NXP Semiconductors MK20DN512VLQ10
- Part No.:
- MK20DN512VLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK20DN512VLQ10.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,780
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK20DN512VLQ10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for real-time embedded control in industrial and automotive applications. It operates at up to 100 MHz, integrates 512 KB on-chip flash memory (no FlexMemory), 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, and dual CAN 2.0B interfaces. It supports -40°C to +105°C operation and is packaged in a 144-pin LQFP (20 mm × 20 mm).
For engineers reviewing the MK20DN512VLQ10 datasheet, MK20DN512VLQ10 pinout, MK20DN512VLQ10 application, or MK20DN512VLQ10 equivalent, key selection considerations include its non-FlexMemory flash architecture, 144-LQFP thermal profile, dual CAN + USB OTG + SDHC interface set, low-power stop modes down to 2.1 µA (VLLS1), and compatibility with Kinetis SDK v2.x and MCUXpresso IDE.
Technical Context
The MK20DN512VLQ10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, enabling deterministic signal processing in motor control and sensor fusion. Its memory subsystem includes 512 KB of program flash (no FlexNVM/FlexRAM), 128 KB SRAM, and EzPort serial programming support - distinguishing it from X-series variants with FlexMemory.
System-level timing relies on a multi-source clock system: 3–32 MHz main crystal oscillator, 32 kHz RTC crystal input, and a multi-purpose clock generator (MCG) supporting FEI/FBI/BLPE/FEE modes. Peripheral clocking is managed via SIM module with configurable dividers, and power management includes six low-power modes (RUN, WAIT, VLPR, STOP, VLPS, LLS, VLLSx) with sub-µA retention capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP, no FPU; delivers 125 DMIPS @ 100 MHz - suitable for real-time motor control loops and audio preprocessing without floating-point overhead. |
| Flash / RAM | 512 KB program flash (non-FlexMemory), 128 KB SRAM - enables complex firmware with bootloader, OTA update partitioning, and large buffer handling for communication stacks. |
| ADC / DAC | Dual 16-bit SAR ADCs (1 MSPS each) with integrated PGA (×1–×64); two 12-bit DACs - supports high-resolution analog sensing and closed-loop actuator control in industrial I/O modules. |
| Timers | Eight-channel TPM (motor control/PWM), two 2-channel QTMR (quadrature decoding), RTC, PDB, LPIT - provides synchronized PWM generation, encoder position capture, and precise time-stamping for motion systems. |
| Communication | Dual CAN 2.0B, USB 2.0 Full/Low-Speed OTG, six UARTs, three SPIs, two I²Cs, SDHC, I²S - enables robust fieldbus connectivity, host-peripheral bridging, and multimedia peripheral interfacing. |
| Supply & Temp | 1.71–3.6 V operation; -40°C to +105°C ambient range - certified for under-hood automotive and industrial control cabinet deployment without external thermal derating. |
| Security | Hardware CRC-32 engine, 128-bit unique chip ID, memory protection unit (MPU) - supports firmware integrity verification and secure device identification in IIoT edge nodes. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm), 0.5 mm pitch, exposed thermal pad (EP). RoHS-compliant, moisture sensitivity level (MSL) 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS (x12) | Power supply / ground | Dedicated digital power/ground pairs per functional block - ensures stable core, analog, and I/O domain operation with minimal noise coupling. |
| VDDA/VSSA | Analog supply / ground | Isolated analog domain pins - required for ADC/DAC reference stability; must be filtered separately from digital VDD. |
| EXTAL/XTAL | Main crystal oscillator input/output | 3–32 MHz crystal connection - enables precise system clock generation; requires external 12–22 pF load capacitors. |
| EXTAL32/XTAL32 | 32 kHz RTC crystal input/output | Low-frequency crystal interface - powers RTC and low-power timer in VLLS modes; supports calendar timekeeping during deep sleep. |
| USB_DP/USB_DM | USB differential data pair | On-chip transceiver with internal termination - eliminates need for external USB PHY; supports full-speed (12 Mbps) and low-speed (1.5 Mbps) enumeration. |
| CAN0_TX/CAN0_RX CAN1_TX/CAN1_RX |
CAN controller physical layer I/O | Dual independent CAN 2.0B channels - enables redundant bus architecture or multi-network gateway functionality (e.g., CAN FD bridge not supported). |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO with multiplexed peripherals | Up to 119 general-purpose I/O pins with configurable slew rate, drive strength, pull-up/down, and interrupt capability - supports flexible board layout and signal routing. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-mode low-power architecture | Six defined power modes (including VLLS1–VLLS3) with sub-µA retention current - enables battery-powered remote sensors to operate >10 years on coin cell. |
| Integrated analog front-end | Dual 16-bit ADCs with programmable gain amplifier (PGA) and 6-bit DAC references per comparator - reduces BOM count by eliminating external signal conditioning ICs in PLC analog input modules. |
| Flexible clock generation | MCG supports internal 32 kHz RC, external crystals (3–32 MHz & 32 kHz), and PLL-based 100 MHz output - simplifies clock tree design across varying EMI and cost constraints. |
| Robust communication suite | Dual CAN, USB OTG, SDHC, and I²S - allows single-chip implementation of automotive body controllers with diagnostics (CAN), service port (USB), logging (SD), and audio feedback (I²S). |
| Secure boot foundation | Hardware CRC engine + 128-bit unique ID + MPU - enables authenticated firmware loading and runtime memory access control for industrial safety-critical updates. |
Applications
| Industrial Motor Control | Automotive Body Controller |
|---|---|
|
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators and pump drives using space-vector PWM and encoder feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm at 20 kHz PWM carrier frequency; quadrature decoder captures rotor position; ADC samples phase currents with <1 µs latency. Use Value: On-chip 16-bit ADCs with PGA eliminate external op-amp stages; dual CAN interfaces enable coordination between multiple motor nodes and central ECU. |
Use Scenario: Centralized control of door locks, lighting, wipers, and window lifts in entry-level vehicles. IC Role / Device Role / Timing Role: CAN message arbitration and filtering; GPIO-driven relay/LED drivers; RTC-scheduled wake-up for periodic diagnostics; USB DFU for dealer reprogramming. Use Value: Dual CAN controllers reduce external transceiver count; 128 KB RAM accommodates AUTOSAR-compliant OS and diagnostic stack (UDS/OBD-II). |
| Programmable Logic Controller (PLC) I/O Module | Medical Infusion Pump Controller |
|
Use Scenario: Analog input module acquiring 4–20 mA and 0–10 V sensor signals with galvanic isolation and linearization. IC Role / Device Role / Timing Role: Simultaneous sampling of dual 16-bit ADCs; hardware CRC validation of configuration EEPROM; watchdog supervision of safety-critical tasks. Use Value: Integrated PGA supports direct 4–20 mA loop interface without external instrumentation amps; FlexBus interface enables expansion with isolated digital I/O daughterboards. |
Use Scenario: Precision flow-rate control and alarm monitoring in portable infusion pumps with battery backup. IC Role / Device Role / Timing Role: Real-time PID loop execution at 100 Hz; DAC-driven stepper motor current control; RTC-backed event logging; low-leakage VLLS3 mode for battery conservation during standby. Use Value: 12-bit DACs provide smooth current ramping; 105°C rating ensures reliability inside sealed medical enclosures; unique chip ID enables device traceability per FDA UDI requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKE15Z64VLH4 | ARM Cortex-M0+, 64 KB flash, 8 KB RAM, no CAN, 48 MHz max - lower performance, smaller footprint (64-LQFP), no USB/SDHC. | Cost-sensitive consumer appliances requiring basic control only - insufficient for dual-CAN or USB-host use cases. | Select MK20DN512VLQ10 when dual CAN, USB OTG, or >100 MHz deterministic processing is required; MKE15Z64VLH4 suits simpler, lower-BOM-cost designs. |
| MIMXRT1021DAG4A | ARM Cortex-M7, 512 KB SRAM, no on-chip flash, 500 MHz, Ethernet, SEMC - higher performance, external flash dependency, larger package (196-BGA). | Edge AI inference or HMI-rich gateways needing >2000 DMIPS - overqualified for standalone motor control or CAN node roles. | MK20DN512VLQ10 offers integrated flash, mature Kinetis toolchain, and proven automotive qualification; MIMXRT1021DAG4A targets next-gen connected devices with external memory. |
Compared with MKE15Z64VLH4, MK20DN512VLQ10 delivers 2.5× higher DMIPS, dual CAN, and USB OTG - essential for fieldbus integration. Versus MIMXRT1021DAG4A, it avoids external flash complexity and BGA assembly while meeting ASIL-B functional safety requirements via built-in MPU and watchdog features.
Availability
MK20DN512VLQ10 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body electronics, programmable logic controller I/O modules, and medical infusion pump controllers requiring stable component supply across extended product lifecycles.
Supply support for MK20DN512VLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications. Formerly Freescale Semiconductor, it acquired the Kinetis portfolio in 2015.
The MK20DN512VLQ10 belongs to the Kinetis K20 family - engineered for real-time deterministic control in harsh environments, emphasizing low-power operation, analog integration, and automotive-grade reliability (AEC-Q100 qualified).
FAQ
What is the maximum operating frequency and core type of the MK20DN512VLQ10?
The MK20DN512VLQ10 features an ARM Cortex-M4 core with DSP extensions and operates at a maximum frequency of 100 MHz. It does not include a floating-point unit (FPU). This configuration delivers 125 DMIPS and supports single-cycle MAC operations, making it suitable for real-time signal processing in motor control and sensor fusion applications. The MK20DN512VLQ10 achieves this performance within its 1.71–3.6 V supply range and -40°C to +105°C temperature specification.
Does the MK20DN512VLQ10 include FlexMemory, and how does its memory architecture differ from other K20 variants?
No, the MK20DN512VLQ10 does not include FlexMemory. Its "N" in the part number denotes program flash only - specifically 512 KB of on-chip flash memory and 128 KB of SRAM. Unlike "X"-suffix variants (e.g., MK20DX256VLQ10), the MK20DN512VLQ10 lacks FlexNVM and FlexRAM, meaning it cannot dynamically allocate non-volatile storage for data logging or EEPROM emulation. This makes the MK20DN512VLQ10 optimal for fixed-function firmware deployments where code size dominates memory requirements.
Which communication interfaces are supported by the MK20DN512VLQ10, and are both CAN controllers fully functional?
The MK20DN512VLQ10 supports dual CAN 2.0B controllers, USB 2.0 Full/Low-Speed OTG with on-chip transceiver, six UARTs, three SPIs, two I²Cs, SDHC, and I²S. Both CAN modules are fully independent and functional - each with dedicated TX/RX pins, message buffers, and acceptance filtering. They do not support CAN FD. This dual-CAN capability enables applications such as automotive gateway functions or redundant industrial fieldbus networks, and is confirmed in the K20 Sub-Family Data Sheet Rev. 3 for the MK20DN512VLQ10.
What are the low-power capabilities of the MK20DN512VLQ10, and what is the lowest achievable current in stop mode?
The MK20DN512VLQ10 supports six low-power modes, including Very-Low-Leakage Stop modes (VLLS1–VLLS3). In VLLS1 mode at 3.0 V and -40°C to +25°C ambient, the typical current consumption is 2.1 µA - retaining RAM, RTC, and selected wakeup sources. At 105°C, VLLS1 current rises to 95.5 µA. These values are measured with all clocks disabled except the 32 kHz RTC oscillator and low-leakage wakeup unit, and are specified in Table 6 of the K20 Sub-Family Data Sheet Rev. 3 for the MK20DN512VLQ10.
Is the MK20DN512VLQ10 pin-compatible with other K20 family members, and what package does it use?
The MK20DN512VLQ10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), identified by "LQ" in its part number. While it shares the same pinout with other K20 devices in the LQ package (e.g., MK20DX256VLQ10, MK20DN512VMD10), pin compatibility is limited to identical package types and does not extend across QFP vs. BGA variants. Signal multiplexing is consistent across the K20 Sub-Family, but users must verify peripheral enablement and clock gating in software - the MK20DN512VLQ10's absence of FlexMemory does not affect pin mapping.
MK20DN512VLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 42x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DN512VLQ10 FAQ
1.How can I place an order for MK20DN512VLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DN512VLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DN512VLQ10 reliable?
The price and inventory of MK20DN512VLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DN512VLQ10 is usually 5 days.
3.What payment methods are accepted for MK20DN512VLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DN512VLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DN512VLQ10?
MK20DN512VLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DN512VLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DN512VLQ10?
For technical support, including MK20DN512VLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DN512VLQ10 requirements.
6.How does Aetrix verify that MK20DN512VLQ10 is sourced from the original manufacturer or authorized distributors?
All MK20DN512VLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DN512VLQ10 meets industry standards.
7.What is the process for return or replacement of MK20DN512VLQ10?
All MK20DN512VLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DN512VLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DN512VLQ10 part is unused and in its original packaging.
Return procedure for MK20DN512VLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK20DN512VLQ10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

