20DN512VLK10, and what is the lowest achievable current draw?

The MK20DN512VLK10 supports seven low-power modes, including VLLS1–VLLS3. In VLLS3 mode with RTC active and all clocks stopped, typical current draw is 3.0 μA at –40 to 25°C (max 23 μA). Wakeup occurs in ≤92 μs via GPIO, RTC alarm, or analog comparator. This enables decade-long battery life in sensor nodes. The MK20DN512VLK10's low-leakage wakeup unit and optimized power gating make it suitable for energy-constrained edge applications.